T3A33BRG-H9C0002X1U1930 HARVATEK | Alldatasheet
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Official Product HT Part No.T3A33BRG-H9C0002X1U1930 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 1/14/2022 Version 1.0 Page 1/18 Harvatek Surface Mount PLCC IC+RGB LEDs Data Sheet T3A33BRG-H9C0002X1U1930
Official Product HT Part No.T3A33BRG-H9C0002X1U1930 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 1/14/2022 Version 1.0 Page 2/18 PACKAGE OUTLINE DIMENSION AND RECOMMENDED SOLDERING PATTERN FOR REFLOW
Official Product HT Part No.T3A33BRG-H9C0002X1U1930 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 1/14/2022 Version 1.0 Page 3/18 DISCLAIMER HARVATEK reserves the right to make changes without further notice to any products herein to improve reliability, function or design. HARVATEK does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. Life Support Policy HARVATEK’s products are not authorized for use as critical components in life support devices or systems without the express written approval of the President of HARVATEK or HARVATEK INTERNATIONAL. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
Official Product HT Part No.T3A33BRG-H9C0002X1U1930 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 1/14/2022 Version 1.0 Page 4/18 Product Specifications Item Specification Material Quantity Luminous Intensity (Iv) R:560.0-1125.0 mcd G:1125.0-2850.0 mcd B:285.0-715.0 mcd IC@5V Ts= 25oC;Tolerance: + 10% Dominant Wavelength (Wd) R:615.0-630.0 nm G:515.0-535.0 nm B:460.0-476.0 nm IC@5V TS= 25oC;Tolerance: + 1 nm Applied voltage 5V_DC Resin Clear Silicone Carrier tape EIA 481-1A specs Conductive black tape 1000 Reel EIA 481-1A specs Conductive black Label HT standard Paper Packing bag 220x240mm Aluminum laminated bag/ no-zipper One reel per bag Carton HT standard Paper Non-specified Others: Each immediate box consists of 5 reels. The 5 reels may not necessarily have the same lot number or the same bin combinations of Iv, λD and Vf. Each reel has a label identifying its specification; the immediate box consists of a product label as well. Note :This is shipped test conditions ※Remarks: This product should be operated in forward bias. If a reverse voltage is continuously app lied to the product, such operation can cause migration resulting in LED damage. ATTENTION: Electrostatic Discharge (ESD) protection The symbol to the left denotes that ESD precaution is needed. ESD protection for GaP and AlGaAs based chips is necessary even though they are relatively safe in the presence of low static -electric discharge. Parts built with AlInGaP , GaN, or/and InGaN based chips are STATIC SENSITIVE devices. ESD precaution must be taken during design and assembly. If manual work or processing is needed, please ensure the device is adequately protected from ESD during the process.
Official Product HT Part No.T3A33BRG-H9C0002X1U1930 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 1/14/2022 Version 1.0 Page 5/18 Label Specifications ■Harvatek P/N: T 3A3 3 BRG- H9C- 0002 X1 U1930 ■ Lot No.: Product Dice Q’ty Current Taping Customer Code LF 3.TRI+IC 5V 1. Taping style 2. Q’ty Customer Product Code Package Color Series Number 5.36(L)x5.0(W)x1.6(H) mm BRG X001~XZZZ
Official Product HT Part No.T3A33BRG-H9C0002X1U1930 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 1/14/2022 Version 1.0 Page 6/18 Product Features Electro-Optical Characteristics (TSoldering , 25 oC) Series Emitting Color Material Wavelength λ(nm) IV(mcd) Viewing Angle 12 λD λP △λ Typical T3A33BRG B InGaN 470 465 25 400 120 R AlInGaP 624 630 18 800 120 G InGaN 523 518 35 1800 120 Package Outline Dimension and Recommended Soldering Pattern for Reflow Soldering (Unit:mm Tolerance: +/-0.1) Outline Dim. Soldering Pattern Soldering terminals may shift in the Wd direction.
