B3FYB HARVATEK | Alldatasheet
Document overview
- Manufacturer or author: Meicer
- PDF pages: 15
Technical content
Official Product HT Part No. B3FYBFCH-F6C-0001HR Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 3/26/ 2019 Version 1.0 Page 1/15 Harvatek Surface Mount CHIP LEDs Data Sheet B3FYBFCH-F6C-0001HR Preliminary
Official Product HT Part No. B3FYBFCH-F6C-0001HR Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 3/26/ 2019 Version 1.0 Page 2/15 PACKAGE OUTLINE DIMENSION AND RECOMMENDED SOLDERING PATTERN FOR
Official Product HT Part No. B3FYBFCH-F6C-0001HR Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 3/26/ 2019 Version 1.0 Page 3/15 DISCLAIMER HARVATEK reserves the right to make changes without further notice to any products herein to improve reliability, function or design. HARVATEK does not assume any liability arising out of the application or use of any product or circuit described herein; nei ther does it convey any license under its patent rights, nor the rights of others. Life Support Policy HARVATEK’s products are not authorized for use as critical components in life support devices or systems without the express written approval of the President of HARVATEK or HARVATEK INTERNATIONAL. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
Official Product HT Part No. B3FYBFCH-F6C-0001HR Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 3/26/ 2019 Version 1.0 Page 4/15 Product Specifications Item Specification Material Quantity Luminous Intensity(Iv) R：min 14 mcd G：min 16 mcd B：min 2.8 mcd R@5mA;G/B@2mA/ Ts= 25℃;Tolerance: + 10% Wavelength R：min 617.0 nm G：min 527.0 nm B：min 465.0 nm R@5mA;G/B@2mA/ Ts= 25℃;Tolerance: + 0.5nm Vf R：1.6-2.4 V G：2.2-3.0 V B：2.2-3.0 V R@5mA;G/B@2mA/ Ts= 25℃;Tolerance: + 0.05V Ir < 1 µA @ VR = 5V Resin Dark Epoxy Carrier tape EIA 481-1A specs Conductive black tape 12000ea/reel Reel EIA 481-1A specs Conductive black Label HT standard Paper Packing bag 220x240mm Aluminum laminated bag/ no-zipper One reel per bag Carton HT standard Paper Non-specified
Official Product HT Part No. B3FYBFCH-F6C-0001HR Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 3/26/ 2019 Version 1.0 Page 5/15 Others: Each immediate box consists of 5 reels. The 5 reels may not necessarily have the same lot number or the same bin combinations of Iv, λD and Vf. Each reel has a label identifying its specification; the immediate box consists of a product label as well. Note :This is shipped test conditions ※Remarks: This product should be operated in forward bias. If a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage. ATTENTION: Electrostatic Discharge (ESD) protection The symbol to the left denotes that ESD precaution is needed. ESD protection for GaP and AlGaAs based chips is necessary even though they are relatively safe in the presence of low static-electric discharge. Parts built with AlInGaP , GaN, or/and InGaN based chips are STATIC SENSITIVE devices. ESD precaution must be taken during design and assembly. If manual work or processing is needed, please ensure the device is adequately protected from ESD during the process.
Official Product HT Part No. B3FYBFCH-F6C-0001HR Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 3/26/ 2019 Version 1.0 Page 6/15 Label Specifications ■Harvatek P/N: B 3FY B FCH F6- 0001 HR ■ Lot No.: Product Dice Current Taping PCB B:12 R:5mA G/B:2mA 1. Taping style 2. Q’ty Package Color Series Number 2.82(L)x2.82(W)x0.65(H) mm FCH : RGB(Full Color) 0001~ZZZZ
Official Product HT Part No. B3FYBFCH-F6C-0001HR Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 3/26/ 2019 Version 1.0 Page 7/15 Specifications Range ■Luminous Intensity (Iv) Bin: Luminous Intensity (Iv) Bin:R@5mA;G/B@2mA HT- B3FYBFCH Series IV Red Green Blue Min 14 Max 28 Min 16 Max 32 Min 2.8 Max 5.6 Bin name(R/G/B):V009 Note: It maintains a tolerance of ±10% on luminous intensity Dominant Wavelength (λD) Bin: HT- B3FYBFCH Series WD Red Green Blue Min 617 Max 627 Min 527 Max 537 Min 465 Max 475 Bin name(R/G/B):D007 Note: It maintains a tolerance of + 0.5nm on color Forward Voltage (Vf) Bin: HT- B3FYBFCH Series VF Red Green Blue Bin name(R/G/B):F002 Note: It maintains a tolerance of ±0.05V on forward voltage measurements
Official Product HT Part No. B3FYBFCH-F6C-0001HR Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 3/26/ 2019 Version 1.0 Page 8/15 Product Features Electro-Optical Characteristics (TSoldering , 25 oC) Series Emitting Color Material VF(V) Wavelength λ(nm) IV(mcd) Viewing Angle 12 typ max λD λP △ λ min B3FYBFCH-F6 Red AllnGaP 2.0 2.4 621 629 20 14 >120 Green InGaN 2.6 3.0 531 524 30 16 >120 Blue InGaN 2.7 3.0 467 462 20 2.8 >120 Package Outline Dimension and Recommended Soldering Pattern for Reflow Soldering (Unit:mm Tolerance: +/ -0.1) Outline Dim. Soldering Pattern Soldering terminals may shift in the x, y direction.
