T6818_05 ATMEL | Alldatasheet
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- Supply Voltage up to 40 V RDSon Typically 0.5 Ω at 25°C, Maximum 1.1 Ω at 150°C Up to 1.5 A Output Current Three Half-bridge Outputs Formed by Three High-side and Three Low-side Drivers Capable to Switch all Kinds of Loads Such as DC Motors, Bulbs, Resistors, Capacitors and Inductors No Shoot-through Current Very Low Quiescent Current IS < 5 µA in Standby Mode versus Total Temperature Range Outputs Short-circuit Protected Overtemperature Protection for Each Switch and Overtemperature Prewarning Undervoltage Protection Various Diagnostic Functions Such as Shorted Output, Open-load, Overtemperature and Power-supply Fail Detection Serial Data Interface, Daisy Chain Capable, up to 2 MHz Clock Frequency SO14 Power Package 1. Description The T6818/ATA6828 are fully protected driver interfaces designed in 0.8-µm BCD- MOS technology. They are used to control up to 3 different loads by a microcontroller in automotive and industrial applications. Each of the 3 high-side and 3 low-side drivers is capable to drive currents up to 1.5 A. The drivers are internally connected to form 3 half-bridges and can be controlled sep- arately from a standard serial data interface. Therefore, all kinds of loads such as bulbs, resistors, capacitors and inductors can be combined . The IC design especially supports the application of H-bridges to drive DC motors. Protection is guaranteed regarding short-circuit conditions, overtemperature and und- ervoltage. Various diagnostic functions and a very low quiescent current in stand-by-mode opens a wide range of applications. Automotive qualification (protec- tion against conducted interferences, EMC protection and 2-kV ESD protection) gives added value and enhanced quality for exacting requirements of automotive applications. Triple Half- bridge DMOS Output Driver with Serial Input Control T6818/ATA6828 Rev. 4530G–BCD–09/05
4530G–BCD–09/05 T6818/ATA6828 Figure 1-1. Block Diagram DI CLK INH DO CS UV protection Serial interfaceInput register Output register H S L S H S L S H S L S S R R O C S P S F O P L S C D H S L S H S L S H S L S T P OUT3 VS VCC Thermal protection Control logic Power-on reset Charge pump OUT2 OUT1 n.n. GND 21 2 13 GND GND GND Fault detect Fault detect Fault detect Fault detect Fault detect Fault detect
4530G–BCD–09/05 T6818/ATA6828 2. Pin Configuration Figure 2-1. Pining SO14/PSO14 GND OUT3 VS CS DI CLK GND GND OUT1 OUT2 VCC INH DO GND Table 2-1. Pin Description Pin Symbol Function 1G N D T6818: ground; reference potential; internal connection to pin 7, 8 and 14; cooling tab ATA6828: additional connection to heat slug
2 OUT3
Half-bridge output 3; formed by internally connected power MOS high-side switch 3 and low-side switch 3 with internal reverse diodes; short circuit protection; overtemperature protection; diagnosis for short and open load
3 VS Power supply for output stages OUT1, OUT2 and OUT3, internal supply
4 CS Chip select input; 5-V CMOS logic level input with internal pull up;
low = serial communication is enabled, high = disabled 5 DI Serial data input; 5-V CMOS logic level input with internal pull down; receives serial data from the control device; DI expects a 16-bit control word with LSB being transferred first 6 CLK Serial clock input; 5-V CMOS logic level input with internal pull down; controls serial data input interface and internal shift register (fmax = 2 MHz)
7 GND Ground; see pin 1
8 GND Ground; see pin 1
Serial data output; 5-V CMOS logic level tri-state output for output (status) register data; sends 16-bit status information to the microcontroller (LSB is transferred first); output will remain tri-stated unless device is selected by CS = low, therefore, several ICs can operate on one data output line only.
