TB2996HQ TOSHIBA | Alldatasheet

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Bi-CMOS Linear Integrated Circuit Silicon Monolithic TB2996HQ Maximum Power 49 W BTL × 4ch Audio Power Amp IC 1. Description The TB2996HQ is a power IC with built-in four -channel BTL amplifier developed for car audio applicatio n. Th e maximum output power POUT is 49 W using a pure complementary P-ch and N-ch DMOS output stage. In addition, a standby switch, a mute function , output offset voltage detector and various protection features are included. 2. Applications Power Amp IC developed for car audio applications. 3. Features  High output power, low distortion, and low noise property (for details, refer to the Table 1 Typical Characteristics).

  • Built-in detecting output offset voltage and shorted to GND (Pin25)
  • Built-in muting function. (Pin22)
  • Built-in auto muting functions (for low Vcc and stand-by sequence)
  • Built-in standby switch. (Pin4)
  • Built-in 6v operation and start stop cruising circuit
  • Built-in various protection circuits (thermal shut down, over-voltage, short to GND, short to VCC, and output to output short) Note1: Typical test conditions : V CC = 13.2 V, f = 1 kHz, RL = 4 Ω, GV = 26 dB, Ta = 25°C; unless otherwise specified. Note2: Rg = signal source resistance Weight: 7.7 g (typ.) Table 1 Typical Characteristics (Note1) Test condition Typ. Unit Output power (POUT) VCC = 15.2 V, JEITA max 49 W VCC = 14.4V, JEITA max 44 VCC = 14.4V,THD = 10% 29 THD = 10% 24 Total harmonic distortion (THD) POUT = 4 W 0.006 % Output noise voltage (VNO) (Rg = 0 Ω) Filter : DIN AUDIO 50 µV Operating Supply voltage range (VCC) RL = 4 Ω 6～18 V RL = 2 Ω 6～16
  1. Block Diagram Some of the functional blocks, circuits or constants labels in the block diagram may have been omitted or simplified for clarity. In the following explanation, a "channel" is a circuit which consists of INx, OUTx (+), OUTx (-), and PW-GNDx. (x:1 to 4) 10 6 20 Ripple VCC2 VCC1 3900 µF 0.1 µF 10 µF 4 25 Offset/Short DET LPF VCC VMUTE STBY OUT1 (+) 11 C1: 0.22 µF

8 PW-GND1

OUT1 (−) IN1 OUT2 (+) 12

2 PW-GND2

OUT2 (−) IN2 OUT3 (+) 15 PW-GND3 OUT3 (−) IN3 OUT4 (+) 14

24 PW-GND4

OUT4 (−) IN4 C6: 1 µF RL = 4Ω Pre-GND AC-GND C1: 0.22 µF C1: 0.22 µF C1: 0.22 µF RL = 4Ω RL = 4Ω RL = 4Ω AC-GND AC-GND AC-GND AC-GND TAB 5 V Play MUTE C4: 1 µF R1: 47 kΩ

  1. Pin Configuration and Function Descriptions

5.1 Pin Configuration (top view)

OUT4(－) MUTE OUT4(＋) VCC1 OUT3(－) PW-GND3 OUT3(＋) AC-GND IN3 IN4 Pre－GND IN2 IN1 Ripple OUT１(＋) PW-GND1 OUT1(－) VCC2 OUT2(＋) STBY OUT2(－) PW-GND2 TAB

