SS545LBG SKTECHNOLGY | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 3
Technical content
Features
- Metal silicon junction, majority carrier conduction
- For surface mounted applications
- Low power loss, high efficiency
- High forward surge current capability
- For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
- A MECHANICAL DATA Case: SMB Terminals: Solderable per MIL-STD-750, Method 2026 pprox. Weight: 0.055g / 0.002oz PINNING PIN
DESCRIPTION
Simplified outline SMB and symbol Top View Marking Code: SL545B SS545LBG 1 of 3 REV.08
Fig.2 Typical Reverse Characteristics Instaneous Current ( μA)Reverse 20 40 60 800 T =25J °C T =100J °C Percent of Rated Peak Reverse Voltage（%） 100 101 102 103 104 Fig.4 Typical Junction Capacitance Junction Capacitance ( pF) Reverse Voltage (V) Fig.3 Typical Forward Characteristic Instaneous Forward Current (A) Instaneous Forward Voltage (V) 0.01 100 100 Fig.6- Typical Transient Thermal Impedance Transient Thermal Impedance（ /W）°C t, Pulse Duration（sec） 0.1 1 10 0.1 0 0.4 0.8 1.0 0.1 10 100 500 1001 1000 T =25J °C Fig.1 Forward Current Derating Curve 1.0 2.0 3.0 4.0 5.0 6.0 0.0 25 50 75 100 125 Average Forward Current (A) Case °C) Temperature ( 150 10 100 Fig.5 Maximum Non-Repetitive Peak Forward Surage Current Peak A)Forward Surage Current ( Number of Cycles at 60Hz 8.3 ms Single Half Sine Wave (JEDEC Method) 125 175 150 100 105 2 of 3 REV.08 SS545LBG
The recommended mounting pad size Unit：mm(mil) 3.0(118)1.8(71) 2.54(100) 1.8(71) PACKAGE OUTLINE Plastic surface mounted package; 2 leads SMB PACKAGE OUTLINE Plastic surface mounted package; 2 leads SMB E A D b L A C E1 V AM UNIT mm max min A CE D E1 L 0.8 1.5 b 1.9 2.2 mil max min 0.20 0.05 96 185 155 220 84 160 130 200 632 877.9 2.0 SMB mechanical data 3 of 3 REV.08 SS545LBG