TC78B015FTG TOSHIBA | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 31
Technical content
Features
- Three-phase full wave drive
- 150-degree trapezoid PWM chopper system
- Soft switching
- Hall amplifier (hall element / hall IC): 1-sensor drive
- Power supply: absolute maximum voltage: 25 V
- Output current: absolute maximum current: 3 A
- Selectable rotational speed command input signal: Pulse duty signal input/analog voltage input/PWM signal input
- Selectable PWM frequency
- Adjustable minimum duty in PWM control
- Adjustable speed ratio in PWM control
- Selectable lead angle control function: Auto lead angle function/External lead angle control (32 steps correspond to 0 to 58°)
- Selectable rotation direction
- Brake function terminal
- Selectable lock detection function
- Restart function
- Rotation frequency signal (FG_OUT): 1 pulse/ electrical angle 360°, 2/3 pulse/ electrical angle 360°, 1/2 pulse/ electrical angle 360°, 1/3 pulse/ electrical angle 360°
- Lock detection signal (LD_OUT)
- Power supply voltage monitoring function
- Overcurrent detection circuit (ISD)
- Thermal shutdown circuit (TSD)
- Under voltage lockout circuit (UVLO)
- Current limit circuit
- Adjustable start conditions
- Selectable control function of forced commutation frequency (1-sensor drive). P-WQFN36-0505-0.50-001 Weight: 0.06 g (typ.) © 2017 TOSHIBA Corporation
<Top view> Note 1: Design the pattern in consideration of the heat design because the back side (E-PAD) has the role of heat radiation. The back side (E-PAD) should be connected to GND because it is connected to the back of the chip electrically. Note 2: There are four pairs of terminals named U, V, W, and VM. Connect two each of the terminals which has the same pin symbol via external patterns. Regarding GND, connect PGND1, PGND2, PGND3, and SGND via external patterns. PGND1 and PGND2 are short-circuited in the IC. SEL_LA FG_OUT U U PGND1 V V PGND2 W W SEL_FG TSP/VSP SEL_LD LA PGND3 TEST2 TIP MVM BRAKE LD_OUT FPWM VM SEL_SP VM CW/CCW MIN_SP SGND OSCCR VREG HUP HUM ILIM TSTEP VST FST TEST E-PAD
Pin No. Symbol I/O Description
1 U O Output terminal for U phase
2 U O Output terminal for U phase
3 PGND1 ― Power ground terminal (source of output Nch MOS transistor)
4 V O Output terminal for V phase
5 V O Output terminal for V phase
6 PGND2 ― Power ground terminal (source of output Nch MOS transistor)
7 W O Output terminal for W phase
8 W O Output terminal for W phase
9 FG_OUT O Output terminal for rotation frequency
10 SEL_FG I Selectable terminal for FG frequency division ratio
11 TSP/VSP I Input terminal for rotational speed command
12 LA I Input terminal for setting lead angle
13 PGND3 ― Power ground terminal (GND for pre-driver block)
14 VM ― Power supply terminal for motor
15 VM ― Power supply terminal for motor
16 MVM I Terminal for monitoring power supply
17 TEST2 ― Terminal for test
18 TIP I Capacitor connecting terminal for setting DC excitation time
19 FST I Selectable terminal for forced commutation frequency
20 VST I Terminal for setting PWM ON duty of DC excitation and forced commutation mode
21 HUM I U-phase Hall-signal input (-)
22 HUP I U-phase Hall-signal input (+)
23 VREG ― Output terminal for reference voltage (5 V)
24 OSCCR ― Terminal for setting internal oscillator circuit
25 SGND ― Signal ground terminal
26 ILIM I Terminal for setting current limit
27 TSTEP ― Terminal for setting acceleration and deceleration time of PWM duty
28 LD_OUT O Output terminal for lock detection
29 TEST I Terminal for test
30 SEL_LA I Input terminal for selecting a method of lead angle or external input
31 MIN_SP I Input terminal for setting minimum output on duty
32 SEL_SP I Input terminal for selecting a method of rotational speed command
33 FPWM I Input terminal for selecting PWM frequency
34 SEL_LD I Selectable terminal for motor lock detection function
35 BRAKE I Brake on/off terminal
36 CW/CCW I Input terminal for selecting rotation direction
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. Pin symbol I/O Signal I/O Internal Circuit HUP HUM Input terminal Hysteresis ± 8 mV (typ.) CW/CCW BRAKE Input terminal H: 2 V (min) L: 0.8 V (max) FST SEL_SP SEL_LA Input terminal When leaving the terminal open, it is set to Middle level. When leaving the terminal open, plenty of evaluations using actual systems are required before using. SEL_FG MIN_SP LA FPWM SEL_LD Input terminal Applying a voltage to the terminals is required. VST Terminal for setting ON duty from DC excitation mode to forced commutation mode 50 kΩ (typ.) VST VREG VREG VREG VREG 50 kΩ (typ.) VREG 50 kΩ (typ.)
