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121www.exxelia.com General characteristics FEED-THRU Page revised 02/2 1

FEATURES

Discoidal Multilayer Ceramic Capacitors
Diameters: 0.053’’ (1.35 mm)– 0.6 1’’ (15.5 mm)
NPO and X7R dielectrics
Very low ESL
Capacitance range: 10pF to 12 µF
Voltage range: 25V DC to 1,000V DC PHYSICAL CHARACTERISTICS CONSTRUCTION Discoidal multilayer capacitors with Silver/Palladium/Plati- num terminations. Option T: central lead enables to get rid of thermal, me- chanical shocks and plating deterioration during soldering process. MARKING (on packaging) Series, capacitance value, tolerance, rated voltage, batch number. ELECTRICAL SPECIFICATIONS Description NPO X7R Operating temperature –55°C to +125°C –55°C to +125°C Maximum ∆C/C over temperature range without DC voltage applied NA ±15% Temperature coefﬁ cient (0±30)ppm/°C NA Climatic category 55 / 125 / 56 55 / 125 / 56 Dielectric withstanding voltage at 25°C 2.5 U RC for U RC ≤ 500V

1.5 U RC for U RC >500V

2.5 U RC for U RC ≤ 500V

Capacitance at 1MHz for C ≤ 1,000pF at 1kHz for C > 1,000pF at 1MHz for C ≤ 100pF at 1kHz for C > 100pF Dissipation factor at25°C ≤ 0.015 (150/C + 7)% at 1MHz for C ≤ 50pF ≤ 0.15% at 1MHz for 50pF < C ≤ 1,000pF ≤ 0.15% at 1kHz for C > 1,000pF ≤ 2.5% at 1MHz for C ≤ 100pF ≤ 2.5% at 1kHz for C > 100pF Insulation resistance at 25°C under U RC for U RC ≤ 500V under 500V for U RC > 500V ≥ 20,000MΩ for C ≤ 25nF ≥ 500MΩ. µF for C > 25nF ≥ 20,000MΩ for C ≤ 25nF ≥ 500MΩ. µF for C> 25nF Aging None ≤ 2.5% per decade hour BX and BR dielectrics available on request. Discoidal Capacitors TBC Series HOW TO ORDER TBC 2 81 W T 10nF 10% 100 V Series Dielectric code Exxelia size code RoHS compliant Central conductor Capacitance Tolerance Rated voltage TBC = discoidal capacitors 1 = NPO 2 = X7R - = No RoHS W = RoHS compliant -: no central lead T = Central lead requested Capacitance value in clear NPO: ±1% (Cap. value ≥ 27pF) ±2% (Cap. value ≥ 15pF) ±5% ±10% ±20% X7R: ±10% ±20% 25 V 50 V 100 V 150 V 200 V 250 V 300 V 500 V 1,000 V

120www.exxelia.com Taping : dimensions Page revised 02/2 1 Discoidal capacitors with NPO, X7R ceramics (BX and BR available on request) feature unique frequency performance due to very low inductance inherent to the conﬁ guration. They are ideally suited to interconnect power ampliﬁ er stages through a shielding wall (high impedance electronic circuits). Silver-palladium terminations can be directly mounted on the metal surface of the shielding wall. Multiple lines can be ﬁ ltered simultaneously using the BPM Series which con- sist of multiple capacitors in the same component. These capacitors can have the same or different values. EXXELIA expertise and ﬂ exible manufacturing processes enable a wide range of arrays: custom conﬁ guration or geometry. Consult our Engineering team to support your design requirements. Another version (option T) featuring central conductor conﬁ guration (illus- trated below) enables to get rid of thermal and mechanical shocks inherent to lead soldering. This also eliminates the risks of plating deterioration during the soldering process. At last 2 lines can be ﬁ ltered simultaneously using the BPM 12 or BPM 22 which consists of two capacitors in the same component (4 lines with the BPM24 or BPM224). These capacitors can have the same or different values (consult us). NPO: TYPICAL ATTENUATION CURVE VERSUS FREQUENCY (50Ω IMPEDANCE) X7R: TYPICAL ATTENUATION CURVE VERSUS FREQUENCY (50Ω IMPEDANCE) 1 0 2 0 3 0 4 0 5 0 6 0 7 0 0.001 0.01 0.1 1 10 100 Attenuation (dB) Frequency (GHz) 1 0 2 0 3 0 4 0 5 0 6 0 7 0 0.01 0.1 1 10 100 1000 Attenuation (dB) Frequency (MHz) Ag -Pd t er min atio n Ø 0,8 General Information

