TC38XAE INFINEON | Alldatasheet

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AURIX™ TC38x variants About this document Scope and purpose This document is an addendum to the TC38x Product Data Sheet and User's Manual, listing all planned product variants, key parameters such as memory size and optional features. The User's Manual lists functions implemented on the Silicon, but this document counts functions that are pinning dependent; i.e. functions are counted that are connected to at least one package pin. As pins are overlaid with several functions the pinning needs to be checked (see Product Data Sheet) to determine the number of usable functions in an application. Naming conventions Prefix:

  • SAK: T ambient Temperature Range from -40 °C up to +125 °C.
  • SAL: T ambient Temperature Range from -40 °C up to +150 °C (packaged device). Feature Package:
  • P: Standard feature.
  • E: Emulation device with all features of the emulated standard type, additionally full MCDS, overlay functionality for calibration, AGBT as trace interface for development (depending on the package).
  • C,V,Z: Customer Specific.
  • A: ADAS ext. Memory.
  • T: ADAS + emulation.
  • X: Extended Feature device. These products contain the extended memory (EMEM) of the ADAS subsystem. The ADAS peripherals SPU, RIF and CIF are not available.
  • M: MotionWise software.
  • F: Extended Flash.
  • G: Additional Connectivity.
  • H: ADAS Standard feature.
  • N: Standard feature with AMU. Datasheet addendum Please read the Important Notice and Warnings at the end of this document v1.4 www.infineon.com 2019-06 OPEN MARKET VERSION

AURIX™ TC38x variants Table of contents Datasheet addendum 2 v1.4 2019-06 OPEN MARKET VERSION

1 TC38x AE step variants

The following tables list the TC38x AE step variants.

1.1 TC38x AE step (part 1)

Table 1 TC38x AE step (part 1) SAL- TC380QP-160 F300 SAL- TC389QP-160 F300S SAL- TC387QP-160 F300S SAK- TC389QP-160 F300S SAK- TC387QP-160 F300S SAK- TC387TP-128 F300S SAL- TC387TP-128 F300S Step AE AE AE AE AE AE AE Production status Standard Standard Standard Standard Standard Customer specific Customer specific Package type Bare Die PG-LFBGA-516 PG-LFBGA-292 PG-LFBGA-516 PG-LFBGA-292 PG-LFBGA-292 PG-LFBGA-292 Pinout Reference silicon TC38x TC38x TC38x TC38x TC38x TC38x TC38x Temperature range (ambient) -40°C up to +170°C -40°C up to +150°C -40°C up to +150°C -40°C up to +125°C -40°C up to +125°C -40°C up to +125°C -40°C up to +150°C Chip ID Attention: The value of SCU_CHIPID in the UCODE field contains the default value 0 not the µCode version. 0x8C008084 0x8C008984 0x8C008784 0x8C008984 0x8C008784 0xCB008784 0xCB008784 Cores / checker cores Maximum frequency (MHz) 300 300 300 300 300 300 300 Program flash (MB) 10 10 10 10 10 8 8 Data flash 0 (single-ended) (KB) 512 512 512 512 512 512 512 Total SRAM (without EMEM and Cache) (KB) 1376 1376 1376 1376 1376 1152 1152 EMEM Size (KB) 0 0 0 0 0 0 0 AURIX™ TC38x variants Datasheet addendum 3 v1.4 2019-06 OPEN MARKET VERSION

Table 1 TC38x AE step (part 1) (continued) SAL- TC380QP-160 F300 SAL- TC389QP-160 F300S SAL- TC387QP-160 F300S SAK- TC389QP-160 F300S SAK- TC387QP-160 F300S SAK- TC387TP-128 F300S SAL- TC387TP-128 F300S DSPR (KB) 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other DLMU (KB) 64 per CPU 64 per CPU 64 per CPU 64 per CPU 64 per CPU 64 per CPU 64 per CPU PSPR (KB) 64 64 64 64 64 64 64 LMU (KB) 128 128 128 128 128 128 128 DAM (KB) 64 64 64 64 64 64 64 AMU1) No No No No No No No ADC (primary groups/channels) 8/64 8/64 5/40 8/64 5/40 5/40 5/40 ADC (secondary groups/channels) 4/60 4/60 4/60 4/60 4/60 4/60 4/60 ADC (fast compare channels) 4 4 4 4 4 4 4 ADC (EDSADC channels) 10 10 6 10 6 6 6 CAN (modules/nodes) 3/3x4 3/3x4 3/3x4 3/3x4 3/3x4 3/3x4 3/3x4 FlexRay (modules/channels) 2/2x2 2/2x2 2/2x2 2/2x2 2/2x2 2/2x2 2/2x2 HSSL modules 1 1 1 1 1 1 1 ASCLIN modules / with ASC and LIN / with 3-wire SPI 24/24/12 24/24/12 24/24/11 24/24/12 24/24/11 24/24/11 24/24/11 QSPI modules / with LVDS 1 AMU is abbreviated as ASC Modeling Unit. For Additional details about AMU, Contact an Infineon Representative AURIX™ TC38x variants Datasheet addendum 4 v1.4 2019-06 OPEN MARKET VERSION