Pin symbol I/O Signal I/O Internal Circuit TSP/VSP Input terminal for rotational speed command VREG Output terminal for reference voltage VREG = 5 V (typ.) Connect a capacitor (Recommended value: 0.1 μF) for voltage stability between SGND. FG_OUT LD_OUT Open drain output Pull-up the terminals externally to output high level. ILIM Terminal for setting current limit Connect the resistance between SGND MVM Input terminal for monitoring power supply voltage Applying a voltage to the terminals is required. TEST Test terminal VREG VREG VM VM VREG VREG
Pin symbol I/O Signal I/O Internal Circuit TIP TSTEP Terminal for setting time Connect a capacitor to SGND. OSCCR Terminal for setting internal oscillation frequency Connect 27 k Ω to VREG and 360 p F to SGND. VM U V W Output terminals for U, V, and W phases VM: Power supply terminal for motor VREG U VM V W PGND1 PGND2 VREG
Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Power supply voltage VM 25 V Input voltage VIN1 (Note 1) -0.3 to 6 V VIN2 (Note 2) -0.3 to VREG + 0.3 V Output voltage VOUT1 (Note 3) 25 V VOUT2 (Note 4) 25 Output current IOUT1 (Note 5) 3 (Note 8) A IOUT2 (Note 6) 10 mA IOUT3 (Note 7) 40 mA Power dissipation PD 4.1 (Note 9) W Operating temperature Topr -40 to 85 °C Storage temperature Tstg -55 to 150 °C Note: The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the ratings may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. Please use within the specified operating ranges. Note 1: Terminal for VIN1: TSP/VSP, CW/CCW, and BRAKE Note 2: Terminal for VIN2: HUP, HUM, SEL_LD, SEL_FG, CW/CCW, BRAKE, ILIM, MIN_SP, MVM, SEL_SP, LA, FPWM, SEL_LA, and TEST Note 3: Terminal for VOUT1: U, V, and W Note 4: Terminal for VOUT2: FG_OUT and LD_OUT Note 5: Terminal for IOUT1: U, V, and W Note 6: Terminal for IOUT2: FG_OUT and LD_OUT Note 7: Terminal for IOUT3: VREG Note 8: Output current may be limited by the ambient temperature or the device implementation. The maximum junction temperature should not exceed Tj (max) = 150°C. Note 9: When mounted on a board (4 layers, FR4, 76.2 mm × 114.3 mm × 1.6 mm), Rth (j-a) = 30.5°C/W
Characteristics Symbol Operating range Unit Power supply voltage VMopr 6 to 22 V V Power dissipation (reference data) When mounted on a board (4 layers, FR4, 76.2 mm × 114.3 mm × 1.6 mm), Rth (j-a) = 30.5°C/W 25 50 75 100 125 150 1.0 2.0 3.0 Ambient temperature T a (°C) Power dissipation P D (W) PD – Ta 4.0
Electrical Characteristics (Ta = 25°C) Characteristics Symbol Test Conditions Min Typ. Max Unit Power supply current IM IVreg = 0 mA ― 6.0 8.5 mA Input current IIN1A TSP/VSP (SEL_SP = VREG) -1 ― 1 μA IIN1D(H) TSP/VSP = 5 V (SEL_SP = Open, GND) ― 100 150 IIN1D(L) TSP/VSP = 0 V (SEL_SP = Open, GND -1 ― 1 IIN2 SEL_FG, MIN_SP, LA, FPWM, SEL_LD -1 ― 1 IN3(H) VIN = 5 V FST, SEL_SP, LA, SEL_LA ― 100 150 IN3(L) VIN = 0 V FST, SEL_SP, LA, SEL_LA -150 -100 ― IN4(H) VIN = 5 V CW/CCW, BRAKE ― 100 