8www.exxelia.com Page revised 02/2 1 Taping : dimensions MLCC STRUCTURE Terminations Ceramic Tin Tin / Lead Gold (Solderable layer) Electrodes Margins Silver or Silver / Palladium (electrodes contact layer) Polymer (crack protection layer) Nickel or Copper barrier (leaching protection layer) EQUIVALENT CIRCUIT Capacitor is a complex component combining resistive, inductive and capaci- tive phenomena. A simpliﬁ ed schematic for the equivalent circuit is: Ls Rs C IR DIELECTRIC CHARACTERISTICS Insulation Resistance (IR) is the resistance measured under DC voltage across the terminals of the capacitor and consists principally of the parallel resistance shown in the equivalent circuit. As capacitance values and hence the area of dielectric increases, the IR decreases and hence the product (C x IR) is often speciﬁ ed in Ω.F or MΩ. µF. The Equivalent Series Resistance (ESR) is the sum of the resistive terms which generate heating when capacitor is used under AC voltage at a given frequency (f). Dissipation factor (DF) is the ration of the apparent power input will turn to heat in the capacitor: DF = 2π f C ESR When a capacitor works under AC voltage, heat power loss (P), expressed in Watt, is equal to: P = 2π f C Vrms 2 DF The series inductance (Ls) is due to the currents running through the elec- trodes. It can distort the operation of the capacitor at high frequency where the impedance (Z) is given as: Z = Rs + j (Ls.q - 1⁄(C.q)) with q = 2πf When frequency rises, the capacitive component of capacitors is gradually canceled up to the resonance frequency, where : Z = Rs and LsC.q 2 = 1 Above this frequency the capacitor behaves like an inductor. P100 NPO N2200 (C4xx) BX 2C1 X7R Dielectric material Porcelain Magnesium titanate or Neodynium baryum titanate Barium zirconate titanate Baryum titanate (BaTiO 3 ) Dielectric constant 15 – 18 20 – 85 450 2,000 – 5,000 Electrode technology PME (Precious Metal Electrodes): Ag/Pd Capacitance variation between –55°C and +125/°C without DC voltage (100±30)ppm/°C (0±30)ppm/°C (–2,200±500) Capacitance variation between –55°C and +125/°C with DC rated voltage 0 -15% 15% –25% 20% –30% Not applicable Piezo-electric effect None None Yes Dielectric absorption None Few % Few % Thermal shock sensitive + + ++ Ceramic Capacitors Technology

9www.exxelia.com Page revised 02/2 1 General characteristics GENERAL INFORMATION Ceramic Capacitors Technology MANUFACTURING STEPS SLIP CASTING ELECTRODE SCREEN PRINTING STACKING A slurry, a mix of ceramic powder, binder and solvents, is poured onto conveyor belt inside a drying oven, resulting in a dry ceramic sheet. The electrode ink, made from a metal powder mixed with solvents, is printed onto the ceramic sheets using a screen printing process. The sheets with electrode printed are stacked to create a multilayer structure. TERMINATIONS SINTERING PRESSING Each terminal of the capacitor is dipped in the termination ink, mix of metal powder, solvents and glass frit and the parts are ﬁ red in an oven. The parts are sintered in an oven with a precise temperature proﬁ le which is very important to the characteristics of the capacitors. Pressure is applied to the stack to fuse all the separate layers, this created a monolithic structure. TERMINATIONS PLATING FINAL TESTING PACKAGING Stacking + leads soldering + encapsulation (see pages 10-11)