Table 1 TC38x AE step (part 1) (continued) SAL- TC380QP-160 F300 SAL- TC389QP-160 F300S SAL- TC387QP-160 F300S SAK- TC389QP-160 F300S SAK- TC387QP-160 F300S SAK- TC387TP-128 F300S SAL- TC387TP-128 F300S SENT channels 25 25 20 25 20 20 20 MSC modules 3 3 2 3 2 2 2 PSI5 channels 4 4 4 4 4 4 4 PSI5-S module Yes Yes Yes Yes Yes Yes Yes SDMMC module No No No No No No No Maximum Ethernet availability: 1GBit/100Mbit/No 1Gbit/s 1Gbit/s 1Gbit/s 1Gbit/s 1Gbit/s 1Gbit/s 1Gbit/s MCDS availability miniMCDS miniMCDS miniMCDS miniMCDS miniMCDS miniMCDS miniMCDS ADAS cluster available No No No No No No No HSM available Yes Yes Yes Yes Yes Yes Yes AURIX™ TC38x variants Datasheet addendum 5 v1.4 2019-06 OPEN MARKET VERSION

1.2 TC38x AE step (part 2)

Table 2 TC38x AE step (part 2) SAK-TC387TP-160F300S SAL-TC387TP-160F300S SAK-TC387QN-160F300S SAK-TC389QN-160F300S Step AE AE AE AE Production status Customer specific Customer specific Customer specific Customer specific Package type PG-LFBGA-292 PG-LFBGA-292 PG-LFBGA-292 PG-LFBGA-516 Pinout LFBGA 0.8 mm LFBGA 0.8 mm LFBGA 0.8 mm LFBGA 0.8 mm Reference silicon TC38x TC38x TC38x TC38x Temperature range (ambient) -40°C up to +125°C -40°C up to +150°C -40°C up to +125°C -40°C up to +125°C Chip ID Attention: The value of SCU_CHIPID in the UCODE field contains the default value 0 not the µCode version. 0xFC008784 0xFC008784 0xAC008784 0xAC008984 Cores / checker cores 3/2 3/2 4/2 4/2 Maximum frequency (MHz) 300 300 300 300 Program flash (MB) 10 10 10 10 Data flash 0 (single-ended) (KB) 512 512 512 512 Total SRAM (without EMEM and Cache) (KB) 768 768 1376 1376 EMEM Size (KB) 0 0 0 0 DSPR (KB) 160 in CPU0; 128 in CPU1; 96 other 160 in CPU0; 128 in CPU1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other DLMU (KB) 64 per CPU 64 per CPU 64 per CPU 64 per CPU AURIX™ TC38x variants Datasheet addendum 6 v1.4 2019-06 OPEN MARKET VERSION

Table 2 TC38x AE step (part 2) (continued) SAK-TC387TP-160F300S SAL-TC387TP-160F300S SAK-TC387QN-160F300S SAK-TC389QN-160F300S PSPR (KB) 64 64 64 64 LMU (KB) 128 128 128 128 DAM (KB) 64 64 64 64 AMU2) No No Yes Yes ADC (primary groups/channels) 5/40 5/40 5/40 8/64 ADC (secondary groups/channels) 4/60 4/60 4/60 4/60 ADC (fast compare channels) 4 4 4 4 ADC (EDSADC channels) 6 6 6 10 CAN (modules/nodes) 3/3x4 3/3x4 3/3x4 3/3x4 FlexRay (modules/channels) 2/2x2 2/2x2 2/2x2 2/2x2 HSSL modules 1 1 1 1 ASCLIN modules / with ASC and LIN / with 3-wire SPI 24/24/11 24/24/11 24/24/11 24/24/12 QSPI modules / with LVDS 5/2 5/2 5/2 5/2 SENT channels 20 20 20 25 MSC modules 2 2 2 3 PSI5 channels 4 4 4 4 2 AMU is abbreviated as ASC Modeling Unit. For Additional details about AMU, Contact an Infineon Representative AURIX™ TC38x variants Datasheet addendum 7 v1.4 2019-06 OPEN MARKET VERSION