5.2 Pin Function Descriptions

Pin Symbol I/O Description

1 TAB ― Ground (TAB)

2 PW-GND2 ― Ground for OUT2

3 OUT2(-) OUT OUT2(-) output

4 STBY VST-IN Standby voltage input

5 OUT2(+) OUT OUT2(+) output

6 VCC2 VCC-IN Supply voltage 2

7 OUT1(-) OUT OUT1(-) output

8 PW-GND1 ― Ground for OUT1

9 OUT1(+) OUT OUT1(+) output

10 Ripple ― Ripple voltage

11 IN1 IN OUT1 input

12 IN2 IN OUT2 input

13 Pre-GND ― Signal ground

14 IN4 IN OUT4 input

15 IN3 IN OUT3 input

16 AC-GND ― Common reference voltage for all input

17 OUT3(+) OUT OUT3(+) output

18 PW-GND3 ― Ground for OUT3

19 OUT3(-) OUT OUT3(-) output

20 VCC1 VCC-IN Supply voltage 1

21 OUT4(+) OUT OUT4(+) output

22 MUTE VmuteIN Mute voltage input

23 OUT4(-) OUT OUT4(-) output

24 PW-GND4 ― Ground for OUT4

25 DET (OC) Note1 Offset detector output / Out to GND short detector

Note1：OC means are open collector output

  1. Functional Description Component Name Recommended Value Pin Purpose Effect (Note1) Lower than Recommended Value Higher than Recommended Value C1 0.22 μF INx (x:1 to 4) To eliminate DC Cut-off frequency becomes higher Cut-off frequency becomes lower C2 10 μF Ripple To reduce ripple Turn on/off time shorter Turn on/off time longer C3 0.1 μF VCC1, VCC2 To provide sufficient oscillation margin Reduces noise and provides sufficient oscillation margin C6 1 μF AC-GND Common reference voltage for all input Pop noise is suppressed when C1: C6 = 1:4. (Note2) C5 3900 μF VCC1, VCC2 Ripple filter Power supply ripple filtering R1 / C4 47kΩ / 1 μF MUTE Mute ON/OFF Smooth switching Pop noise becomes larger Switching time becomes longer Note1: When the unrecommended value is used, please examine it enough by system evaluation. Note2: Since “AC-GND” pin is a common reference voltage for all input, this product needs to set the ratio of an input capacitance (C1) and the AC-GND capacitance (C6) to 1:4 Note3: Use the low leak current capacitor for C1 and C6. 10 6 20 Ripple VCC2 VCC1 3900 µF 0.1 µF 10 µF 4 25 Offset/Short Det LPF VCC VMUTE STBY OUT1 (+) 11 C1: 0.22 µF

OUT1 (−) IN1 OUT2 (+) 12 OUT2 (−) IN2 OUT3 (+) 15 PW-GND3 OUT3 (−) IN3 OUT4 (+) 14 OUT4 (−) IN4 C6: 1 µF RL = 4 Ω Pre-GND AC-GND C1: 0.22 µF C1: 0.22 µF C1: 0.22 µF RL = 4 Ω RL = 4 Ω RL = 4 Ω AC-GND AC-GND AC-GND AC-GND TAB 5 V Play MUTE C4: 1 µF R1: 47 kΩ

  1. Mute Function (pin 22) The audio mute function is enabled by setting pin 22 Low. R1 and C4 determine the time constant of the mute function. The time constant affects pop noise generated when power or the mute function is turned on or off; thus, it must be determined on a per-application basis. (Refer to Figures 3 and 4.) The value of the external pull-up resistor is determined, based on pop noise value. For example : when the control voltage is changed from 5V to 3.3V, the pull-up resistor should be: 3.3V/5V×47 kΩ=31kΩ Figure 3 Mute Function Figure 4 Mute Attenuation − VMUTE (V) 22 1 kΩ 5 V Mute ON/OFF control Pin 22 Control voltage : VMUTE (V) ATT – VMUTE Mute attenuation ATT (dB )
  1. Auto Muting Functions The TB2996HQ has two automatic mute function. a) Low Vcc Mute b) Stand-by Off Mute.

9.1 Low Vcc Mute

When the supply voltage became lower than about 5.5V (Typ), The TB2996HQ operates the mute circuit automatically. This function prevents the large audible transient noise which is generated by low Vcc

9.2 Standby-Off Mute

The TB29 96HQ operates the mute circuit during th e standby -off transition. When the ripple voltage reached Vcc/5, the standby-off mute is terminated. The external mute has to be ON till the internal mute-OFF. Figure 5 standby-Off Mute Standby OFF Ripple voltage Vcc/5 → Ripple terminal voltage Standby Off transition (Mute-ON) Tmute＜500ms Vcc=13.2V Normal operation (mute-OFF) t

  1. Output DC Offset Detection

10.1 Offset circuit explanation

Offset Circuit This function detects the offset voltage between OUT(+) and OUT(-). The detection result is gotten by pin25. The result of detection does not judge the abnormal offset or not. This function detects only the offset voltage which is decided by specification.