10www.exxelia.com Page revised 02/2 1 Taping : dimensions SMD TERMINATIONS NON RoHS COMPLIANT Code RoHS COMPLIANT Code Magnetic Recommended mounting process Storage (months)*Epoxy bonding Iron soldering Wave soldering Vapor phase soldering Infrared soldering Wire bonding Ag Q Ag QW / P No •••• 18 Ag/Pd/Pt - Ag/Pd/Pt W / A No ••• 24 Ag + Ni + dipped Sn/Pb Ag/Pd/Pt + dipped Sn/Pb 60/40 H Ag/Pd/Pt + dipped Sn HW No • 24 Ag + Ni + electrolytic Sn/Pb 95/5 C Ag + Ni + electrolytic Sn CW / S Yes •••• 18 Ag + Ni + electrolytic Sn/Pb 60/40 D - - Yes •••• 18 - - Ag + Cu + electrolytic Sn Ag + Ni + dipped Sn/Pb 60/40 E Ag + Ni + electrolytic Sn EW Yes •• 24 Ag + Ni + Au G Ag + Ni + Au GW Yes •••••• 36 Ag + Polymer + Ni + Sn/Pb YC Ag + Polymer + Ni + Sn YCW Yes •••• 18 Ag + Polymer + Ni + Sn/Pb YD - - Yes •••• 18 Ag + Polymer + Ni + Au YG Ag + Polymer Nickel (Ni) or Copper (Cu) barriers amplify thermal shock and are not recommended for chip sizes larger than 3030. * Storage must be in a dry environment at a temperature of 20°C with a relative humidity below 50%, or preferably in a package enclosing a desiccant. Maintenance only. * Non magnetic chips series only. SMD ENVIRONMENTAL TESTS Ceramic chip capacitors for SMD are designed to meet test requirements of CECC 32100 and NF C 93133 standards as speciﬁed below in compliance with NF C 20700 and IEC 68 standards:

Solderability: NF C 20758, 260°C, bath 62/36/2.
Adherence: 5N force.
Vibration fatigue test: NF C 20706, 20 g, 10 Hz to 2,000 Hz, 12 cycles of 20 minutes each.
Rapid temperature change: NF C 20714, –55°C to + 125°C, 5 cycles.
Combined climatic test: IEC 68-2-38.
Damp heat: NF C 20703, 93 %, H.R., 40°C.
Endurance test: 1,000 hours, 1.5 U RC , 125°C. STORAGE OF CHIP CAPACITORS TINNED OR NON TINNED CHIP CAPACITORS Storage must be in a dry environment at a temperature of 20°C with a relative humidity below 50 %, or preferably in a packaging enclosing a desiccant. STORAGE IN INDUSTRIAL ENVIRONMENT:
2 years for tin dipped chip capacitors,
18 months for tin electroplated chip capacitors,
2 years for non tinned chip capacitors,
3 years for gold plated chip capacitors. STORAGE IN CONTROLLED NEUTRAL NITROGEN ENVIRONMENT:
4 years for tin dipped or electroplated chip capacitors,
4 years for non tinned chip capacitors,
5 years for gold plated chip capacitors. Storage duration should be considered from delivery date and not from batch manufacture date. The tests carried out at ﬁnal acceptance stage (solderabili- ty, susceptibility to solder heat) enable to assess the compatibility to surface mounting of the chips. User Guide

11www.exxelia.com Page revised 02/2 1 General characteristics GENERAL INFORMATION User Guide SURFACE MOUNTING DIL LEADS P style PL style L style J style RIBBON LEADS Micro-strip (type 1) Short Micro-strip (type 1S) Axial (Type 2) Radial (Type 3) R style RX style RJ style Please contact Exxelia sales for any lead conﬁ guration not shown. TROUGH-HOLE MOUNTING AXIAL AND RADIAL Radial leads (Type 6) Radial leads (4 leads) Axial leads (Type 7) DIL leads: N style ENCAPSULATION STYLES Ceramic encapsulation (selfprotected) Varnish Conformal coating Molding LEAD STYLES