Table 2 TC38x AE step (part 2) (continued) SAK-TC387TP-160F300S SAL-TC387TP-160F300S SAK-TC387QN-160F300S SAK-TC389QN-160F300S PSI5-S module Yes Yes Yes Yes SDMMC module No No No No Maximum Ethernet: availability: 1GBit/100Mbit/No 1Gbit/s 1Gbit/s 1Gbit/s 1Gbit/s MCDS availability miniMCDS miniMCDS miniMCDS miniMCDS ADAS cluster available No No No No HSM available Yes Yes Yes Yes AURIX™ TC38x variants Datasheet addendum 8 v1.4 2019-06 OPEN MARKET VERSION

2 TC38x AD step variants

The following tables list the TC38x AD step variants.

2.1 TC38x AD step (part 1)

Table 3 TC38x AD step (part 1) SAL- TC380QP-160 F300 SAL- TC389QP-160 F300S SAL- TC387QP-160 F300S SAK- TC389QP-160 F300S SAK- TC387QP-160 F300S SAK- TC387TP-128 F300S SAL- TC387TP-128 F300S Step AD AD AD AD AD AD AD Production status Standard Standard Standard Standard Standard Customer specific Customer specific Package type Bare Die PG-LFBGA-516 PG-LFBGA-292 PG-LFBGA-516 PG-LFBGA-292 PG-LFBGA-292 PG-LFBGA-292 Pinout Reference silicon TC38x TC38x TC38x TC38x TC38x TC38x TC38x Temperature range (ambient) -40°C up to +170°C -40°C up to +150°C -40°C up to +150°C -40°C up to +125°C -40°C up to +125°C -40°C up to +125°C -40°C up to +150°C Chip ID Attention: The value of SCU_CHIPID in the UCODE field contains the default value 0 not the µCode version. 0x8C008083 0x8C008983 0x8C008783 0x8C008983 0x8C008783 0xCB008783 0xCB008783 Cores / checker cores Maximum frequency (MHz) 300 300 300 300 300 300 300 Program flash (MB) 10 10 10 10 10 8 8 Data flash 0 (single-ended) (KB) 512 512 512 512 512 512 512 Total SRAM (without EMEM and Cache) (KB) 1376 1376 1376 1376 1376 1152 1152 EMEM size (KB) 0 0 0 0 0 0 0 AURIX™ TC38x variants Datasheet addendum 9 v1.4 2019-06 OPEN MARKET VERSION

Table 3 TC38x AD step (part 1) (continued) SAL- TC380QP-160 F300 SAL- TC389QP-160 F300S SAL- TC387QP-160 F300S SAK- TC389QP-160 F300S SAK- TC387QP-160 F300S SAK- TC387TP-128 F300S SAL- TC387TP-128 F300S DSPR (KB) 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other DLMU (KB) 64 per CPU 64 per CPU 64 per CPU 64 per CPU 64 per CPU 64 per CPU 64 per CPU PSPR (KB) 64 64 64 64 64 64 64 LMU (KB) 128 128 128 128 128 128 128 DAM (KB) 64 64 64 64 64 64 64 AMU3) No No No No No No No ADC (primary groups/channels) 8/64 8/64 5/40 8/64 5/40 5/40 5/40 ADC (secondary groups/channels) 4/60 4/60 4/60 4/60 4/60 4/60 4/60 ADC (fast compare channels) 4 4 4 4 4 4 4 ADC (EDSADC channels) 10 10 6 10 6 6 6 CAN (modules/nodes) 3/3x4 3/3x4 3/3x4 3/3x4 3/3x4 3/3x4 3/3x4 FlexRay (modules/channels) 2/2x2 2/2x2 2/2x2 2/2x2 2/2x2 2/2x2 2/2x2 HSSL modules 1 1 1 1 1 1 1 ASCLIN modules / with ASC and LIN / with 3-wire SPI 24/24/12 24/24/12 24/24/11 24/24/12 24/24/11 24/24/11 24/24/11 QSPI modules / with LVDS 3 AMU is abbreviated as ASC Modeling Unit. For Additional details about AMU, Contact an Infineon Representative AURIX™ TC38x variants Datasheet addendum 10 v1.4 2019-06 OPEN MARKET VERSION