Official Product HT Part No.T3A33BRG-H9C0002X1U1930 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 1/14/2022 Version 1.0 Page 7/18 Absolute Maximum Ratings (TA=25oC) Symbol Parameter Range Units VDD Supply Voltage 6.5 V PD Power Dissipation <400 mW ILEDOUT Maximum Output Current 30 mA TM Welding Temperature 300(8S) oC TOPR Operating Temperature Range -40~+85 oC TSTO Storage Temperature Range -65+125 oC
Electrical characteristics
(unless otherwise specified, Temperature=25oC & VDD=5.0V) Symbol Characteristic Min. Typ. Max. Units Condition VDD Supply Voltage 3.3 5.0 5.5 V - Idyn Operation Current - - 2 mA VDD=5V, RGB off Isleep Standby Current - - 5 μA - Logic input control DIN/CIN VIH Input High “H” 2.7 - VDD+0.4 V - VlL Input High “L” -0.4 1.0 V - RIN DIN Pull-up resistance @normal mode 80k - Ω - CFREQ CIN Frequency - - 15 MHz - TCKH CIN High pulse width 30 - - ns - TCKL CIN Low pulse width 30 - - ns - TSETUP DIN to CIN setup 10 - - ns - THOLD DIN to CIN hold time 5 - - ns - Logic output DOUT/COUT VOH Output High “H” 4.5 - - V 4mA@VDD=5V VOL Output High “L” - - 0.4 V 4mA@VDD=5V Sink Current R/G/B ISINK Sink Current 19 20 21 mA @VDD-VfLED≥1.5V
Official Product HT Part No.T3A33BRG-H9C0002X1U1930 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 1/14/2022 Version 1.0 Page 8/18 ■ Application circuit Block Diagram Pin Function Description Pin Name IO Description VDD P Power Supply GND G Ground DIN I Series data input DOUT I Series data output CIN O Clock input COUT O Clock output R O Red LED output driver G O Green LED output driver B O Blue LED output driver
Official Product HT Part No.T3A33BRG-H9C0002X1U1930 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 1/14/2022 Version 1.0 Page 9/18 ■ Cascading data structure 32 consecutive 0’s denote the start of a command for an RGB LED. After receiving 32 0’s, IC gets the following 32 bits as the received command, including FLAG, DIMMING, BLUE, GREEN and RED fields . The serial command is transmitted with MSB first, DIN is latched at the rising edge of CIN clock. COUT and DOUT are re -generated for the next RGB LED. COUT is inverted from CIN. When 32 consecutive 0 ’s are encountered, the next 1 is expected to start a 32-bit command, i.e., FLAG [2:0]=111. When FLAG [2:0]=111, then DIMMING, BLUE, GREEN a nd RED fields are latched respectively. While the current 32-bit command is got, IC passes remaining command bits to the next RGB LED. After the last one command is issued for the last LED (LED n), the following 32 consecutive 1’s denote the end of the current command for an RGB LED(End of Frame) and wait for next 32 consecutive 0’s to start a new command set.(Note: IC is workable either with or without “End of Frame” command, but MCU should issue the extra N/2 numbers of clocks signal if there are N LED l amps totally connected in the strip to make sure the data transfer and display of the last one LED lamp is complete and correct)
Official Product HT Part No.T3A33BRG-H9C0002X1U1930 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 1/14/2022 Version 1.0 Page 10/18 FLAG [2:0] : 111 to start a 32-bit command DIMMING [4:0] : 32-level current control for R/G/B drivers BLUE [7:0] : 256 gray levels for blue LED GREEN [7:0] : 256 gray levels for green LED RED [7:0] : 256 gray levels for red LED Sleep and power saving mode IC supports the sleep/wake -up modes for power -saving purpose. In sleep mode, the built -in oscillator and associated circuitry will be disabled. The quiescent current of IC is approximately 1uA (typ.). Command Setup to enable sleep or wake up mode When receiving 24-bit 0’s BGR data (that is BLUE [7:0]=8h00, G [7:0]=8h00, R [7:0]=8h00), in the meantime, both of the data in 3 -bits’ flag and 5 -bits’ DIMMING is 8h’A0’ (that is FLAG [2:0]=3b101 and DIMMING [4:0]=5b00000), IC will enter sleep mode. IC will wake up from sleep mode once receiving the new data with the data of Flag [2:0] , DIMMING [4:0] is not 8h"A0"; after wake-up, all sleeping circuits in IC return to normal working mode within 1ms. Since it takes 1ms for a sleeping IC returning to normal function mode, it is recommended for a host to wait for 1ms to send display data and command after issuing a wake-up command. Sleep power-saving mode example:
Official Product HT Part No.T3A33BRG-H9C0002X1U1930 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 1/14/2022 Version 1.0 Page 11/18 In case 2, while lamp2 is under sleep mode, in the following data transfer process, the state of lamp 2 will be not changed as long as the 32 bits data for lamp 2 is received with data of Flag [2:0]、DIMMING [4:0] being 8h”A0” . It means lamp2 will keep in sleep mode as well. In the situation, lamp2 can pass through the remaining data to lamp 3 (32bits) to change the display data of lamp 3. In other words, the sleeping chip is able to pass the data to the next chips. Typical Circuit of an RGB LED strip application
Official Product HT Part No.T3A33BRG-H9C0002X1U1930 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 1/14/2022 Version 1.0 Page 12/18 Precaution for Use 1. The chips should not be used directly in any type of fluid such as water, oil, organic solvent, etc. 2. When the LEDs are illuminating, the maximum ambient temperature sho uld be first considered before operation. 3. LEDs must be stored in a clean environment. A sealed container with a nitrogen atmosphere is necessary if the storage period is over 3 months after shipping. 4. The LEDs must be used within 24 hrs after unpacked. Unused products must be repacked in an anti-electrostatic package, folded to close any opening and then stored in a dry and cool space. 5. The appearance and specifications of the products may be modified for improvement without further notice. 6. The LEDs are sensi tive to the static electricity and surge. It is strongly recommended to use a grounded wrist band and anti -electrostatic glove when handling the LEDs.If a voltage over the absolute maximum rating is applied to LEDs, it will damage LEDs.Damaged LEDs will sh ow some abnormal characteristics such as remarkable increase of leak current, lower turn-on voltage and getting unlit at low current.