150 IN4(L) VIN = 0 V CW/CCW, BRAKE -1 0 ― IN5 MVM -1 ― 1 Hall element input Input sensitivity VS Differential input 40 ― ― mVpp In-phase voltage range VW ― 0.5 ― 3.5 V Input hysteresis VH (Reference data) ±4 ±8 ±12 mV Hall IC input VIN4 H HUP HUM = VREG/2 VREG - 1 ― VREG V L 0 ― 0.8 Input voltage VIN1 (H) TSP/VSP SEL_SP = Open, GND 2.0 ― 5.5 V VIN1 (L) GND ― 0.8 VIN2 (H) CW/CCW, BRAKE 2.0 ― 5.5 VIN2 (L) CW/CCW, BRAKE GND ― 0.8 VIN3 (H) MVM LH: 150-degree commutation 120-degree commutation 1.9 2.0 2.1 VIN3 (L) MVM HL: 120-degree commutation150-degree commutation 1.7 1.8 1.9 Input hysteresis range V1hys (Reference data) TSP/VSP SEL_SP = GND 0.3 0.4 0.5 V V2hys (Reference data) CW/CCW, BRAKE 0.3 0.4 0.5 Output low voltage of FG_OUT/LD_OUT VOUT I OUT = 5 mA GND ― 0.5 V Leakage current of FG_OUT/LD_OUT I LOUT (Reference data) V OUT = 22 V ― 0 2 μA Output on resistance of U, V, W R ON (H+L) I OUT = 1 A ― 0.24 0.33 Ω Output leakage current of U, V, W I L (H) V OUT = 0 V -10 0 ― μA IL (L) (Reference data) V OUT = 22 V ― 0 10 ON resistance of VST terminal in starting RVST ― ― 600 1000 Ω Masking time for detecting current limit TRS (Reference data) ― 1.2 ― μs
Characteristics Symbol Test Conditions Min Typ. Max Unit Detection error of current limit ΔIOUT Iout (U/V/W) = 1 A, ILIM: 39 kΩ -10 ― 10 % Relative detection error of current limit ΔIOUT_R (Reference data) Iout (U/V/W) = 1 A, ILIM: 39 kΩ Measured value of each upper-and-lower phase for average value of upper-and-lower phase -8.5 ― 8.5 % PWM oscillation frequency FPWM3 (Reference data)FPWM = ”3” 22.5 25 27.5 kHz FPWM2 (Reference data)FPWM = ”2” 180 200 220 FPWM1 (Reference data)FPWM = ”1” 90 100 110 FPWM0 (Reference data)FPWM = ”0” 45 50 55 OSC frequency OSC (Reference data)OSCCR : 27 kΩ,360 pF 11.7 13 14.3 MHz Setting time of TSTEP terminal Tsoft (Reference data)TSTEP = 0.01 μ F ― 0.100 ― s Setting time of TIP terminal Tip (Reference data)TIP = 0.01 μ F ― 0.100 ― s Lock detection time Tlock1 (Reference data)SEL_LD = ”0” ― 0.5 ― s Restart time after lock Tlock2 (Reference data)SEL_LD = ”0” ― 5 ― s Masking time for detecting overcurrent TISD (Reference data) ― 1.9 ― μs Current when overcurrent detection operates ISD (Reference data) 3 4.5 6 A Thermal shutdown circuit TSD (Reference data) 150 165 180 TSDhys (Reference data) Hysteresis for restart ― 15 ― Under lockout voltage of VM terminal VMUVLO ― 5.0 5.3 5.6 V Under lockout restarting voltage of VM terminal VMUVLOR ― 5.3 5.6 5.9 V VREG output voltage VREG IVREG = - 40 mA (Note 1) 4.7 5 5.3 V (Reference data) : No shipping inspection Note 1: There is a possibility that VREG output voltage does not reach the minimum value in the above Electrical Characteristics when the power supply voltage is less than the operating ranges. Moreover, it depends on VM and the conditions of IVREG. Therefore, confirm there are not any problems by evaluating actual systems at about VMUVLO.