10.2 Outputshort detector

TB2996HQ has output shorting detector. In case of shorting output to VCC/GND or over voltage power supplied, NPN transistor is turned on. In case of shorting output to output NPN Tr. is turned on and off in response to the input signal voltage. Figure 6 The detected result and audio output waveform Offset detector output pin 1 VTH -VTH Output waveform Waveform LPF output Irregular offset occurred Volume down Judgement Waiting time for Prevention misjudgement Detection delay time t VST VST Vref Elec. vol 5 V LPF To a microcontroller V Negative DC offset (−) (caused by RS2) Positive DC offset (+) (caused by RS1) VCC/2 (normal DC voltage) Leakage current or short-circuit Vbias Vref/2 A B RS2 RS1 The microcontroller shuts down the system if the output is lower than the specified voltage.

  1. Protection Functions This product has internal protection circuits such as thermal shut down, over -voltage, out to V CC, out to GND, and out to out short circuit protections. (1) Thermal shut down It operates when junction temperature exceeds 150°C (typ.). When it operates, it is protected in the following order. 1. An Attenuation of an output starts first and the amount of attenuation also increases according to a temperature rising, 2. All outputs become in a mute state, when temperature continues rising in spite of output attenuation. 3. Shutdown function starts, when a temperature rise continues though all outputs are in a mute state. In any case if temperature falls, it will return automatically. (2) Over-voltage It operates when voltage exceeding operating range is supplied to V CC pin. If voltage falls, it will return automatically. When it operates, all outputs bias and high-side switch are turned off and all outputs are intercepted. Threshold voltage is 23V(Typ.) (3) Short to VCC, Short to GND, Output to output short It operates when each output pin is in irregular connection and the load line goes over the SOA of power transistor (DMOS). When it operates, all outputs bias circuits are turned off and all outputs are intercepted. If irregular connection is canceled, it will return automatically. Note 1: When the current phase shifts widely, the protection will operate for the capacitor etc are connected with the output. Please confirmation to use enough by using your testing board etc.
  1. Absolute Maximum Ratings (Ta = 25°C unless otherwise specified) Characteristics Condition Symbol Rating Unit supply voltage (surge) max0.2s VCC (surge) 50 V supply voltage (DC) VCC (DC) 25 V supply voltage (operation) VCC (opr) 18 V output current (peak) IO (peak) 9 A power dissipation (Note) PD 125 W Operating temperature range Topr -40 to 85 °C Storage temperature Tstg -55 to 150 °C Note: Package thermal resistance Rth(j-t) = 1°C/W (typ.) (Ta = 25°C, with infinite heat sink) The absolute maximum ratings of a semiconductor device are a set of specified parameter values , which must not be exceeded during operation, even for an instant. If any of these rating would be exceeded during operation, the device electrical characteristics may be irreparably altered and the reliability and lifetime of the device can no longer be guaranteed . Moreover, these operations with exceeded ratings may cause break down, damage, and/or degradation to any other equipment . Applications using the device should be designed such that each maximum rating will never be exceeded in any operating conditions. Before using, creating, and/or producing designs, refer to and comply with the precautions and conditions set forth in this document.