Table 3 TC38x AD step (part 1) (continued) SAL- TC380QP-160 F300 SAL- TC389QP-160 F300S SAL- TC387QP-160 F300S SAK- TC389QP-160 F300S SAK- TC387QP-160 F300S SAK- TC387TP-128 F300S SAL- TC387TP-128 F300S SENT channels 25 25 20 25 20 20 20 MSC modules 3 3 2 3 2 2 2 PSI5 channels 4 4 4 4 4 4 4 PSI5-S module Yes Yes Yes Yes Yes Yes Yes SDMMC module No No No No No No No Maximum Ethernet availability: 1GBit/100Mbit/No 1Gbit/s 1Gbit/s 1Gbit/s 1Gbit/s 1Gbit/s 1Gbit/s 1Gbit/s MCDS availability miniMCDS miniMCDS miniMCDS miniMCDS miniMCDS miniMCDS miniMCDS ADAS cluster available No No No No No No No HSM available Yes Yes Yes Yes Yes Yes Yes AURIX™ TC38x variants Datasheet addendum 11 v1.4 2019-06 OPEN MARKET VERSION

2.2 TC38x AD step (part 2)

Table 4 TC38x AD step (part 2) SAK-TC387TP-160F300S SAL-TC387TP-160F300S Step AD AD Production status Customer specific Customer specific Package type PG-LFBGA-292 PG-LFBGA-292 Pinout LFBGA 0.8 mm LFBGA 0.8 mm Reference silicon TC38x TC38x Temperature range (ambient) -40°C up to +125°C -40°C up to +150°C Chip ID Attention: The value of SCU_CHIPID in the UCODE field contains the default value 0 not the µCode version. 0xFC008783 0xFC008783 Cores / checker cores 3/2 3/2 Maximum frequency (MHz) 300 300 Program flash (MB) 10 10 Data flash 0 (single-ended) (KB) 512 512 Total SRAM (without EMEM and Cache) (KB) 768 768 EMEM size (KB) 0 0 DSPR (KB) 160 in CPU0; 128 in CPU1; 96 other 160 in CPU0; 128 in CPU1; 96 other DLMU (KB) 64 per CPU 64 per CPU PSPR (KB) AURIX™ TC38x variants Datasheet addendum 12 v1.4 2019-06 OPEN MARKET VERSION

Table 4 TC38x AD step (part 2) (continued) SAK-TC387TP-160F300S SAL-TC387TP-160F300S 64 64 LMU (KB) 128 128 DAM (KB) 64 64 AMU4) No No ADC (primary groups/channels) 5/40 5/40 ADC (secondary groups/channels) 4/60 4/60 ADC (fast compare channels) 4 4 ADC (EDSADC channels) 6 6 CAN (modules/nodes) 3/3x4 3/3x4 FlexRay (modules/channels) 2/2x2 2/2x2 HSSL modules 1 1 ASCLIN modules / with ASC and LIN / with 3-wire SPI 24/24/11 24/24/11 QSPI modules / with LVDS 5/2 5/2 SENT channels 20 20 MSC modules 2 2 PSI5 channels 4 4 PSI5-S module 4 AMU is abbreviated as ASC Modeling Unit. For Additional details about AMU, Contact an Infineon Representative AURIX™ TC38x variants Datasheet addendum 13 v1.4 2019-06 OPEN MARKET VERSION

Table 4 TC38x AD step (part 2) (continued) SAK-TC387TP-160F300S SAL-TC387TP-160F300S Yes Yes SDMMC module No No Maximum Ethernet availability: 1GBit/100Mbit/No 1Gbit/s 1Gbit/s MCDS availability miniMCDS miniMCDS ADAS cluster available No No HSM available Yes Yes AURIX™ TC38x variants Datasheet addendum 14 v1.4 2019-06 OPEN MARKET VERSION

3 Memory maps of TC38x variants

This section shows the influence of above feature variants on the memory map. Program Flash Variants:

  • 10 MB: umbrella (3 x 3 MB, 1 x 1 MB), see User's Manual.
  • 8 MB: 3 MB + 1 MB + 3 MB + 1 MB (see Figure below). 8/A000 0000H PFlash0 (3 MB) PFlash1 (3 MB) 8/A030 0000H PFlash2 (3 MB) 8/A060 0000H PFlash3 (1 MB) 8/A090 0000H

10 MBPFlash Variants:

(3 MB) PFlash1 (1 MB) PFlash2 (3 MB) 8 MB Sectorization of each 3 MB Bank 8/A0A0 0000H PFlash3 (1 MB) S61 S62 S63 Logical Sector Sectors available in