12www.exxelia.com Page revised 02/2 1 Taping : dimensions SOLDERING ADVICES FOR REFLOW SOLDERING Dimensions in inches (in mm) Reﬂow soldering Wave soldering I 1 I 2 I 3 I 1 I 2 I 3 User Guide Large chips above size 2225 are not recommended to be mounted on epoxy board due to thermal ex- pansion coefﬁcient mismatch between ceramic ca- pacitor and epoxy. Where larger sizes are required, it is recommended to use components with ribbon or other adapted leads so as to absorb thermo-me- chanical strains. RECOMMENDED FOOTPRINT FOR SMD CAPACITORS Ceramic is by nature a material which is sensitive both thermally and mechan- ically. Stresses caused by the physical and thermal properties of the capaci- tors, substrates and solders are attenuated by the leads. Wave soldering is unsuitable for sizes larger than 2220 and for the higher ends of capacitance ranges due to possible thermal shock (capacitance values giv- en upon request). Infrared and vapor phase reﬂow, are preferred for high reliability applications as inherent thermo-mechanical strains are lower than those inherent to wave soldering. Whatever the soldering process is, it is highly recommended to apply a thermal cycle, see hereafter our recommended soldering proﬁle: Preheat zone 100 150 200 250 0 12 3 4 5 Time (min) Temperature (°C) 215°C 250°C 20°C >50°C/s Natural cool down RoHS No RoHS 0 100 150 200 250Temperature (°C) 0 12 3 4 5 Time (min) 20°C 215°C-225°C 245°C-255°C Natural cool down RoHS No RoHS 100 150 200 250 0 12 3 4 Time (min) Temperature (°C) 20°C 300 250°C 280°C Natural cool down RoHS No RoHS RECOMMENDED VAPOR PHASE REFLOW PROFILE RECOMMENDED IR REFLOW PROFIL RECOMMENDED WAVE SOLDERING PROFILE SOLDERING ADVICES FOR IRON SOLDERING Attachment with a soldering iron is discouraged due to ceramic brittleness and the process control limitations. In the event that a soldering iron must be used, the following precautions should be observed:

Use a substrate with chip footprints big enough to allow putting side by side one end of the capacitor and the iron tip without any contact between this tip and the component,
place the capacitor on this footprint,
heat the substrate until the capacitor’s temperature reaches 150°C minimum (preheating step, maximum 1°C per second),
place the hot iron tip (a ﬂat tip is preferred) on the footprint without touching the capacitor. Use a regulated iron with a 30 watts maximum power. The recommended temperature of the iron is 270 ±10°C. The tem- perature gap between the capacitor and the iron tip must not exceed 120°C,

13www.exxelia.com Page revised 02/2 1 General characteristics GENERAL INFORMATION

leave the tip on the footprint for a few seconds in order to increase locally the footprint’s temperature,
use a cored wire solder and put it down on the iron tip. In a preferred way use Sn/Pb/Ag 62/36/2 alloy,
wait until the solder ﬁ llet is formed on the capacitor’s termination,
take away iron and wire solder,
wait a few minutes so that the substrate and capacitor come back down to the preheating temperature,
solder the second termination using the same procedure as the ﬁ rst,
let the soldered component cool down slowly to avoid any thermal shock. PACKAGING TAPE AND REEL The ﬁ lms used on the reels correspond to standard IEC 60286-3. Films are de- livered on reels in compliance with document IEC 286-3 dated 1991. Minimum quantity is 250 chips. Maximum quantities per reel are as follows:
Super 8 reel - Ø 180: 2,500 chips.
Super 8 reel - Ø 330: 10,000 chips.
Super 12 reel - Ø 180: 1,000 chips. Reel marking complies with CECC 32 100 standard:
Model.
Rated capacitance.
Capacitance tolerance.
Rated voltage.
Batch number. User Guide Sizes Nr. of chips/ package Oriented chips Dimensions in inches (in mm) A B C D E DIMENSIONAL CHARACTERISTICS OF CHIPS TRAY PACKAGES HIGH Q CAPACITORS TAPE AND REEL PACKAGING SPECIFICATIONS Chips tray depth: C E E A D D B TRAY PACKAGES Sizes Type (1) W ±0.3 inches (mm) F ±0.05 inches (mm) P1 ±0.1 inches (mm) T max. inches (mm) Reel Size inches (mm) Quantity per Reel (1): Horizontal (H) or Vertical (V) orientation in cavities.