12.1 Power Dissipation

  1. Operating Ranges Characteristics Symbol Condition Min Typ Max Unit Supply voltage VCC RL=4Ω 6 --- 18 V RL=2Ω 6 --- 16 V Ambient Temperature Ta ( °C) PD (max) – Ta Allowable Power Dissipation PD (MAX)（W） (1) (2) (3) 25 0 150 120 100 100 50 125 (1) Infinite heat sink Rth(j-t) = 1°C/W (2) Heat sink (Rth(HS) = 3.5°C/W) Rth(j-t) + Rth(HS) = 4.5°C/W (3) No heat sink Rth(j-a) = 39°C/W
  1. Electrical Characteristics (V CC = 13.2 V, f = 1 kHz, RL = 4 Ω, Ta = 25°C unless otherwise specified) Characteristics Symbol Test Condition Min Typ. Max Unit Quiescent supply current ICCQ VIN = 0 ― 200 320 mA Output power POUT MAX (1) VCC = 15.2 V, MAX POWER ― 49 ― W POUT MAX (2) VCC = 14.4 V, MAX POWER ― 44 ― POUT MAX (3) VCC = 13.7 V, MAX POWER ― 40 ― POUT (1) VCC = 14.4 V, THD = 10% ― 29 ― POUT (2) THD = 10% 21 24 ― Output power(RL=2Ω) POUT MAX (4) VCC = 14.4 V, MAX POWER ― 80 ― W POUT MAX (5) VCC = 13.7 V, MAX POWER ― 73 ― POUT (3) VCC = 14.4 V, THD = 10% 46 POUT (4) THD = 10% ― 45 ― Total harmonic distortion THD POUT = 4 W ― 0.006 0.07 % Voltage gain GV VOUT = 0.775 Vrms 25 26 27 dB Channel-to-channel voltage gain ∆GV VOUT = 0.775 Vrms −1.0 0 1.0 dB Output noise voltage VNO Rg = 0 Ω, BW=20Hz to 20KHz ― 50 70 µV Ripple rejection ratio R.R. fRIP = 100 Hz, Rg = 620 Ω (note1) VRIP = 0.775 Vrms 60 70 ― dB Crosstalk C.T. Po = 4W, Rg = 620 Ω, ― 80 ― dB Output offset voltage VOFFSET ― −90 0 90 mV Input resistance RIN ― ― 90 ― kΩ Standby current ISTBY VSTB = 0V,V22=0 ― 0.01 1 µA Mute attenuation ATT M MUTE: ON VOUT = 7.75 Vrms → MUTE: OFF 85 100 ― dB Standby control voltage VSB H POWER : ON 2.2 ― VCC V VSB L POWER : OFF 0 ― 0.9 Mute control voltage VM H MUTE : OFF 2.2 ― VCC V VM L MUTE : ON , R1 = 47 kΩ 0 ― 0.9 Offset detection threthold voltage Vosdet Rpull-up = 47 kΩ, +V= 5.0 V Reference of Vout DC voltage ±1.0 ±1.5 ±2.0 V Terminal 25 saturation voltage P25-Sat Rpull-up = 10 kΩ, +V = 5.0 V P25 is LOW at the detective.  100 500 mV Note 1 : fRIP : repple frequency Note2： VRIP : Ripple signal voltage ( AC fluctuations in the power supply )
  1. Test Circuit components in the test circuit are only used to determine the device characteristics. It is not guaranteed that the system will work properly with these components. 10 6 20 Ripple VCC2 VCC1 3900 µF 0.1 µF 10 µF 4 25 Offset/Short Det LPF VCC VMUTE STBY OUT1 (+) 11 C1: 0.22 µF

OUT1 (−) IN1 OUT2 (+) 12 OUT2 (−) IN2 OUT3 (+) 15 PW-GND3 OUT3 (−) IN3 OUT4 (+) 14 OUT4 (−) IN4 C6: 1 µF RL = 4Ω Pre-GND AC-GND C1: 0.22 µF C1: 0.22 µF C1: 0.22 µF RL = 4Ω RL = 4Ω RL = 4Ω AC-GND AC-GND AC-GND AC-GND TAB 5 V Play MUTE C4: 1 µF R1: 47 kΩ

0.001 0.01 0.1 0.1 1 10 100 0.001 0.01 0.1 0.1 1 10 100 0.001 0.01 0.1 0.1 1 10 100 0.001 0.01 0.1 0.1 1 10 100 16. Electrical characteristics 16.1 Total Harmonic Distortion vs. Output Power Fig. 7-1 T otal Harmonic Distortion of Each Frequency (RL=4Ω) Output power POUT (W) THD – POUT (ch1) THD – POUT (ch2) Output power POUT (W) Total harmonic distortion THD (%) THD – POUT (ch3) THD – POUT (ch4) Output power POUT (W) Output power POUT (W) Total harmonic distortion THD (%) f = 1 kHz 100 Hz 10 kHz 20 kHz VCC = 13.2 V GV = 26dB RL = 4 Ω Filter

100 Hz : ~30 kHz

1 kHz : 400 Hz~30 kHz 10 kHz : 400 Hz~ 20 kHz : 400 Hz~ VCC = 13.2 V GV = 26dB RL = 4 Ω Filter 1 kHz : 400 Hz~30 kHz 10 kHz : 400 Hz~ 20 kHz : 400 Hz~ VCC = 13.2 V GV = 26dB RL = 4 Ω Filter 1 kHz : 400 Hz~30 kHz 10 kHz : 400 Hz~ 20 kHz : 400 Hz~ VCC = 13.2 V GV = 26dB RL = 4 Ω Filter 1 kHz : 400 Hz~30 kHz 10 kHz : 400 Hz~ 20 kHz : 400 Hz~ f = 1 kHz 100 Hz 10 kHz 20 kHz f = 1 kHz 100 Hz 10 kHz 20 kHz f = 1 kHz 100 Hz 10 kHz 20 kHz Total harmonic distortion THD (%) Total harmonic distortion THD (%)