The relation of setting steps and terminal voltage SEL_SP FST SEL_LA SEL_FG FPWM SEL_LD MIN_SP LA (Auto lead angle: SEL_LA = ”1”) LA (External input: SEL_LA = ”0”) Input voltage (V) (Written by VREG) Input voltage (V) (When VREG = 5 V) Min Max Min Max 2 3 31 Vreg/256*160 Vreg 3.125 5 30 Vreg/256*155 Vreg/256*159 3.027 3.105 29 Vreg/256*150 Vreg/256*154 2.93 3.008 28 Vreg/256*145 Vreg/256*149 2.832 2.910 27 Vreg/256*140 Vreg/256*144 2.734 2.813 26 Vreg/256*135 Vreg/256*139 2.637 2.715 25 Vreg/256*130 Vreg/256*134 2.539 2.617 24 Vreg/256*125 Vreg/256*129 2.441 2.520 23 Vreg/256*120 Vreg/256*124 2.344 2.422 22 Vreg/256*115 Vreg/256*119 2.246 2.324 21 Vreg/256*110 Vreg/256*114 2.148 2.227 20 Vreg/256*105 Vreg/256*109 2.051 2.129 19 Vreg/256*100 Vreg/256*104 1.953 2.031 18 Vreg/256*95 Vreg/256*99 1.855 1.934 17 Vreg/256*90 Vreg/256*94 1.758 1.836 16 Vreg/256*85 Vreg/256*89 1.66 1.738 15 Vreg/256*80 Vreg/256*84 1.563 1.641 14 Vreg/256*75 Vreg/256*79 1.465 1.543 13 Vreg/256*70 Vreg/256*74 1.367 1.445 12 Vreg/256*65 Vreg/256*69 1.27 1.348 11 Vreg/256*60 Vreg/256*64 1.172 1.250 10 Vreg/256*55 Vreg/256*59 1.074 1.152 9 Vreg/256*50 Vreg/256*54 0.977 1.055 0 0 8 Vreg/256*45 Vreg/256*49 0.879 0.957 7 Vreg/256*40 Vreg/256*44 0.781 0.859 6 Vreg/256*35 Vreg/256*39 0.684 0.762 5 Vreg/256*30 Vreg/256*34 0.586 0.664 4 Vreg/256*25 Vreg/256*29 0.488 0.566 3 Vreg/256*20 Vreg/256*24 0.391 0.469 2 Vreg/256*15 Vreg/256*19 0.293 0.371 1 Vreg/256*10 Vreg/256*14 0.195 0.273 0 0 Vreg/256*9 0 0.176
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. Timing charts may be simplified for explanatory purposes. 1. Basic operation In receiving the start command, rotational speed and rotation direction are detected and the motor operates by the sequence of the following table. Detection of rotation direction State Sequence of operation Enable Rotation direction agrees 150-degree PWM drive Rotation direction disagrees Reverse brake Forced commutation 150-degree PWM drive Disenable Position signal frequency ≤ 40 Hz DC excitation Forced commutation 150-degree PWM drive Position signal frequency: 40 to 200 Hz Short brake DC excitation Forced commutation 150-degree PWM drive Position signal frequency> 200 Hz Detecting rotation direction is retried. 2. Startup operation Term of the DC excitation is configured by the TIP terminal. Forced commutation frequency is configured by the FST terminal. When the frequency of a position signal exceeds the frequency configured by the FST terminal, the operation moves from the forced commutation mode to the 150-degree PWM dr ive. In outputting, the on-duty in the DC excitation mode and the forced commutation mode correspond to the duty according to VST terminal voltage. The on-duty in the 150-degree PWM drive is determined by the input of TSP/VSP terminals. And startup, speed variable, and stop of the motor are controlled. Time configuration and starting torque (output duty) of DC excitation and forced commutation are changed depending on motors and loads. So, adjustment is needed by experiment. 1) DC excitation mode Term of the DC excitation is configured by the TIP terminal. The motor operates in the DC excitation mode for 2 × T2[s]. The operation shifts to the DC excitation (2) after T2 term of the DC excitation (1). And it shifts to the forced commutation after T2 term of the DC excitation (2). In the term of the DC excitation (1) and (2), when C2 is 0.01 μF, T2 is calculated as follows; 32 × 0.313 × C2 × 10^6 = approximately 0.100 s States of the excitation phase of the DC excitation (1) and (2) according to the state of CW/CCW and the signals of HUP and HUM terminals are shown in the following table.