14www.exxelia.com Page revised 02/2 1 Taping : dimensions EIA STANDARD CAPACITANCE VALUES Following EIA standard, the values and multiples that are indicated in the chart below can be ordered. E48, E96 series and intermediary values are available upon request. (± 20%) E12 (± 10%) E24 (± 5%) 10 10 12 12 15 15 18 18 22 22 27 27 33 33 39 39 47 47 56 56 68 68 82 82 EIA CAPACITANCE CODE The capacitance is expressed in three digit codes and in units of pico Farads (pF). The ﬁrst and second digits are signiﬁcant ﬁgures of the capacitance value and the third digit identiﬁes the multiplier. For capacitance value < 10pF , R designates a decimal point. See examples below: EIA code Capacitance value in pF in nF in µF 2R2 2.2 0.0022 0.0000022 6R8 6.8 0.0068 0.0000068 220 22 0.022 0.000022 470 47 0.047 0.000047 181 180 0.18 0.00018 2 21 220 0.22 0.00022 102 1,000 1 0.001 272 2,700 2.7 0.0027 123 12,000 12 0.012 683 68,000 68 0.068 124 120,000 120 0.12 564 560,000 560 0.56 335 3,300,000 3,300 3.3 825 8,200,000 8,200 8.2 156 15,000,000 15,000 15 686 68,000,000 68,000 68 107 100,000,000 100,000 100 227 220,000,000 220,000 220 PART MARKING VOLTAGE CODES Use the following voltage code chart for part markings: Voltage (V) Code Letter code 25 250 A 40 400 B 50 500 C 63 630 D 100 101 E 200 201 G 250 251 H 400 401 K 500 501 L 1,000 102 M 2,000 202 P 3,000 302 R 4,000 402 S 5,000 502 T 7 ,500 752 U 10,000 103 W PART MARKING TOLERANCE CODES Use the following tolerance code chart for part markings: Tolerance Letter code ±0.25pF CU ±0.5pF DU ±1pF FU ±1% F ±2% G ±5% J ±10% K ±20% M User Guide

15www.exxelia.com Page revised 02/2 1 General characteristics GENERAL INFORMATION RELIABILITY LEVELS Exxelia proposes different reliability levels for the ceramic capacitors for both NPO and X7R ceramics. ÆÆ Æ ÆÆ Æ Æ ¬¬¬¬Æ ¬¬¬Æ ¬¬Æ ÆÆ Æ ÆÆ Æ ÆÆÆÆ CECC EXXELIA TECHNOLOGIES chips capacitors are qualiﬁed according to CECC32101-801 100% electrical and visual control

Voltage proof
Insulation Resistance
Capacitance value
Dissipation factor IN PROCESS control According ESCC n°3009/3001 Documentation: according ESCC n°3009/3001 Chart F2 According ESCC n°3009/3001 Rapid Change of Temperature 5 cycles –55°C +125°C Damp Heat 85°C • 85 % RH 240 h • 1.5 V On 40 parts Standard Only for rated voltage <500V F T5 CoC Standard CoC CoC F CoC ESA ESCC EXXELIA TECHNOLOGIES chips capacitors are qualiﬁed (QPL) according to ESCC n°3009 (chips) and ESCC n°3001 (leaded) Level FM Rapid Change of Temperature 10 cycles –55°C +125°C Burn-in (100% control) 168 h, 125°C, 1.5 Un Solderability Test On 10 parts Chart F3 According ESCC n°3009/3001 User Guide

16www.exxelia.com Page revised 02/2 1 Taping : dimensions As the world’s leading manufacturer of speciﬁ c passive components, we stand apart through our ability to quickly evaluate the application speciﬁ c engineering challenges and provide a cost-effective and efﬁ cient solutions. For requirements that cannot be met by catalog products, we offer leading edge solutions in custom conﬁ guration: custom geometries, packaging, characteristics, all is possible thanks to our extensive experience and robust development process, while maintaining the highest level of reliability. Where necessary, special testing is done to verify requirements, such as low dielectric absorption, ultra-high insulation resistance, low dissipation factor, stability under temperature cycling or under speciﬁ ed environmental conditions, etc. HIGH CAPACITANCE

