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Hall Latch - High Sensitivity 1 V3.10 Nov 1, 201 3 Packages Features and Benefits 3 pin SOT23 (suffix SO) 3 pin SIP (suffix UA) – Wide operating voltage range from 2.5V to 24V – High magnetic sensitivity – Multi-purpose – CMOS technology – Low current consumption – Chopper-stabilized amplifier stage – Open drain output – Superior temperature stability – Insensitive to physical stress – Tiny SOT23 3L or flat SIP 3L both RoHS Compliant packages Functional Block Diagram Application Examples – Automotive, Consumer and Industrial – Solid-state switch – Brushless DC motor commutation – Speed detection – Angular position detection – Linear position detection – Proximity detection General Description The SS559 is a uni polar Hall-effect sensor IC fabr i- cated from mixed signal CMOS technology. T he de- vice integrates a voltage regulator, Hall sensor with dynamic offset cancellation system, Schmitt trigger and an open-drain output driver, all in a single pac k- age. It incorporates advanced chopper stabilization techniques to provide accurate and stab le magnetic switch points. There are many applications for this HED - Hall Electronic Device - in addition to those listed above. The design, specifications and performance have been optimized for commutation applications in 5V and 12V brushless DC motors. Thanks to its wide operating voltage range and extended choice of temperature range, it is quite suitable for use in automotive, industrial and consumer applications. The device is delivered in a Small Outline Transistor (SOT) for surface mount process or in a Plastic Single In Line (SIP 3L flat) for through- hole mount. Both 3-lead packages are RoHS compliant. VDD OUT Voltage Regulator Chopper Hall Plate GND Pin 1 – VDD Pin 1 – VDD Pin 2 – GND Pin 2 – OUT Pin 3 – OUT Pin 3 – GND

Hall Latch - High Sensitivity 2 V3.10 Nov 1, 201 3 Glossary of Terms MilliTesla (mT), Gauss Units of magnetic flux density: 1mT = 10 Gauss RoHS Restriction of Hazardous Substances SOT Small Outline Transistor (SOT package) – also referred with the package code “SO” ESD Electro-Static Discharge BLDC Brush-Less Direct-Current Operating Point (BOP) Magnetic flux density applied on the branded side of the package which turns the output driver ON (VOUT = VDSon) Release Point (BRP) Magnetic flux density applied on the branded side of the package which turns the output driver OFF (VOUT = high) Unique Features Based on mixed signal CMOS technology, the SS559 is a Hall-effect device with high magnetic sensitivity. This multi-purpose latch meets most of the application requirements. The chopper-stabilized amplifier uses switched capacitor technique to suppress the offset generally observed with Hall sensors and amplifiers. The CMOS technology m akes this advanced technique possible and contributes to smaller chip size and lower current consumption than bipolar technology. The small chip size is also an important factor to minimize the effect of physical stress. This combination results in more stable magnetic characteristics and enables faster and more precise design. The wide operating voltage from 2.5V to 24V, low current consumption and large choice of operating temperature range according to “L”, and “E” specification make this device suitable for automotive, industrial and consumer applications. Pin Definitions and Descriptions SOT Pin № SIP Pin № Name Type Function 1 1 VDD Supply Supply Voltage pin 2 3 OUT Output Open Drain Output pin 3 2 GND Ground Ground pin

