TC1173-3.3VOA

TC1173 TELCOM | Alldatasheet

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Technical content

TC1173-2 2/2/00 TelCom Semiconductor reserves the right to make changes in the circuitry and specifications of its devices. GENERAL DESCRIPTION The TC1173 is a precision output (typically ±0.5%) CMOS low dropout regulator. Total supply current is typi- cally 50µA at full load (20 to 60 times lower than in bipolar regulators!). TC1173 key features include ultra low noise operation (plus optional Bypass input); very low dropout voltage (typically 240mV at full load) and internal feed-forward compensation for fast response to step changes in load. An error output (ERROR) is asserted when the TC1173 is out- of-regulation (due to a low input voltage or excessive output current). ERROR can be set as a low battery warning or as a processor RESET signal (with the addition of an external RC network). Supply current is reduced to 0.05µA (typical) and V OUT and ERROR fall to zero when the shutdown input is low. The TC1173 incorporates both over-temperature and over-current protection. The TC1173 is stable with an output capacitor of only 1µF and has a maximum output current of 300mA. 300mA CMOS LDO with Shutdown, ERROR Output and Bypass

FEATURES

I Extremely Low Supply Current for Longer Battery Life! I Very Low Dropout Voltage I Guaranteed 300mA Output I Standard or Custom Output Voltages I ERROR Output Can be Used as a Low Battery Detector or Processor Reset Generator I Power-Saving Shutdown Mode I Bypass Input for Ultra-Quiet Operation I Over-Current and Over-Temperature Protection I Space-Saving MSOP Package Option

APPLICATIONS

I Battery-Operated Systems I Portable Computers I Medical Instruments I Instrumentation I Cellular / GSM / PHS Phones I Linear Post-Regulator for SMPS I Pagers PIN CONFIGURATION VIN NC ERROR VOUT GND NC Bypass SHDN VIN NC ERROR VOUT GND NC Bypass SHDNTC1173VUA TC1173VOA MSOP SOIC

ORDERING INFORMATION

Number Package Temp. Range TC1173-xxVOA 8-Pin SOIC – 40 °C to +125°C TC1173-xxVUA 8-Pin MSOP – 40 °C to +125°C Available Output Voltages: xx indicates output voltages Other output voltages are available. Please contact TelCom Semiconductor for details. TYPICAL APPLICATION TC1173 4 5 VOUT Shutdown Control (from Power Control Logic) 1µF GND NC VIN NC SHDN Bypass C BYPASS 470pF (Optional) ERROR VIN ERROR

300mA CMOS LDO With Shutdown, ERROR Output, And Bypass TC1173-2 2/2/00 ABSOLUTE MAXIMUM RATINGS* J < 125°C *Absolute Maximum Ratings indicate device operation limits beyond dam- age may occur. Device operation beyond the limits listed in Electrical Characteristics is not recommended. ELECTRICAL CHARACTERISTICS: VIN = VOUT + 1V, IL = 0.1µA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless otherwise noted. BOLDFACE type specifications apply for junction temperatures of – 40°C to +125°C Symbol Parameter Test Conditions Min Typ Max Units VIN Input Operating Voltage — — 6.0 V IOUT MAX Maximum Output Current 300 ——m A VOUT Output Voltage Note 1 — V R ± 0.5% — V ∆VOUT /∆TV OUT Temperature Coefficient Note 2 — — — ppm/ °C ∆VOUT /∆VIN Line Regulation (V R + 1V) < VIN < 6V — 0.05 0.35 % ∆VOUT /VOUT Load Regulation I L = 0.1mA to IOUT MAX (Note 3) — 0.5 2.0 % VIN – VOUT Dropout Voltage (Note 4) I L = 0.1mA — 20 30 mV IL = 100mA 80 160 IL = 300mA 240 480 ISS1 Supply Current SHDN = V IH —5 0 90 µA ISS2 Shutdown Supply Current SHDN = 0V — 0.05 0.5 µA PSRR Power Supply Rejection Ratio F RE ≤ 1kHz — 60 — dB IOUT SC Output Short Circuit Current VOUT = 0V — 550 650 mA ∆VOUT ∆PD Thermal Regulation Note 5 — 0.04 — V/W eN Output Noise F = 1kHz, C OUT = 1µF, — 260 — nV/ √Hz R LOAD = 50Ω SHDN Input VIH SHDN Input High Threshold 45 —— % V IN VIL SHDN Input Low Threshold — — 15 %V IN ERROR Output VMIN Minimum Operating Voltage 1.0 — — V VOL Output Logic Low Voltage 1mA Flows to ERROR — — 400 mV VTH ERROR Threshold Voltage — 0.95 x V R —V VOL ERROR Positive Hysteresis Note 7 — 50 — mV NOTES: 1. VR is the user-programmed regulator output voltage setting. 2. TC VOUT = (VOUT MAX – VOUT MIN ) x 10 6 VOUT x ∆T 3. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 4. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. 5. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10msec. 6. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature, and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Thermal Considerations section of this data sheet for more details. 7. Hysteresis voltage is referenced to VR .