1 MB Bank

(2 MB) PS1 (1 MB) PS2 (1 MB) PS0 (1 MB) S61 S62 S63 S65 S66 S125 S126 S127 S128 S129 S130 S189 S190 S191 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 00 0000H 00 4000H 00 8000H 0F 4000H 0F 8000H 0F C000H 10 4000H 10 8000H 1F 4000H 1F 8000H 1F C000H 20 0000H 20 4000H 20 8000H 2F 4000H 2F 8000H 2F C000H Logical Sector Phys. Sub- Sector Size Offset Address S64 16 KB 10 0000H Figure 1 TC38x PFlash variants Cores / Checker cores Variants:

  • 4/2: umbrella, see User's Manual
  • 3/2: not available is CPU3 including its RAMs (DSPR, DCACHE, DTAG, PSPR, PCACHE, PTAG, DLMU) CPU RAMs Variants:
  • DSPR: 240 KB in CPU0 & CPU1, 96 KB in CPU2 & CPU3: umbrella, see User's Manual
  • DSPR: 240 KB in CPU0 & CPU1, 96 KB in CPU2: default for 3/2 Cores/Checker Cores configuration (see Figure below for available DSPR address ranges).
  • DSPR: 160 KB in CPU0, 128 KB in CPU1, 96 KB in CPU2: reduced RAM variant of 3/2 Cores/Checker Cores configuration (see Figure below for available DSPR address ranges). AURIX™ TC38x variants

Datasheet addendum 15 v1.4 2019-06 OPEN MARKET VERSION

(96 KB) 4001 8000H 240/240/96/96 Core / Checker Core: DSPR Variant: 240/240/96 160/128/96 4010 0000H CPU3 PSPR (64 KB) 4011 0000H 5000 0000H CPU2 DSPR (96 KB) 5001 8000H 5010 0000H CPU2 PSPR (64 KB) 5011 0000H 6000 0000H CPU1 DSPR (240 KB)

6003 C000H

(64 KB) 6011 0000H 7000 0000H CPU0 DSPR (240 KB)

7003 C000H

(64 KB) 7011 0000H Reserved 4000 0000H 4001 8000H 4010 0000H 4011 0000H 5000 0000H CPU2 DSPR (96 KB) 5001 8000H 5010 0000H CPU2 PSPR (64 KB) 5011 0000H 6000 0000H CPU1 DSPR (240 KB) (64 KB) 6011 0000H 7000 0000H CPU0 DSPR (240 KB) (64 KB) 7011 0000H 4000 0000H 4001 8000H 4010 0000H 4011 0000H 5000 0000H CPU2 DSPR (96 KB) 5001 8000H 5010 0000H CPU2 PSPR (64 KB) 5011 0000H 6000 0000H CPU1 DSPR (128 KB) (64 KB) 6011 0000H 7000 0000H CPU0 DSPR (160 KB) 7002 8000H 7010 0000H CPU0 PSPR (64 KB) 7011 0000H Reserved Reserved Reserved CPU0 DSPR (80 KB) Reserved (112 KB) Reserved 6002 0000H Figure 2 DSPR variants ADC availability

  • Limitation on availability of ADC channels are caused by pin limitations. See Data Sheet for the pinning table of the package. AURIX™ TC38x variants

Datasheet addendum 16 v1.4 2019-06 OPEN MARKET VERSION

Revision history

V1.0 2018-06-08 • First release. V1.1 2018-08-06 • Added row "Reference Silicon" (needed e.g. for TC37x) to refer user to User's Manual Appx. V1.2 2019-02-04 • Removed from "Memory Maps" the description for LMU and DAM variations as these are not varied.

  • "Variant Tables": added SAL-TC387TP-128F300S V1.3 2019-03-01 • "About this document": reduced list of described Feature Package to the used ones.
  • "Memory Maps": added hint to understand ADC device specific differences.
  • "Variant Tables": changed Production Status of several devices.
  • "Variant Tables": clarified Total SRAM value is without cache memories. V1.4 2019-06-12 • Chapter 1: Added the TC38x AE step variants table.
  • Chapter 1 and 2: TC38x Ax step variants table format changed to fit all the contents.
  • Chapter 1 and 2:Added new row in the variant tables called "AMU" with the footnote for additional details.
  • Chapter: About this document: Feature package definitions are updated to consistent with the product naming nomenclature definition. AURIX™ TC38x variants

Datasheet addendum 17 v1.4 2019-06 OPEN MARKET VERSION

All referenced product or service names and trademarks are the property of their respective owners. Edition 2019-06 Published by Infineon Technologies AG

81726 Munich, Germany

© 2019 Infineon Technologies AG All Rights Reserved. Do you have a question about any aspect of this document? Email: erratum@infineon.com Document reference IFX-ume1559051479610 IMPORTANT NOTICE The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. WARNINGS Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury OPEN MARKET VERSION