Hall Latch - High Sensitivity 3 V3.10 Nov 1, 201 3 Absolute Maximum Ratings Parameter Symbol Value Units Supply Voltage VDD 28 V Supply Current IDD 50 mA Output Voltage VOUT 28 V Output Current IOUT 50 mA Storage Temperature Range TS -50 to 150 °C Maximum Junction Temperature TJ 165 °C Operating Temperature Range Symbol Value Units Temperature Suffix “E” TA -40 to 85 °C Temperature Suffix “K” TA -40 to 125 °C Temperature Suffix “L” TA -40 to 150 °C Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximum-rated conditions for extend- ed periods may affect device reliability. General Electrical Specifications DC Operating Parameters TA = 25°C, VDD= 2.5V to 24V (unless otherwise specified) Parameter Symbol Test Conditions Min Typ Max Units Supply Voltage VDD Operating 2.2 24 V Supply Current IDD B < BRP 5 mA Output Saturation Voltage VDSon IOUT = 20mA, B > BOP 0.5 V Output Leakage Current IOFF B < BRP VOUT = 24V 1 10 µA Output Rise Time tr RL = 1kΩ, CL = 20pF 0.25 µs Output Fall Time tf RL = 1kΩ, CL = 20pF 0.25 µs Maximum Switching Frequency FSW --- 10 KHz Package Thermal Resistance RTH Single layer (1S) Jedec board 301 °C/W Note: The output of SS559 will be switched after the supply voltage is over 2.2V, but the magnetic characteris- tics won't be normal until the supply is over 2.5V. Magnetic Specifications DC Operating Parameters VDD = 2.5 to 24V (unless otherwise specified) Package Parameter Symbol Test Conditions Min Typ Max Units UA Operating Point BOP Ta=25°C Vdd=5V DC 10 30 55 G Release Point BRP -55 -30 -10 G Hysteresis BHYST 60 G SO Operating Point BOP Ta=25°C Vdd=5V DC -55 -30 -10 G Release Point BRP 10 30 55 G Hysteresis BHYST 60 G

Hall Latch - High Sensitivity 4 V3.10 Nov 1, 201 3 Output Behavior versus Magnetic Pole DC Operating Parameters TA = -40°C to 150°C, VDD = 2.5 to 24V (unless otherwise specified) Test Conditions (UA) Test Conditions (SO) OUT B < BRP B > BRP High B > BOP B < BOP Low The SOT-23 device is reversed from the UA package. The SOT-23 output transistor will be turned on(drops low) in the presence of a sufficiently strong North pole magnetic field applied to the marked face and turned off(hoists high) in the presence of a sufficiently strong South pole magnetic field. Detailed General Description The SS559 exhibits latch magnetic switching characteristics. Therefore, it requires both south and north poles to operate properly. The OUT pin of these devices switches low (turns on) when a magnetic field perpendicular to the Hall se nsor ex- ceeds the operate point threshold, BOP. After turn-on, the output voltage is VDSon. Note that the device latches, that is, a south pole of sufficient strength towards the branded surface of the device turns the device on. The device re- mains on if the south pole is removed (B→0). This latching property defines the device as a magnetic memory. When the magnetic field is reduced below the release point, BRP, the OUT pin turns off (goes high). The difference in the magnetic operating and release points is the hysteresis, BHYST, of the device. This built-in hysteresis prevents output oscillation near the switching point, and allows clean switching of the output even in the presence of exter- nal mechanical vibration and electrical noise. The device behaves as a latch with symmetric operating and release switching points (B OP=|BRP|). This means 0mT 0mT Output level Output level OUT = High Flux density OUT = High BOP 30Gs typ OUT = Low OUT = Low UA package - Latch characteristic BOP 30Gs typ BRP -30Gs typ BRP -30Gs typ Flux density SE package - Latch characteristic BHYS BHYS

Hall Latch - High Sensitivity 5 V3.10 Nov 1, 201 3 magnetic fields with equivalent strength and opposite direction drive the output high and low. Powering-on the device in the hysteresis region (less than BOP and higher than BRP) allows an indeterminate output state. The correct state is attained after the first excursion beyond BOP or BRP. The SOT-23 device is reversed from the UA package. The SOT-23 output transistor will be latched on in the pres- ence of a sufficiently strong North pole magnetic field applied to the marked face.