OUT falls to zero and ERROR is disabled. Figure 2. Note that ERROR is active when V below VTH , and inactive when VOUT is above VTH + VH . for at least 200msec to allow time for the system to stabilize. The TC1173 is a fixed output, low drop-out regulator. eration in RTC and CMOS RAM battery back-up applications).

2 GND Ground terminal

3 NC No connect

to this input further reduces output noise.

5 ERROR Out-of-Regulation Flag (Open Drain Out-

of-tolerance by approximately -5%. supply current is reduced to 0.05µA (typical).

7 NC No connect

IH, and shutdown (disabled) when SHDN is at or below VIL.

300mA CMOS LDO With Shutdown, ERROR Output, And Bypass TC1173-2 2/2/00 Bypass Input A 470pF capacitor connected from the Bypass input to ground reduces noise present on the internal reference, which in turn significantly reduces output noise. If output noise is not a concern, this input may be left unconnected. Larger capacitor values may be used, but results in a longer time period to rated output voltage when power is initially applied. Thermal Considerations Thermal Shutdown Integrated thermal protection circuitry shuts the regula- tor off when die temperature exceeds 150°C. The regulator remains off until the die temperature drops to approximately 140°C. Power Dissipation The amount of power the regulator dissipates is prima- rily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation: PD ≈ (VINMAX – VOUT MIN )ILOAD MAX Where: P D = worst case actual power dissipation VINMAX = maximum voltage on VIN VOUT MIN = minimum regulator output voltage ILOAD MAX = maximum output (load) current Equation 1. The maximum allowable power dissipation (Equation 2) is a function of the maximum ambient temperature (TAMAX ), the maximum allowable die temperature (125°C), and the thermal resistance from junction-to-air (/H9258JA). The 8-Pin SOIC package has a /H9258JA of approximately 160°C/Watt, while the 8-Pin MSOP package has a /H9258JA of approximately 200°C/Watt; both when mounted on a single layer FR4 dielectric copper clad PC board. PD MAX = (TJMAX – TAMAX ) /H9258JA Where all terms are previously defined. Equation 2. Equation 1 can be used in conjunction with Equation 2 to ensure regulator thermal operation is within limits. For example: GIVEN: V INMAX = 3.0V ± 10% VOUT MIN = 2.7V ± 0.5% ILOADMAX = 250mA TJMAX = 125°C TAMAX = 55°C /H9258JA = 200°C/W 8-Pin MSOP Package FIND: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD ≈ (VINMAX - VOUT MIN )ILOAD MAX = 155mW Maximum allowable power dissipation: PD ≈ (TJMAX – TAMAX ) /H9258JA = (125 – 55) 200 = 350mW In this example, the TC1173 dissipates a maximum of only 155mW; far below the allowable limit of 350mW. In a similar manner, Equation 1 and Equation 2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable V IN is found by substitut- ing the maximum allowable power dissipation of 350mW into Equation 1, from which V INMAX = 4.1V. Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower /H9258 JA and, therefore, increase the maximum allowable power dissipation limit.