When CW/CCW = L, HU (HUP-HUM) = H Mode DC excitation (1) DC excitation (2) Term[s] T2 T2 Conduction phase U phase: Full ON (Lower side) V phase: OFF W phase: PWM (Upper side) U phase: OFF V phase: PWM (Lower side) W phase: Full ON (Upper side) When CW/CCW = L, HU (HUP-HUM) = L Mode DC excitation (1) DC excitation (2) Term[s] T2 T2 Conduction phase U phase: Full ON (Upper side) V phase: OFF W phase: PWM (Lower side) U phase: OFF V phase: PWM (Upper side) W phase: Full ON (Lower side) When CW/CCW=H, HU (HUP-HUM) = H Mode DC excitation (1) DC excitation (2) Term[s] T2 T2 Conduction phase U phase: PWM (Upper side) V phase: OFF W phase: Full ON (Lower side) U phase: Full ON (Upper side) V phase: PWM (Lower side) W phase: OFF When CW/CCW = H, HU (HUP-HUM) = L Mode DC excitation (1) DC excitation (2) Term[s] T2 T2 Conduction phase U phase: PWM (Lower side) V phase: OFF W phase: Full ON (Upper side) U phase: Full ON (Lower side) V phase: PWM (Upper side) W phase: OFF 2) Forced commutation mode Forced commutation frequency is determined by the FST terminal. Number of steps set of FST terminal Forced commutation frequency
2 Forced commutation frequency
∼ − 1.6 Hz
1 Forced commutation frequency
∼ − 6.4 Hz
0 Forced commutation frequency
∼ − 3.2 Hz 2×T2 DC excitation Signal input of TSP/VSP terminal starts Forced commutation Start 1- sensor drive VST TIP TSP/VSP VST TIP 0.625 V (typ.) VST voltage is calculated from the following formula. (t = 0 s in startup) VST(t) = V1×(1-e^(-t/τ)) V1 = R2/(R1+R2)×VREG (VREG = 5 V(typ.)) τ = (R1×R2)/(R1+R2)×C1 VREG
3) Timing chart in starting 3. Position detection terminal <Hall element input> In-phase voltage range: VW = 0.5 to 3.5 V Input hysteresis: VH = 8 mV (typ.) <Hall IC input> Conditions: HUP = GND to VREG HUM = VREG/2 VS ≥ 40 mV VS VH = 8 mV (typ.) VH HUM HUP Output duty determined by VST voltage Output duty determined by inputting TSP/VSP OFF (High impedance) VST TSP/VSP input start Startup 1 electrical angle (min) TSP/VSP input stop TSP/VSP input start Startup DC excitation Forced commutation 1-sensor drive Stop U, V, W Position signal (HUP-HUM) LD_OUT TIP DC excitation Forced commutation
- Operation in abnormality detection The following states are detected as abnormalities: 1. The ISD circuit is activated. 2. The TSD circuit is activated. 3. The motor lockout detection is activated. 4. Overvoltage detection is activated. 5. Frequency of position signal is abnormal (≥ 3 kHz per electrical angle) If either of the above abnormality of 1, 2, 3 or 5 is detected, the LD_OUT terminal outputs low level until 150-degree PWM drive starts. <Output operation of U, V, W, and LD_OUT terminals in abnormality detection> Output duty determined by VST voltage Output duty determined by TSP/VSP terminal input OFF (high impedance) VST TIP Forced commutation DC excitation 1-sensor drive DC excitation Forced commutation Abnormality detection U, V, W 1 electrical angle (min) LD_OUT Starting TSP/VSP input 1-sensor drive Position signal (HUP-HUM) Abnormality detection is canceled
- Motor lockout detection If the position signal does not change within the term of Ton, which is configured by SEL_LD terminal, during the forced commutation mode or 150 -degree PWM drive, the operation turns off, and re-starts after the term of Toff. After abnormality is detected, LD_OUT terminal outputs low. It outputs high when the operation moves to the 150-degree PWM drive. When on duty = 0 % as a rotational speed command is input into TSP/VSP terminal, the term of Toff is released. After a start command signal is input into TSP/VSP terminal, the drive will restart. To release the abnormality detection, input a rotational speed command of ‘on duty = 0 % ‘ for 2 ms period or more. Ton and Toff are set by SEL_LD terminal as follows. Number of steps set of SEL_LD terminal Functional description Motor lockout detection does not work. Also disenable for abnormality detection when the frequency of position signal is abnormal (≥3 kHz/electrical angle) 2 Ton = 1 s (typ.), Toff = 10 s (typ.) 1 Ton = 0.5 s (typ.), Toff = 10 s (typ.) 0 Ton = 0.5 s (typ.), Toff = 5 s (typ.) <Output operation of U, V, W, and LD_OUT terminals in lockout detection> VST TIP Forced commutation DC excitation DC excitation Forced commutation U, V, W Ton LD_OUT Starting TSP/VSP input 1-sensor drive Motor lock Motor lock detection is canceled Toff Motor lock is canceled Position signal (HUP-HUM) Abnormality detection Output duty determined by VST voltage Output duty determined by TSP/VSP terminal input OFF (high impedance)
