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6.9 A, 30 V , RDS(ON) 34 m

Dual N-Channel Mode Power MOSFET Elektronische Bauelemente 22-Nov-2010 Rev. A Page 1 of 4 http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually. A H B M D C J K F L E N G RoHS Compliant Product A suffix of “-C” specifies halogen & lead-free

DESCRIPTION

These miniature surface mount MOSFETs utilize high cell density process Low RDS(on) assures minimal power loss and conserves energy, making this device ideal for use in power management circuitry. Typical applications are PWMDC-DC converters, power management in portable and battery- powered products such as computers, printers, battery charger, telecommunication power system, and telephones power system.

FEATURES

 Low RDS(on) provides higher efficiency and extends battery life.  Miniature SOP-8 surface mount package saves board space.  High power and current handling capability.  Low side high current DC-DC Converter applications. PRODUCT SUMMARY SSG4920N VDS(V) RDS(on) m( I D(A) 30 34@VGS=10V 6.9 41@VGS=4.5V 6.0

PACKAGE INFORMATION

SOP-8 2.5K 13’ inch MAXIMUM RATINGS (TA = 25°C unless otherwise specified) PARAMETER SYMBOL RATINGS UNIT Drain-Source Voltage V DS 30 V Gate-Source Voltage V GS ±20 V Continuous Drain Current 1 ID @ TA = 25°C ±6.9 A ID @ TA = 70°C ±5.6 A Pulsed Drain Current 2 I DM ±40 A Continuous Source Current (Diode Conduction) 1 I S 1.7 A Total Power Dissipation 1 PD @ TA = 25°C 2.1 W PD @ TA = 70°C 1.3 W Operating Junction & Storage Temperature Range T J, TSTG -55 ~ 150 °C THERMAL RESISTANCE RATINGS Thermal Resistance Junction-Ambient (Max.) 1 t ≦ 10 sec RθJA 62.5 °C / W Steady State 110 °C / W Notes 1 Surface Mounted on 1” x 1” FR4 Board. 2 Pulse width limited by maximum junction temperature. SOP-8 REF. Millimeter REF. Millimeter Min. Max. Min. Max. A 5.80 6.20 H 0.35 0.49 B 4.80 5.00 J 0.375 REF. C 3.80 4.00 K 45 ° D 0 ° 8 ° L 1.35 1.75 E 0.40 0.90 M 0.10 0.25 F 0.19 0.25 N 0.25 REF. G 1.27 TYP. D D S S G G D D

Dual N-Channel Mode Power MOSFET Elektronische Bauelemente 22-Nov-2010 Rev. A Page 2 of 4 http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified) PARAMETER SYMBOL MIN. TYP. MAX. UNIT TEST CONDITIONS STATIC Gate Threshold Voltage V GS(th) 1 - - V V DS= VGS, ID= 250μA Gate-Body Leakage Current I GSS - - ±100 nA V DS= 0V, VGS= ±20V Zero Gate Voltage Drain Current I DSS - - 1 μA V DS= 24V, VGS= 0V - - 10 μA V DS= 24V, VGS= 0V, TJ= 55°C On-State Drain Current 1 I D(on) 20 - - A V DS= 5V, VGS= 10V Drain-Source On-Resistance 1 R DS(ON) - - 34 mΩ VGS= 10V, ID= 6.9A - - 41 V GS= 4.5V, ID= 6.0A Forward Transconductance 1 g fs - 25 - S V DS= 15V, ID= 6.9A Diode Forward Voltage V SD - 0.77 - V I S= 1.7A, VGS= 0V DYNAMIC 2 Total Gate Charge Q g - 4.0 - nC ID= 6.9A VDS= 15V VGS= 4.5V Gate-Source Charge Q gs - 1.1 - Gate-Drain Charge Q gd - 1.4 - Turn-On Delay Time T d(on) - 12 - nS VDD= 15V ID= 1A VGEN= 10V RL= 15Ω Rise Time T r - 10 - Turn-Off Delay Time T d(off) - 60 - Fall Time T f - 15 - Source-Ddrain Reverse Recovery Time Trr - 50 - I F=1.7A, Di / Dt = 100A/μs Notes 1 Pulse test ：PW ≦ 300 μs duty cycle ≦ 2%. 2 Guaranteed by design, not s ubject to production testing.

Dual N-Channel Mode Power MOSFET Elektronische Bauelemente 22-Nov-2010 Rev. A Page 3 of 4 http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually. TYPICAL ELECTRICAL CHARACTERISTICS

Dual N-Channel Mode Power MOSFET Elektronische Bauelemente 22-Nov-2010 Rev. A Page 4 of 4 http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually. TYPICAL ELECTRICAL CHARACTERISTICS