10 INH Inhibit input; 5-V logic input with internal pull down; low = standby, high = normal operation
11 VCC Logic supply voltage (5 V)
12 OUT2 Half-bridge output 2; see pin 2
13 OUT1 Half-bridge output 1; see pin 2
14 GND Ground; see pin 1
4530G–BCD–09/05 T6818/ATA6828 3. Functional Description
3.1 Serial Interface
Data transfer starts with the falling edge of th e CS signal. Data must appear at DI synchronized to CLK and are accepted on the falling edge of the CLK signal. LSB (bit 0, SRR) has to be trans- ferred first. Execution of new input data is enabled on the rising edge of the CS signal. When CS is high, pin DO is in tri-state condition. This output is enabled on the falling edge of CS. Output data will change their state with the rising edge of CLK and stay stable until the next rising edge of CLK appears. LSB (bit 0, TP) is transferred first. Figure 3-1. Data Transfer CS DI CLK 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Table 3-1. Input Data Protocol Bit Input Register Function 0S R R Status register reset (high = reset; the bits PSF , OPL and SCD in the output data register are set to low)
1 LS1 Controls output LS1 (high = switch output LS1 on)
2 HS1 Controls output HS1 (high = switch output HS1 on)
3 LS2 See LS1
4 HS2 See HS1
5 LS3 See LS1
6 HS3 See HS1
7 n. u. Not used 8 n. u. Not used 9 n. u. Not used 10 n. u. Not used 11 n. u. Not used 12 n. u. Not used
13 OCS Overcurrent shutdown (high = overcurrent shutdown is active)
14 n. u. Not used 15 n. u. Not used
4530G–BCD–09/05 T6818/ATA6828 Table 3-2. Output Data Protocol Bit Output (Status) Register Function
0 TP Temperature prewarning: high = warning
1 Status LS1 High = output is on, low = output is off; not affected by SRR
2 Status HS1 High = output is on, low = output is off; not affected by SRR
3 Status LS2 Description see LS1
4 Status HS2 Description see HS1
5 Status LS3 Description see LS1
6 Status HS3 Description see HS1
7 n. u. Not used 8 n. u. Not used 9 n. u. Not used 10 n. u. Not used 11 n. u. Not used 12 n. u. Not used
13 SCD
Short circuit detected: set high when at least one high-side or low-side switch is switched off by a short-circuit condition. Bits 1 to 6 can be used to detect the shorted switch.
14 OPL
Open load detected: set high, when at least one active high-side or low- side switch sinks/sources a current below the open load threshold current. PSF Power-supply fail: undervoltage at pin VS detected After power-on reset, the input register has the following status: Bit 15 Bit 14 Bit 13 (OCS) Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 (HS3) Bit 5 (LS3) Bit 4 (HS2) Bit 3 (LS2) Bit 2 (HS1) Bit 1 (LS1) Bit 0 (SRR) x xHxxxxxx LLLL L LL The following patterns are used to enable internal test modes of the IC. It is not recommended to use these patterns during normal operation. Bit 15 Bit 14 Bit 13 (OCS) Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 (HS3) Bit 5 (LS3) Bit 4 (HS2) Bit 3 (LS2) Bit 2 (HS1) Bit 1 (LS1) Bit 0 (SRR) H HHH HLLLLLLLL L LL H HHLLH HLLLLLL L LL H HHLLLLH HLLLL L LL
4530G–BCD–09/05 T6818/ATA6828
3.2 Power-supply Fail
In case of undervoltage at pin VS, the Power-Supply Fail bit (PSF) in the output register is set and all outputs are disabled. To detect an undervoltage, its duration has to last longer than the undervoltage detection delay time t dUV. The outputs are enabled immediately when supply volt- age recovers normal operation value. The PSF bit stays high until it is reset by the SRR bit in the input register.
3.3 Open-load Detection
If the current through a high-side or low-side switch in ON-state stays below the open-load detection threshold, the open-load detection bit (OPL) in the output register is set. The OPL bit stays high until it is reset by the SRR bit in the input register. To detect an open load, its duration has to last longer than the open-load detection delay time t dSd.