Application Information

It is strongly recommended that an external bypass capacitor be connected (in close proximity to the Hall sensor) between the supply (VDD Pin) and ground (GND Pin) of the device to reduce both external noise and noise gener- ated by the chopper stabilization technique. As is shown in the following first figure, a 0.1μF capacitor is typical. For reverse voltage protection, it is recommended to connect a resistor or a diode in series with the VDD pin. When using a resistor, three points are important: - the resistor has to limit the reverse current to 50mA maximum (VCC / R1 ≤ 50mA) - the resulting device supply voltage VDD has to be higher than VDD min (VDD = VCC – R1*IDD) - the resistor has to withstand the power dissipated in reverse voltage condition (PD = VCC 2/R1) When using a diode, a reverse current cannot flow and the voltage drop is almost constant (≈0.7V). Therefore, a 100Ω/0.25W resistor for 5V application and a diode for higher supply voltage are recommended. Both solutions provide the required reverse voltage protection. When a weak power supply is used or when the device is intended to be used in noisy environment, it is reco m- mended the following second figure is used. The low-pass filter formed by R1 and C1 and the zener diode Z1 bypass the disturbances or voltage spikes occur- ring on the device supply voltage VDD. The diode D1 provides additional reverse voltage protection. SS559 VDD GND OUT SS559 R1:100 VDD GND OUT Automotive and Severe EnvironmentProtection Circuit Typical Three-Wire Application Circuit

Hall Latch - High Sensitivity 6 V3.10 Nov 1, 201 3 The SS559 have been optimized for commutation applications in 5V and 12V brushless DC motors. The follow figure is the typical application circuit for 3 phase brushless DC motors. Standard information regarding manufacturability of Eastera’s Hall IC with different soldering processes Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods: Reflow Soldering SMD’s (Surface Mount Devices)

  • IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2)
  • EIA/JEDEC JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles according to table 2) Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
  • EN60749-20 Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
  • EIA/JEDEC JESD22-B106 and EN60749-15 Resistance to soldering temperature for through-hole mounted devices Iron Soldering THD’s (Through Hole Devices)
  • EN60749-15 Resistance to soldering temperature for through-hole mounted devices Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
  • EIA/JEDEC JESD22-B102 and EN60749-21 Solderability ESD Precautions Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products.

Hall Latch - High Sensitivity 7 V3.10 Nov 1, 201 3

Package Information

Package UA, 3-Pin SIP: 4.0 ± 0.01 1.27 2.13 1.87 1.00 1.20 45° ± 1° 1.52 ± 0.1 3° ± 1° 0.75 ± 0.05 3.0 ± 0.01 0.44± 0.01 0.05 ± 0.05 1.6.± 0.1 0.84(Nom) 3° ± 1° 6° ± 1° 6° ± 1° 3° ± 1° 14 .5 ± 1 Active Area Depth: Sensor Location Notes: 1). Controlling dimension : mm ; 2). Leads must be free of flash and plating voids ; 3). Do not bend leads within 1 mm of lead to package interface ; 4). PINOUT: Pin 1 V DD Pin 2 GND Pin 3 Out put 0.39± 0.01 0.38 ± 0.01 2.54

Hall Latch - High Sensitivity 8 V3.10 Nov 1, 201 3 Package SO, 3-Pin SOT-23:

Ordering Information

Part No. Pb-free Temperature Code Package Code Packing SS559ESOT YES -40°C to 85°C SOT-23 7-in. reel, 3000 pieces/reel SS559EUA YES -40°C to 85°C TO-92 Bulk, 1000 pieces/bag SS559KSOT YES -40°C to 125°C SOT-23 7-in. reel, 3000 pieces/reel SS559KUA YES -40°C to 125°C TO-92 Bulk, 1000 pieces/bag SS559LSOT YES -40°C to 150°C SOT-23 7-in. reel, 3000 pieces/reel SS559LUA YES -40°C to 150°C TO-92 Bulk, 1000 pieces/bag 0.56 0.66 0.95 1.50 Chip Bottom View of SOT-23 Package 2.70 3.10 1.00 1.30 0.70 0.90 0.00 0.10 0.35 0.50 0.10 0.25 0.20 Min 2.60 3.00 1.50 1.80 1.70 2.10 2 1 Top Side Vie End Notes 1). PINOUT: Pin 1 VDD Pin 2 Output Pin 3 GND 2). All dimensions are in millimeters;