0.001 0.01 0.1 0.1 1 10 100 0.001 0.01 0.1 0.1 1 10 100 0.001 0.01 0.1 0.1 1 10 100 0.001 0.01 0.1 0.1 1 10 100 Fig.7-2 T otal Harmonic Distortion by Power-supply Voltage (RL=4Ω) GV = 26dB RL = 2 Ω f = 1 kHz Filter

400 Hz~30 kHz

Total harmonic distortion THD (%) THD – POUT (ch1) THD – POUT (ch2) Output power POUT (W) Output power POUT (W) Total harmonic distortion THD (%) THD – POUT (ch3) THD – POUT (ch4) Output power POUT (W) Output power POUT (W) 13.2 V 6 V 18 V GV = 26dB RL = 2 Ω f = 1 kHz Filter GV = 26dB RL = 2 Ω f = 1 kHz Filter GV = 26dB RL = 2 Ω f = 1 kHz Filter 13.2 V 18 V 13.2 V 6 V 18 V 13.2 V 6 V 18 V Total harmonic distortion THD (%) Total harmonic distortion THD (%)

0.001 0.01 0.1 0.1 1 10 100 0.001 0.01 0.1 0.1 1 10 100 0.001 0.01 0.1 0.1 1 10 100 0.001 0.01 0.1 0.1 1 10 100 Fig.7-3 Total Harmonic Distortion by Power-supply Voltage (RL=4Ω) GV = 26dB RL = 4 Ω f = 1 kHz Filter Total harmonic distortion THD (%) THD – POUT (ch1) THD – POUT (ch2) Output power POUT (W) Output power POUT (W) Total harmonic distortion THD (%) THD – POUT (ch3) THD – POUT (ch4) Output power POUT (W) Output power POUT (W) 13.2 V 6 V 18 V GV = 26dB RL = 4 Ω f = 1 kHz Filter GV = 26dB RL = 4 Ω f = 1 kHz Filter GV = 26dB RL = 4 Ω f = 1 kHz Filter 13.2 V 13.2 V 18 V 18 V 18 V 13.2 V 6 V 6 V Total harmonic distortion THD (%) Total harmonic distortion THD (%)

-100 -80 -60 -40 -20 0.01 0.1 1 10 0.001 0.01 0.1 0.01 0.1 1 10 0.001 0.01 0.1 0.01 0.1 1 10

16.2 Various Frequency Characteristics

Fig.7-4 Frequency Characteristics of Total Harmonic Distortion Fig. 7-5 Frequency Characteristics of Voltage Gain and Mute Attenuation GV – f ATTMUTE – f Voltage gain GV (dB) Mute attenuation ATTMUTE (dB) VCC = 13.2 V RL = 4 Ω VOUT = 7.75 Vrms (20dBm) 1ch~4ch VCC = 13.2 V RL = 4 Ω VOUT = 0.775 Vrms (0dBm) 1ch~4ch THD – f frequency f (kHz) Total harmonic distortion THD (%) VCC = 13.2 V RL = 4 Ω POUT = 5 W No Filter 6 V 18 V 13.2 V frequency f (kHz) furequency f (kHz)