3.4 Overtemperature Protection
If the junction temperature of one or more output stages exceeds the thermal prewarning thresh- old, T jPW set , the temperature prewarning bit (TP) in the output register is set. When the temperature falls below the thermal prewarning threshold, T jPW reset, the bit TP is reset. The TP bit can be read without transferring a complete 16-bit data word. The status of TP is available at pin DO with the falling edge of CS. After the micr ocontroller has read this information, CS is set high and the data transfer is interrupted without affecting the status of input and output registers. If the junction temperature of one or more outp ut stages exceeds the thermal shutdown thresh- old, Tj switch off, all outputs are disabled and the corresponding bits in the output register are set to low. The outputs can be enabled again when the temperature falls below the thermal shutdown threshold, Tjswitch on and the SRR bit in the input register is set to high. Hysteresis of thermal pre- warning and shutdown threshold avoids oscillations.
3.5 Short-circuit Protection
The output currents are limited by a current regulator. Overcurrent detection is activated by writ- ing a high to the OCS bit in the input register. When the current in an output stage exceeds the overcurrent limitation and shutdown threshold, it is switched off after a delay time (t dSd). The short-circuit detection bit (SCD) is set and the corresponding status bit in the output register is set to low. For OCS = low the overcurrent shutdown is inactive. The SCD bit is also set if the cur- rent exceeds the overcurrent limitation and shutdown threshold, but the outputs are not affected. By writing a high to the SRR bit in the input register the SCD bit is reset and the disabled outputs are enabled.
3.6 Inhibit
0 V applied to pin 10 (INH) inhibits the T6818/ATA6828. All output switches are then turned off and switched to tri-state. The data in the output register are deleted. The current consumption is reduced to less than 5 µA at pin VS and less than 25 µA at pin VCC. The output switches can be activated again by switching pin 10 (INH) to 5 V which initiates an internal power-on reset.
4530G–BCD–09/05 T6818/ATA6828 Note: 1. Threshold for undervoltage detection 4. Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. All values refer to GND pins. Parameters Pin Symbol Value Unit Supply voltage 3 V VS –0.3 to +40 V Supply voltage t < 0.5 s; IS > –2 A 3 VVS –1 V Logic supply voltage 11 VVCC –0.3 to +7 V Logic input voltage 4 to 6, 10 VCS,VDI, VCLK, VINH –0.3 to VVCC+0.3 V Logic output voltage 9 VDO –0.3 to VVCC+0.3 V Input current 4 to 6, 10 ICS,IDI, ICLK, IINH –10 to +10 mA Output current 9 IDO –10 to +10 mA Output current 2, 12 and 13 IOut3, IOut2, IOut1 Internally limited, see output specification Output voltage 2, 12 and 13 IOut3, IOut2, IOut1 –0.3 to +40 V Reverse conducting current (tpulse = 150 µs) 2, 12 and 13 towards pin 3 IOut3, IOut2, IOut1 17 A Junction temperature range TJ –40 to +150 °C Storage temperature range TSTG –55 to +150 °C 5. Thermal Resistance Parameters Test Conditions Symbol Value Unit T6818 Junction pin Measured to GND Pins 1, 7, 8 and 14 RthJP 30 K/W Junction ambient RthJA 65 K/W ATA6828 Junction pin Measured to heat slug GND pins 1, 7, 8 and 14 RthJP 5 K/W Junction ambient RthJA 30 K/W 6. Operating Range Parameters Symbol Value Unit Supply voltage V VS VUV (1) to 40 V Logic supply voltage VVCC 4.75 to 5.25 V Logic input voltage VCS,VDI, VCLK, VINH –0.3 to VVCC V Serial interface clock frequency fCLK 2 MHz Junction temperature range Tj –40 to +150 °C