- Forward /Reverse rotation direction switching CW/CCW = Low: Forward direction, CW/CCW = High: Reverse direction. When input level (H or L) of CW/CCW terminal is switched during 150-degree PWM drive, reverse brake operates until the position signal frequency decreases to 40 Hz or less. And then, it operates by the sequence of DC excitation, forced commutation, and 150-degree PWM drive. 7. Rotation speed output A rotation pulse based upon hall signals is output. Either of 1 pulse, 2/3, 1/3, or 1/2 pulses per electrical angle can be selected by SEL_FG terminal. In selecting 2/3, 1/2, or 1/3 pulses per electrical angle, FG_OUT terminal outputs low when the frequency of the position signal is 1 Hz or less. Number of steps set by SEL_FG terminal FG_OUT 3 1 pulse / electrical angle 2 2/3 pulses / electrical angle 1 1/3 pulses / electrical angle 0 1/2 pulses / electrical angle CW/CCW Order of conduction phase of output L Forward rotation direction: U→V→W→U→ ··· H Reverse rotation direction: W→V→U→W→ ··· SEL_FG=“2” HUP HUM SEL_FG=“0” SEL_FG=“1” SEL_FG=“3”
- Rotational speed command Startup, stop and motor rotational speed which is set by output PWM duty are able to be controlled by an input signal into TSP/VSP terminal. Pulse duty control, analog voltage control, or direct PWM control can be selected as a mode of TSP/VSP terminal by the number of steps set by SEL_SP terminal. Output PWM duty in DC excitation mode and forced commutation mode is according to VST voltage. Number of steps set by SEL_SP terminal Input control at TSP/VSP terminal
2 Analog voltage control
1 Pulse duty control
0 Direct PWM control
1) Relation of VST terminal voltage and output PWM duty 0 ≤ VST voltage ≤ 0.625 V (typ.) → Duty = 0 % 0.625 V (typ.) ≤ VST voltage ≤ 3.125 V (typ.) → See the right figure (1/128 to 128/128) 3.125 V (typ.) ≤ VST voltage ≤ VREG → Duty = 100 % (128/128) 2) Relation of TSP/VSP terminal voltage and output PW M duty in controlling analog voltage (SEL_SP=”2”) When the voltage of TSP/VSP terminal ≥ 0.625 V, startup sequence starts. When the voltage of TSP/VSP terminal < 0.625 V, the sequence is reset. 0 ≤ VSP/TSP (when analog voltage control) ≤ VAD (L): 0.625 V (typ.) → Duty = 0 % V AD (L): 0.625 V (typ.) ≤ VSP/TSP (when analog voltage control) ≤ VAD (H): 3.125 V (typ.) → See the below figure. (1/128 to 128/128) VAD (H) 3.125 V (typ.) ≤ VSP/TSP (when analog voltage control) ≤ VREG → Duty = 100 % (128/128) 0 % VAD (L) 0.625 V (typ.) 100 % Output on duty VST voltage VAD (H) 3.125 V (typ.) 0 % VAD (L) 100 % Output on duty VAD (H) TSP/VSP voltage
3) Relation of TSP/VSP terminal voltage and output PWM duty in controlling pulse duty (SEL_SP=”1”) When a PWM signal is input into TSP/VSP terminal, startup sequence starts. The pulse frequency input into TSP/VSP terminal should be set from 1 kHz to 100 kHz . B ecause input signal may be ineffective when on duty is for 0.2 μs or less. B ecause the operation may be judged off state when output off duty is for 1 ms or more. 4) Relation of TSP/VSP terminal voltage and output PWM duty in controlling direct PWM (SEL_SP = ”0”) When a PWM signal is input into TSP/VSP terminal, startup sequence starts. The pulse frequency of input into TSP/VSP terminal should be set from 23 kHz to 100 kHz. The PWM frequency in DC excitation mode and forced commutation mode is determined by configuration of FPWM terminal and the output PWM duty is determined by the input voltage of VST terminal. The PWM frequency of 150-degree PWM drive is determined by the input signal of TSP/VSP terminal. When SEL_SP is "0", configurations of TSTEP terminal and MIN_SP terminal become invalid, and the functions of control configuration of acceleration and deceleration and configuration of minimum output on-duty become invalid. 9. Setting minimum output on duty Minimum output on duty is determined by the input voltage into MIN_SP terminal. However, minimum o utput on -duty becomes invalid for MIN_SP terminal in DC excitation mode, forced commutation mode, and setting SEL_SP = ”0”. Number of steps set by MIN_SP terminal Minimum output duty [%] 20.3 6 18.8 5 17.2 4 15.6 3 14.1 2 12.5 1 10.9 0 0 0 % 100 % Output on duty Input on duty at TSP/VSP terminal 100 %