High energy density
Specific case sizes
Specific shape of connections (high resistance to vibrations) HIGH TEMPERATURE
Up to 250°C
Specific shape of connections
2,000 hours life time
HMP soldering OTHERS
Screen printed resistors
Complex components
Full functions available HIGH VOLTAGE
Up to 50 kV
Specific circular shape

4www.exxelia.com Page revised 02/2 1 Taping : dimensionsGeneral Information MATERIALS EXPERT For 50 years and as a market leader, EXXELIA’s comprehensive knowledge of the materials properties and performances have enabled us to design capaci- tors in Porcelain, NPO, BX, 2C1, BP , X7R and –2200ppm/°C ceramics. CUSTOM DESIGNS Our catalog products don’t meet your application? Based on the valuable experience accumulated over the design of 2,000+ spe- ciﬁc ceramic capacitors, you can trust EXXELIA to deﬁne a qualitative custom solution in a time effective manner. NO OBSOLESCENCE Choosing a standard or custom EXXELIA product means you won’t have to wor- ry about obsolescence. TYPICAL APPLICATIONS

Aerospace & Defense: cockpit panels, ﬂight control, radio systems, missile guidance systems…
Space: military and commercial satellites, launcher…
Medical: MRI, external deﬁbrillators, implantable devices…
Telecommunications: base stations…
Oil and gas: drilling tools, MWD, LWD, wellheads… ISO 9001 AND AS9100C Quality is at the core of Exxelia’s corporate culture. Each sites has its own cer- tiﬁcations. CERTIFICATIONS Capacitors manufactured by EXXELIA comply with American and European standards and meet the requirements of many international standards. For Space qualiﬁed parts (ESA QPL), please refer to our catalog «Ceramic ca- pacitors for Space applications». QUALITY & RELIABILITY EXXELIA is committed to design and manufacture high quality and reliability products. The test cycles reproducing the most adverse operating conditions over extended periods (up to 10 000 hours) have logged to date well over 5.10 hours/°Component. Failure rate data can be provided upon request. CONFLICT MINERALS EXXELIA is committed to an approach based on «Conﬂict Minerals Compli- ance». This US SEC rule demands complete traceability and a control mecha- nism for the mineral procurement chain, encouraging importers to buy only «certiﬁed» ore. We have discontinued relations with suppliers that procure from the Demo- cratic Republic of the Congo or an adjoining country. ENVIRONMENT EXXELIA is committed to applying a robust environmental policy, from product design through to shipment. To control its environmental footprint and recon- cile this with the company’ functional imperatives, our environmental policy provides for the reduction or elimination of hazardous substances. We also focus on compliance with European Union directives and regulations, notably REACH and RoHS. RoHS COMPLIANCY SMD CAPACITORS The capacitor terminations are generally protected by a nickel barrier formed by electrolytic deposit. This barrier gives chip capacitors leaching performance far exceeding the requirements of all applicable standards. The nickel barrier guarantees a minimum resistance to soldering heat for a period of 1 minute at 260°C in a tin-lead (60/40) or tin-lead-silver (62/36/2) bath without noticeable alteration to the solderability. It also allows repeated soldering-unsoldering and the longer soldering times required by reﬂow techniques. However nickel barrier ampliﬁes thermal shock and is not recommended for chip sizes equal or greater than CNC Y (30 30) - (C 282 to C 288 - CNC 80 to CNC 94). LEADED COMPONENTS As well as for SMD products, leaded capacitors ranges can also be RoHS. These products, which are characterized by the sufﬁx «W» added to the commercial type, are naturally compatible with the soldering alloys used in RoHS mounting technology. The connections coating is generally an alloy SnAg (with a maxi- mum of 4% Ag). However, on a few products that EXXELIA will precise on re- quest, the coating is pure silver. 10 - 60 µm Metallization Silver-Palladium (or Silver) Nickel barrier Tinning: Tin-Lead No RoHs Pure Tin RoHS (W) CerUflex (polymer) 2 - 3 µm 3 - 8 µm

Product Information

TBC specifications and overview.

Summary

Discoidal Capacitors revised 02/21

Description

Discoidal Capacitors revised 02/21

Source title TBC Datasheet(PDF) - Exxelia Group

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