4530G–BCD–09/05 T6818/ATA6828 Note: 1. Test pulse 5: V smax = 40 V 7. Noise and Surge Immunity Parameters Test Conditions Value Conducted interferences ISO 7637-1 Level 4 (1) Interference suppression VDE 0879 Part 2 Level 5 ESD (Human Body Model) ESD S 5.1 2 kV ESD (Machine Model) JEDEC A115A 200 V 8. Electrical Characteristics 7.5 V < VVS < 40 V; 4.75 V < VVCC < 5.25 V; INH = High; –40°C < Tj < 150° C; unless otherwise specified, all values refer to GND pins. No. Parameters Test Conditions Pi n Symbol Min. Typ. Max. Unit Type*
1 Current Consumption
1.1 Quiescent current VS VVS < 20 V, INH = low 3 IVS 1 5 µA A
1.2 Quiescent current VCC 4.75 V < VVCC < 5.25 V, INH = low 11 IVCC 15 25 µA A
1.3 Supply current VS VVS < 20 V normal
operating, all outputs off 3 IVS 4 6 mA A 1.4 Supply current VCC 4.75 V < VVCC < 5.25 V, normal operating 11 IVCC 350 500 µA A 1.5 Discharge current VS VVS = 32.5 V, INH = low 3 IVS 0.5 5.5 mA A
1.6 Discharge current VS VVS = 40 V,
INH = low 3 IVS 2.5 10 mA A
2 Undervoltage Detection, Power-on Reset
2.1 Power-on reset
11 VVCC 3.2 3.9 4.4 V A
2.2 Power-on reset
delay time After switching on VCC tdPor 30 95 190 µs A
2.3 Undervoltage-detection
threshold VCC = 5 V 3 VUv 5.6 7.0 V A
2.4 Undervoltage-detection
hysteresis VCC = 5 V 3 ∆VUv 0.6 V A
2.5 Undervoltage-detection
tdUV 10 40 µs A
3 Thermal Prewarning and Shutdown
3.1 Thermal prewarning set TjPW set 120 145 170 °C B
3.2 Thermal prewarning
reset TjPW reset 105 130 155 °C B
3.3 Thermal prewarning
hysteresis ∆TjPW 15 °C B
3.4 Thermal shutdown off Tj switch off 150 175 200 °C B
3.5 Thermal shutdown on Tj switch on 135 160 185 °C B
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. Delay time between rising edge of input signal at pin CS a fter data transmission and switch on output stages to 90% of final level. Device not in standby for t > 1 ms
4530G–BCD–09/05 T6818/ATA6828
3.6 Thermal shutdown
hysteresis ∆Tj switch off 15 ° CB 3.7 Ratio thermal shutdown off/thermal prewarning set Tj switch off/ TjPW set 1.05 1.2 B 3.8 Ratio thermal shutdown on/thermal prewarning reset Tj switch on/ TjPW reset 1.05 1.2 B
4 Output Specificat ion (OUT1-OUT3)
4.1 On resistance IOut 1-3 = –1.3 A 2, 12, 13 RDSOn1-3 1.1 Ω A 4.2 IOut 1-3 = 1.3 A 2, 12, 13 RDSOn1-3 1.1 Ω A
4.3 High-side output
VOut 1-3 = 0 V, output stages off 2, 12,
13 IOut1-3 –15 µA A
4.4 Low-side output
VOut 1-3 = VVS, output stages off 2, 12,
13 IOut1-3 200 µA A
4.5 High-side switch reverse diode forward voltage IOut 1-3 = 1.5 A 2, 12, 13 VOut1-3 – VVS 1.5 V A
4.6 Low-side switch reverse
IOut 1-3 = –1.5 A 2, 12, 13 VOut 1-3 –1.5 V A 4.7 High-side overcurrent limitation and shutdown threshold 2, 12, 13 IOut1-3 –2.5 –2 –1.5 A A 4.8 Low-side overcurrent limitation and shutdown threshold 2, 12, 13 IOut1-3 1.5 2 2.5 A A
4.9 Overcurrent shutdown