300mA CMOS LDO With Shutdown, ERROR Output, And Bypass TC1173 TC1173-2 2/2/00 TYPICAL CHARACTERISTICS Output Noise FREQUENCY (KHz) Noise (µV/√/ HZ) 10.0 1.0 0.01 0.01 1 10 100 1000 0.1 0.0 R LOAD = 50Ω C OUT = 1µF 0.012 0.010 0.008 0.004 0.002 0.000 –0.002 –0.004 0.006 –40 –20 0 20 40 60 80 100 120 TEMPERATURE ( °C) Line Regulation LINE REGULATION (%) 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 0 50 100 150 200 250 300 LOAD CURRENT (mA) Dropout Voltage vs. Load Current DROPOUT VOLTAGE (V) Power Supply Rejection Ratio FREQUENCY (KHz) –30dB –35dB –40dB –45dB –50dB –55dB –60dB –65dB –70dB –75dB –80dB 100 1K 10K10 1M100K VOUT = 5V R LOAD = 50Ω VINAC = 50mV p-p C OUT = 1µF 100.0 90.0 70.0 80.0 50.0 40.0 60.0 –40 –20 0 20 40 60 80 100 120 TEMPERATURE ( °C) Supply Current SUPPLY CURRENT ( µA)PSRR (dB) 2.00 1.80 1.60 1.20 1.00 0.80 0.60 0.40 0.20 0.00 1.40 –40 –20 0 20 40 60 80 100 120 TEMPERATURE ( °C) Load Regulation LOAD REGULATION (%) 1 to 300mA 1 to 50mA 1 to 100mA 3.075 3.025 2.925 2.975 –40 –20 0 20 40 60 80 100 120 TEMPERATURE ( °C) VOUT vs. Temperature VOUT (V) 125°C 85°C 70°C 25°C 0°C –40°C VIN = 4V ILOAD = 100µA C LOAD = 3.3µF

300mA CMOS LDO With Shutdown, ERROR Output, And Bypass TC1173-2 2/2/00 TAPE AND REEL DIAGRAMS PIN 1 PIN 1 Component Taping Orientation for 8-Pin SOIC (Narrow) Devices User Direction of FeedUser Direction of Feed Standard Reel Component Orientation for TR Suffix Device Reverse Reel Component Orientation for RT Suffix Device W P Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin SOIC (N) 12 mm 8 mm 2500 13 in Carrier Tape, Number of Components Per Reel and Reel Size PIN 1 PIN 1 Component Taping Orientation for 8-Pin MSOP Devices User Direction of FeedUser Direction of Feed Standard Reel Component Orientation for TR Suffix Device Reverse Reel Component Orientation for RT Suffix Device W P Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin MSOP 12 mm 8 mm 2500 13 in Carrier Tape, Number of Components Per Reel and Reel Size

300mA CMOS LDO With Shutdown, ERROR Output, And Bypass TC1173 TC1173-2 2/2/00 PACKAGE DIMENSIONS Dimensions: inches (mm) Sales Offices TelCom Semiconductor, Inc.

1300 Terra Bella Avenue

P.O. Box 7267 Mountain View, CA 94039-7267 TEL: 650-968-9241 FAX: 650-967-1590 E-Mail: liter@telcom-semi.com TelCom Semiconductor, GmbH Lochhamer Strasse 13 D-82152 Martinsried Germany TEL: (011) 49 89 895 6500 FAX: (011) 49 89 895 6502 2 TelCom Semiconductor H.K. Ltd.

10 Sam Chuk Street, Ground Floor

San Po Kong, Kowloon Hong Kong TEL: (011) 852-2350-7380 FAX: (011) 852-2354-9957 .050 (1.27) TYP. 8° MAX. PIN 1 .244 (6.20) .228 (5.79) .157 (3.99) .150 (3.81) .197 (5.00) .189 (4.80) .020 (0.51) .013 (0.33) .010 (0.25) .004 (0.10) .069 (1.75) .007 (0.18) .050 (1.27) .016 (0.40) 8-Pin SOIC (Narrow) 8-Pin MSOP .122 (3.10) .114 (2.90) .122 (3.10) .114 (2.90) .043 (1.10) MAX. .006 (0.15) .002 (0.05) .016 (0.40) .010 (0.25) .197 (5.00) .189 (4.80) .008 (0.20) .005 (0.13) .028 (0.70) .016 (0.40) 6° MAX. .026 (0.65) TYP. PIN 1