- PWM frequency Output PWM frequency either in analog voltage control or in pulse duty control is determined by input voltage at FPWM terminal. Output PWM frequency should be much higher than the electrical frequency of the motor. Please determine the value within switching performance of the drive circuits. Number of steps set by FPWM terminal PWM frequency 3 25 kHz 2 200 kHz 1 100 kHz 0 50 kHz
- Lead angle control Lead angle control mode is determined by setting both SEL_LA and LA terminal. Number of steps set by SEL_LA terminal Functional description
2 Test mode
1 Auto lead angle: Auto lead angle mode is selected by input
0 External input: Lead angle value is configured by input voltage of
1) Auto lead angle (SEL_LA = ”1”) The threshold of the frequency has hysteresis +0 Hz/-50 Hz. Lead angle value [deg] Number of steps set by LA terminal Electrical frequency [Hz] to 100 100 to 200 200 to 300 300 to 400 400 to 500 500 to 600 600 to 700 700 to 800 800 to 900 900 to 1000 Lead angle value [deg] Number of steps set by LA terminal Electrical frequency [Hz] 1000 to 1100 1100 to 1200 1200 to 1300 1300 to 1400 1400 to 1500 1500 to 1600 1600 to 1700 1700 to 1800 1800 to 1900 1900 to 2000 More than 2000
2) External input (SEL_LA = ”0”) Lead angle in the range of 0 ° to 58.125° as commutation signals which correspond to the induced voltage can be adjusted. The range from 0 V to 3.125 V as analog input voltage into LA terminal is divided into 32 parts. Input voltage into LA terminal = 0 V: lead angle = 0°. Input voltage into LA terminal = 3.125 V: lead angle = 58.125°. Input voltage ≥ 3.125 V, input voltage: lead angle = 58.125°. (Design value) Number of steps LA [V] Lead angle [deg] Number of steps LA [V] Lead angle [deg] 31 3.125 58.125 15 1.563 28.125 30 3.027 56.250 14 1.465 26.250 29 2.930 54.375 13 1.367 24.375 28 2.832 52.500 12 1.270 22.500 27 2.734 50.625 11 1.172 20.625 26 2.637 48.750 10 1.074 18.750 25 2.539 46.875 9 0.977 16.875 24 2.441 45.000 8 0.879 15.000 23 2.344 43.125 7 0.781 13.125 22 2.246 41.250 6 0.684 11.250 21 2.148 39.375 5 0.586 9.375 20 2.051 37.500 4 0.488 7.500 19 1.953 35.625 3 0.391 5.625 18 1.855 33.750 2 0.293 3.750 17 1.758 31.875 1 0.195 1.875 16 1.660 30.000 0 0.000 0.000
- Acceleration and deceleration control setting Time to reflect the duty of the input control signal of TSP/VSP terminal in the output duty during acceleration and deceleration can be set by connecting the capacitor to TSTEP terminal. (About 0.078 %/T) Therefore, the rotation speed can accelerate and slow down gradually in startup. However, when change of the duty of an input control signal is 2.5 % or less, it is reflected in output duty for every PWM cycle. Acceleration and deceleration time : (For example) When C = 0.01 μ F, 32×T = 32× 0.313×C×10^6 = about 0.100 s. When the speed command that the output on duty is 0 % is inputted during operation, the deceleration function becomes invalid, and the output is turned off. At this time, an output duty is reset to 0 %. When res tarting, please input a start command signal to TSP/VSP pin after inputting a speed control command that the output on duty is 0 % for 2 ms or more. Output DUTY TSTEP 32×T 32×T 32×T 2.5 % 2.5 % Input DUTY 7.5 % In case of 7.5 % increase in input DUTY 2.5 % Output DUTY TSTEP 32×T 32×T 32×T 2.5 % 2.5 % Input DUTY 7.5 % In case of 7.5 % decrease in input DUTY 2.5 %
- Brake function If high level is input into BRAKE terminal, the reverse brake works to stop the motor operation. After the input signal into BRAKE terminal is changed from L level to H level during the motor rotation, the reverse brake works until the position signal frequency becomes 40 Hz. When the position signal frequency is less than 40 Hz, the motor will stop. However, when the input signal into BRAKE terminal is changed from L level to H level under the condition that the output duty command of TSP/VSP terminal is 0 %, the operation sequence is shown as the b elow table. BRAKE Functional description High Brake Low or open Normal operation In case the input signal into BRAKE terminal is changed from L level to H level under the condition that the output duty command of TSP/VSP terminal is 0 % Detection of rotation direction Status Brake sequence Enable Position signal frequency ≤ 40 Hz Short brake Position signal frequency > 40 Hz Reverse brake → Short brake Disenable Position signal frequency ≤ 200 Hz or less Short brake Position signal frequency > 200 Hz or more Detection of rotation direction is retried 14. Overvoltage monitoring function When MVM = 2.0 V (typ.) or more, drive mode is 120-degree conduction. MVM Functional description MVM ≥ 2.0 V (typ.) 120-degree commutation MVM < 1.8 V (typ.) 150-degree commutation 15. Current limit circuit Current limit circuit turns off upper side of the output transistors and limits the current. Driver restarts just when PWM turns on. Value of current limit is configured by the external resistance. (Example) When 39 kΩ is set as the resistor (R), I OUT (typ.) = 39000/R = 39000/39000 ∼ − 1.0 A IR ILIM U V W Detector Detector Detector R = 39 k Ω (typ.) VM PGND1, PGND2 Detector Detector Detector Current limit circuit Setting current limit value
- Overcurrent detection circuit (ISD) Six overcurrent detectors are bui lt in each output transistor. If detected value exceeds the absolute maximum rating, all of outputs are turned off (high impedance: Hi-Z). If output on duty of rotational speed command is set 0 %, abnormality detection is released. Please input a rotational speed command (0 % for 2 ms or more) to release the abnormality detection. 17. Thermal shutdown circuit (TSD) It turns off output (high impedance: Hi-Z), when the junction temperature (Tj) exceeds 165°C (typ.). There is 15°C (typ.) of hysteresis. Temperature for restart is TSD - TSDhys after thermal shutdown circuit operates. TSD = 165°C (typ.), TSDhys = 15°C (typ.) 18. Under voltage lockout (UVLO) It turns off each output of U, V, W, FG_OUT and LD_OUT (high impedance: Hi-Z), when VM is 5.3 V (typ.)
1) CW/CCW = L, LA = 0 [deg] In this timing chart, the reverse rotation brake is indicated without current limit. 2) CW/CCW = H, LA = 0 [deg] In this timing chart, the reverse rotation brake is indicated without current limit. HUP HUM U V W U V W U V W U V W U V W Full on ON duty (modulation) ON duty (fix) Full on ON duty (modulation) ON duty (fix) 150-degree PWM drive U V W Reverse rotation brake (CW/CCW=L H) 150-degree PWM drive Reverse rotation brake (CW/CCW=H L) HUP HUM
Application circuit example Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. FG_OUT TSD PGND1 VM U V W MOTOR Pre-driver ISD HUP Control logic VREG DC excitation SEL_LA Lead angle control PWM control Clock generation 0.1 μF GND n-bit counter Forced commutation frequency 8-bit ADC converter Startup circuit TSTEP Duty up time control LD_OUT TEST OSCCR Direction of rotation control VREG 27 kΩ 360 pF BRAKE HUM LVD SEL_FG FG select Position Detection Brake control TIP FST TEST2 ILIM VM OVD MVM Auto lead angle control VREG VREG/2 VREG FPWM TSP/VSP LA VREG SEL_SP CW/CCW VREG SEL_LD VREG MIN_SP VREG VREG VREG/2 VREG VREG VREG/2 VREG VST Current limit circuit Re-start OFF time control VREG PGND3 SGND PGND2 Lock detection select Reference voltage circuit (5 V)
P-WQFN36-0505-0.50-001 Unit: mm Weight: 0.06 g (typ.)
- Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuit s shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the devi ce breakdown, damage or deterioration, and may result injury by explosion or combustion. (2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. (4) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time.
Points to remember on handling of ICs (1) Over current Protection Circuit Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the Over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. (2) Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. (3) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (4) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.
RESTRICTIONS ON PRODUCT USE
- Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice.
- This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
- Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
- PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative.
- Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
- Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations.
- The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
- ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
- Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
- Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.