Official Product HT Part No. B3FYBFCH-F6C-0001HR Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 3/26/ 2019 Version 1.0 Page 9/15 ( TSoldering 25 ℃) Absolute Maximum Ratings *Condition for IFP is pulse of 1/10 duty and 0.1msec width *Remarks:This product should be operated in forward bias.If a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage. Series PD (mW) VR(V) IF (mA) IFP (mA)* Top(°C) Color Power Dissipation Reverse Voltage Forward Current Pulse Forward Current Operating Temperature Red 15 5 5 15 -30~+80 Green 10 5 2 15 Blue 10 5 2 15
Official Product HT Part No. B3FYBFCH-F6C-0001HR Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 3/26/ 2019 Version 1.0 Page 10/15 Precaution for Use 1. The chips should not be used directly in any type of fluid such as water, oil, organic solvent, etc. 2. When the LEDs are illuminating, the maximum ambient temperature should be first considered before operation. 3. LEDs must be stored in a clean environment. A sealed co ntainer with a nitrogen atmosphere is necessary if the storage period is over 3 months after shipping. 4. The LEDs must be used within 4 weeks after unpacked. Unused products must be repacked in an anti-electrostatic package, folded to close any opening and then stored in a dry and cool space. 5. The appearance and specifications of the products may be modified for improvement without further notice. 6. The LEDs are sensitive to the static electricity and surge. It is strongly recommended to use a grounded wrist ban d and anti -electrostatic glove when handling the LEDs.If a voltage over the absolute maximum rating is applied to LEDs, it will damage LEDs.Damaged LEDs will show some abnormal characteristics such as remarkable increase of leak current, lower turn-on voltage and getting unlit at low current.
Official Product HT Part No. B3FYBFCH-F6C-0001HR Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 3/26/ 2019 Version 1.0 Page 11/15 Packaging Tape Dimension Dim. A Dim. B Dim. C Q’ty/Reel
Official Product HT Part No. B3FYBFCH-F6C-0001HR Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 3/26/ 2019 Version 1.0 Page 12/15 Reel Dimension Packing 28 boxes per carton is available depending on shipment quantity. (裝貨量每一紙箱可裝載 28 袋)
Official Product HT Part No. B3FYBFCH-F6C-0001HR Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 3/26/ 2019 Version 1.0 Page 13/15 Dry Pack All SMD optical devices are MOISTURE SENSITIVE. Avoid exposure to moisture at all times during transportation or storage. Every reel is packaged in a moisture protected anti-static bag. Each bag is properly sealed prior to shipment. A humidity indicator will be included in the moisture protected anti-static bag prior to shipment. The packaging sequence is as follows: Baking(烘烤) Baking before soldering is recommended when the package has been unsealed for 4weeks. (當包裝已開封四週,在焊接時建議先烘烤) The conditions are as following: MBB is unsealed ≤ 672 hrs, Recommended baking conditions：50±3℃×(3hrs). MBB is unsealed > 672 hrs, Recommended baking conditions：60±3℃×(8~12hrs)and<5%RH, tape reel type. 100±3℃×(45min~1hr), bulk type. 130±3℃×(15min~30min), bulk type. Precautions 1. Avoid exposure to moisture at all times during transportation or storage. 2. Anti-Static precaution must be taken when handling GaN, InGaN, and AlInGaP products. 3. It is suggested to connect the unit with a current limiting resistor of the proper size. Avoid applying a reverse voltage beyond the specified limit.
Official Product HT Part No. B3FYBFCH-F6C-0001HR Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 3/26/ 2019 Version 1.0 Page 14/15 4. Avoid operation beyond the limits as specified by the absolute maximum ratings. 5. Avoid direct contact with the surface through which the LED emits light. 6. If possible, assemble the unit in a clean room or dust-free environment. Reflow Soldering Recommend soldering paste specifications: 1. Operating temp.: Above 220℃ ,60 sec. 2. Peak temp.:260 ℃Max.,10sec Max. 3. Reflow soldering should not be done more than two times. 4. Never attempt next process until the component is cooled down to room temperature after reflow. 5. The recommended reflow soldering profile (measured on the surface of the LED terminal) is as following: Lead-free Solder Profile Reworking Rework should be completed within 5 seconds under 260 ℃. The iron tip must not come in contact with the copper foil. Twin-head type is preferred. Cleaning Following are cleaning procedures after soldering: An alcohol-based solvent such as isopropyl alcohol (IPA) is recommended.
Official Product HT Part No. B3FYBFCH-F6C-0001HR Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 3/26/ 2019 Version 1.0 Page 15/15 Temperature x Time should be 50℃ x 30sec. or <30℃ x 3min Ultrasonic cleaning: < 15W/ bath; bath volume ≤ 1liter Curing: 100 ℃ max, <3min Cautions of Pick and Place Avoid stress on the resin at elevated temperature. Avoid rubbing or scraping the resin by any object. Electric-static may cause damage to the component. Please ensure that the equipment is properly grounded. Use of an ionizer fan is recommended. Revise History Rev. Descriptions Date Page 1.0 - 3/26/2019 -