STS17NH3LL_0710 STMICROELECTRONICS | Alldatasheet

Document overview

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  • PDF pages: 12

Technical content

Datasheet sections

  • 1 Electrical ratings
  • 2 Electrical characteristics
  • 2.1 Electrical characteristics (curves)
  • 3 Test circuit
  • 4 Package mechanical data
  • 5 Revision history

Features

■ Optimal RDS(on) x Qg trade-off @ 4.5 V ■ Conduction losses reduced ■ Improved junction-case thermal resistance ■ Low threshold device

Applications

■ Switching application

Description

This device utilizes the latest advanced design rules of ST’s proprietary STripFET™ technology. This process coupled to unique metallization techniques realizes the most advanced low voltage Power MOSFET in SO-8 ever produced. Figure 1. Internal schematic diagram

  1. This value is rated according to Rthj-pcb

Table 1. Device summary

1 Electrical ratings

Table 2. Absolute maximum ratings

  1. This value is rated according to Rthj-pcb
  2. Pulse width limited by safe operating area

Table 3. Thermal resistance

  1. When mounted on 1inch² FR-4 board, 2oz of Cu and t< 10sec

Table 4. Avalanche data

2 Electrical characteristics

Table 5. On/off states Table 6. Dynamic

Table 7. Switching times Table 8. Source drain diode

  1. Pulsed: pulse duration=300µs, duty cycle 1.5%

2.1 Electrical characterist ics (curves)

Figure 2. Safe operating area Figure 3. Thermal impedance Figure 4. Output characteristics Figure 5. Transfer characteristics Figure 6. Normalized B VDSS vs temperature Figure 7. Static drain-source on resistance

3 Test circuit

Figure 13. Switching times test circuit for Figure 14. Gate charge test circuit Figure 15. Test circuit for inductive load Figure 16. Unclamped inductive load test Figure 17. Unclamped inductive wavefo rm Figure 18. Switching time waveform

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com

DIM. mm. inch A 1.75 0.068 a1 0.1 0.25 0.003 0.009 a2 1.65 0.064 a3 0.65 0.85 0.025 0.033 b 0.35 0.48 0.013 0.018 b1 0.19 0.25 0.007 0.010 C 0.25 0.5 0.010 0.019 c1 45 (typ.) D 4.8 5.0 0.188 0.196 E 5.8 6.2 0.228 0.244 e 1.27 0.050 e3 3.81 0.150 F 3.8 4.0 0.14 0.157 L 0.4 1.27 0.015 0.050 M 0.6 0.023 S 8 (max.) SO-8 MECHANICAL DATA

5 Revision history

Table 9. Document revision history