tdSd 10 40 µs A
4.10 High-side open-load
2, 12,
13 IOut1-3 –45 –30 –15 mA A
4.11 Low-side open-load
2, 12,
13 IOut1-3 15 30 45 mA A
4.12 Open-load detection
delay time tdSd 200 600 µs A
4.13 High-side output switch
on delay(1) VVS = 13 V RLoad = 30 Ω tdon 20 µs A
4.14 Low-side output switch
(1) VVS = 13 V RLoad = 30 Ω tdon 20 µs A
4.15 High-side output switch
off delay(1) VVS = 13 V RLoad = 30 Ω tdoff 20 µs A 8. Electrical Characteristics (Continued) 7.5 V < VVS < 40 V; 4.75 V < VVCC < 5.25 V; INH = High; –40°C < Tj < 150° C; unless otherwise specified, all values refer to GND pins. No. Parameters Test Conditions Pi n Symbol Min. Typ. Max. Unit Type* *) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. Delay time between rising edge of input signal at pin CS a fter data transmission and switch on output stages to 90% of final level. Device not in standby for t > 1 ms
4530G–BCD–09/05 T6818/ATA6828
4.16 Low-side output switch
off delay(1) VVS = 13 V RLoad = 30 Ω tdoff 3µ sA 4.17 Dead time between corresponding high- and low-side switches VVS = 13 V RLoad = 30 Ω tdon – tdoff 1 µs A
5 Logic Inputs DI, CLK, CS, INH
5.1 Input voltage low-level
threshold 4-6, 10 VIL 0.3 × VVCC V A
5.2 Input voltage high-level
4-6, 10 VIH 0.7 × VVCC V A
5.3 Hysteresis of input
voltage 4-6, 10 ∆VI 50 700 mV B
5.4 Pull-down current pin
DI, CLK, INH VDI, VCLK, VINH = VCC 5, 6, 10 IPD 10 65 µA A
5.5 Pull-up current
Pin CS VCS = 0 V 4 IPU –65 –10 µA A
6 Serial Interface – Logic Output DO
6.1 Output-voltage low level IDOL = 2 mA 9 VDOL 0.4 V A
6.2 Output-voltage high
level IDOL = –2 mA 9 VDOH VVCC –
0.7 V V A
6.3 Leakage current
(tri-state) VCS = VCC 0V < VDO < VVCC
9 IDO –10 10 µA A
7 Inhibit Input — Timing
7.1 Delay time from standby to normal operation tdINH 100 µs A 8. Electrical Characteristics (Continued) 7.5 V < VVS < 40 V; 4.75 V < VVCC < 5.25 V; INH = High; –40°C < Tj < 150° C; unless otherwise specified, all values refer to GND pins. No. Parameters Test Conditions Pi n Symbol Min. Typ. Max. Unit Type* *) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. Delay time between rising edge of input signal at pin CS a fter data transmission and switch on output stages to 90% of final level. Device not in standby for t > 1 ms
4530G–BCD–09/05 T6818/ATA6828 9. Serial Interface – Timing
8.1 DO enable after CS
falling edge CDO = 100 pF 9 1 t ENDO 200 ns D
8.2 DO disable after CS
rising edge CDO = 100 pF 9 2 t DISDO 200 ns D
8.3 DO fall time C DO = 100 pF 9 – t DOf 100 ns D
8.4 DO rise time C DO = 100 pF 9 – t DOr 100 ns D
8.5 DO valid time C DO = 100 pF 9 10 t DOVal 200 ns D
8.6 CS setup time 4 4 t CSSethl 225 ns D
8.7 CS setup time 4 8 t CSSetlh 225 ns D
8.8 CS high time 4 9 t CSh 500 ns D
8.9 CLK high time 6 5 t CLKh 225 ns D
8.10 CLK low time 6 6 t CLKl 225 ns D
8.11 CLK period time 6 – t CLKp 500 ns D
8.12 CLK setup time 6 7 t CLKSethl 225 ns D
8.13 CLK setup time 6 3 t CLKSetlh 225 ns D
8.14 DI setup time 5 11 t DIset 40 ns D
8.15 DI hold time 5 12 t DIHold 40 ns D
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. See Figure 9-1 on page 12
4530G–BCD–09/05 T6818/ATA6828 Figure 9-1. Serial Interface Timing with Chart Numbers CS DO 1 2 CS CLK DI CLK DO 10 12 Inputs DI, CLK, CS: High level = 0.7 × VCC, low level = 0.3 × VCC Output DO: High level = 0.8 × VCC, low level = 0.2 × VCC