Official Product HT Part No.T3A33BRG-H9C0002X1U1930 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 1/14/2022 Version 1.0 Page 13/18 Packaging Tape Dimension Dim. A Dim. B Dim. C Q’ty/Reel Unit : mm
Official Product HT Part No.T3A33BRG-H9C0002X1U1930 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 1/14/2022 Version 1.0 Page 14/18 Reel Dimension Unit : mm Packing 5 or 10 boxes per carton is available depending on shipment quantity.
Official Product HT Part No.T3A33BRG-H9C0002X1U1930 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 1/14/2022 Version 1.0 Page 15/18 Dry Pack All SMD optical devices are MOISTURE SENSITIVE. Avoid exposure to moisture at all times during transportation or storage. Every reel is packaged in a moisture protected anti-static bag. Each bag is properly sealed prior to shipment. Upon request, a humidity indicator will be included in the moisture protected anti-static bag prior to shipment. The packaging sequence is as follows: Baking Baking before soldering is recommended when the package has been unsealed for 72 hrs. The conditions are as followings: 1. 60±3℃×(12~24hrs)and<5%RH, taped reel type. 2. 100±3℃×(45min~1hr), bulk type. 3. 130±3℃×(15min~30min), bulk type. Precautions 1. Avoid exposure to moisture at all times during transportation or storage. 2. Anti-Static precaution must be taken when handling GaN, InGaN, and AlInGaP products. 3. It is suggested to connect the unit with a current limiting resistor of the proper size. Avoid applying a reverse voltage beyond the specified limit. 4. Avoid operation beyond the limits as specified by the absolute maximum ratings. 5. Avoid direct contact with the surface through which the LED emits light. 6. If possible, assemble the unit in a clean room or dust-free environment.
Official Product HT Part No.T3A33BRG-H9C0002X1U1930 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 1/14/2022 Version 1.0 Page 17/18 Reflow Soldering Recommend soldering paste specifications: 1. Operating temp.: Above 217 OC ,60~150 sec. 2. Peak temp.:260 OCMax.,10sec Max. 3. Reflow soldering should not be done more than two times. 4. Never attempt next process until the component is cooled down to room temperature after reflow. 5. The recommended reflow soldering profile (measured on the surface of the LED terminal) is as following: Lead-free Solder Profile Reworking Rework should be completed within 5 seconds under 260 OC. The iron tip must not come in contact with the copper foil. Twin-head type is preferred. Cleaning Following are cleaning procedures after soldering: An alcohol-based solvent such as isopropyl alcohol (IPA) is recommended. Temperature x Time should be 50oC x 30sec. or <30oC x 3min Ultrasonic cleaning: < 15W/ bath; bath volume ≤ 1liter Curing: 100 OC max, <3min Cautions of Pick and Place Avoid stress on the resin at elevated temperature.
Official Product HT Part No.T3A33BRG-H9C0002X1U1930 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 1/14/2022 Version 1.0 Page 18/18 Avoid rubbing or scraping the resin by any object. Electric-static may cause damage to the component. Please ensure that the equipment is properly grounded. Use of an ionizer fan is recommended. Revise History Rev. Descriptions Date Page