-80 -60 -40 -20 0.01 0.1 1 10 -100 -90 -80 -70 -60 -50 -40 -30 0.01 0.1 1 10 -100 -90 -80 -70 -60 -50 -40 -30 0.01 0.1 1 10 -100 -90 -80 -70 -60 -50 -40 -30 0.01 0.1 1 10 -100 -90 -80 -70 -60 -50 -40 -30 0.01 0.1 1 10 Fig. 7-6 Frequency Characteristics of Ripple Rejection Rate Fig. 7-7 Frequency Characteristics of Cross Talk C.T. – f (ch1) C.T. – f (ch2) frequency f (kHz) frequency f (kHz) Cross talk C.T. (dB) C.T. – f (ch3) C.T. – f (ch4) Cross talk C.T. (dB) VCC = 13.2 V RL = 4 Ω f = 1 kHz VOUT = 0.775 Vrms (0dBm) RG = 620 Ω 2ch 3ch 4ch VCC = 13.2 V RL = 4 Ω f = 1 kHz VOUT = 0.775 Vrms (0dBm) RG = 620 Ω 3ch 4ch 1ch VCC = 13.2 V RL = 4 Ω f = 1 kHz VOUT = 0.775 Vrms (0dBm) RG = 620 Ω 2ch 4ch 1ch VCC = 13.2 V RL = 4 Ω f = 1 kHz VOUT = 0.775 Vrms (0dBm) RG = 620 Ω 1ch 3ch 2ch R.R. – f (GV = 26dB) frequency f (kHz ) Ripple rejection ratio R.R. (dB) VCC = 13.2 V RL = 4 Ω RG = 620 Ω Vrip = 0.775 Vrms (0dBm) GV = 26dB 2ch 4ch 1ch 3ch Cross talk C.T. (dB) frequency f (kHz) Cross talk C.T. (dB) frequency f (kHz)

16.3 Output Power vs Input Voltage

16.4 Power Dissipation vs. Output Power PD – POUT (RL = 4 Ω) Power dissipation P D ( W) f = 1 kHz RL = 4 Ω 4ch drive 6 V 13.2 V 18 V POUT (ch1) – VIN POUT (ch2) – VIN Input signal voltage VIN (rms) (V) Input signal voltage VIN (rms) (V) Output power P OUT (W) 出力電力 P OUT (W) POUT (ch3) – VIN POUT (ch4) – VIN Input signal voltage VIN (rms) (V) Input signal voltage VIN (rms) (V) Output power P OUT (W) 出力電力 P OUT (W) VCC = 13.2 V RL = 4 Ω No Filter 100 Hz 10 kHz f = 20 kHz 1 kHz VCC = 13.2 V RL = 4 Ω No Filter f = 20 kHz 100 Hz 10 kHz 1 kHz VCC = 13.2 V RL = 4 Ω No Filter f = 20 kHz 100 Hz 10 kHz 1 kHz VCC = 13.2 V RL = 4 Ω No Filter f = 20 kHz 100 Hz 10 kHz 1 kHz Output power POUT/CH (W)

0.001 0.01 0.1 1 10

16.5 Other characteristics

VNO – Rg ICCQ – VCC Supply voltage VCC (V) Output noise voltage V NO ( μV) Quicent current I CCQ (mA) VCC = 13.2 V RL = 4 Ω f = 1 kHz Filter to 20 kHz 1ch~4ch VIN = 0 V RL = ∞ Ambient input resistance Rg (Ω)

  1. Package Dimensions Weight : 7.7 g (typ.) * From center to parting line.
  1. Board Layout for TOSHIBA 4-Channel Power Circuitry The layout diagrams below illustrate the front and back sides of the test board “ RP-2024” for testing Toshiba’s 4-channel power circuitry, which is housed in a HZIP25-P-1.00F (SPP25) package. Note 1: This test board is designed to be used for several power amplifiers. Therefore, devices that are externally connected to the power amplifier to be tested must be checked before setting up the test board. Front Side Back Side
  • Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.
  • If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. For details on how to connect a protection circuit such as a current limiting resistor or back electromotive force adsorption diode, refer to individual IC datasheets or the IC databook. IC breakdown may cause injury, smoke or ignition.
  • Use a stable power supply with ICs with built -in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
  • Carefully select external components (such as inputs and negative feedba ck capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
  • Over current Protection Circuit Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the Over current protectio n circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown.
  • Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the Thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding a bsolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.
  • Heat Radiation Design When using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components.
  • Installation to Heat Sink Please install the power IC to the heat sink not to apply excessive mecha nical stress to the IC. Excessive mechanical stress can lead to package cracks, resulting in a reduction in reliability or breakdown of internal IC chip. In addition, depending on the IC, the use of silicon rubber may be prohibited. Check whether the use of silicon rubber is prohibited for the IC you intend to use, or not. For details of power IC heat radiation design and heat sink installation, refer to individual technical datasheets or IC databooks.

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  • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSE S OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.