4530G–BCD–09/05 T6818/ATA6828 10. Application Circuit
10.1 Application Notes
It is strongly recommended to connect the blocking capacitors at V CC and VS as close as possi- ble to the power supply and GND pins. Recommended value for capacitors at VS: Electrolytic capacitor C > 22 µF in parallel with a ceramic capacitor C = 100 nF. Value for elec- trolytic capacitor depends on external loads, conducted interferences and reverse conducting current I Out1,2,3 (see “Absolute Maximum Ratings” on page 7). Recommended value for capacitors at VCC: Electrolytic capacitor C > 10 µF in parallel with a ceramic capacitor C = 100 nF. To reduce ther- mal resistance it is recommended to place cooling areas on the PCB as close as possible to the GND pins. Negative spikes at the output pins (e .g. negative spikes caused by an inductive load switched off with a high side driver) may activate the overtemperature protection function of the T6818/ATA6828. In this condition, all outputs will be switched off simultaneously. If this behavior is not acceptable or compatible with your application functionally, it is necessary, that for switch- ing on required outputs again, the SRR bit (Status Register Reset) is set, to ensure a reset of the overtemperature function. DI CLK INH DO CS UV protection Serial interfaceInput register Output register H S L S H S L S H S L S S R R O C S P S F O P L S C D H S L S H S L S H S L S T P OUT3 VS VCC Thermal protection Control logic Power-on reset Charge pump OUT2 OUT1 n.n. GND 21 21 3 GND GND GND Fault detect Fault detect Fault detect Fault detect Fault detect Fault detect 5 V 13 V BYT41D VS VBatt Microcontroller U5021M Watchdog VCC Reset Trigger Enable MM VCC VCC VCC
4530G–BCD–09/05 T6818/ATA6828 12. Package Information 11. Ordering Information Extended Type Number Package Remarks T6818-TUSY SO14 Power package, tubed, lead-free T6818-TUQY SO14 Power package, taped and reeled, lead-free ATA6828-T2SY PSO14 Power package with heat slug, tubed, lead-free ATA6828-T2QY PSO14 Power package with heat slug, taped and reeled, lead-free technical drawings according to DIN specifications Dimensions in mm 0.25 0.10 8.75 0.4 1.27 7.62 1.4 5.2 4.8 3.7 3.8 6.15 5.85 0.2 14 8
4530G–BCD–09/05 T6818/ATA6828 13. Revision History with heat slug Dimensions in mm heat slug exposed17 14 8 6.86 2.54-0.5 ∅ 0.4 A A B B specifications according to DIN technical drawings 0.41 1.27 nom. 6 x 1.27 = 7.62 nom. 1.62 max. 0.1 max. 0.23 1.52 max. 8.75±0.1 3.99 max. 4.27±0.4 6±0.2 Issue: 2; 18.08.05 Drawing-No.: 6.541-5051.01-4 Please note that the following page numbers referred to in this section refer to the specific revision mentioned, not to this document. Revision No. History 4530G-BCD-09/05
- Complete datasheet: T6828 changed in ATA6828
- Ordering Information on page 14 changed
- Package drawing on page 15 changed 4530F-BCD-03/05 • Lead-free Logo on page 1 added
- Table “Ordering Information” on page 14 changed 4530E-BCD-07/04 • Table “Ordering Information” on page 14 changed 4530D-BCD-04/04 • Features on page 1 changed
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