SRP5030T-100M

KTD3134 KINETIC | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 24

Technical content

Features

• Wide input range: 2.7V~5.5V
• High efficiency step-up 2-Channel LED driver
• 2-Ch current sinks, up to 8-LEDs per string  Up to 29.8mA/Ch in backlight mode and up to 59.6mA/Ch in flash mode  +/-0.6% current matching at 20.2mA  +/-1.5% current accuracy at 20.2mA
• I2C/PWM dual dimming control scheme  11-bit I2C exponential or linear mapping with programmable transition ramp time  Wide range PWM dimming with programable transition ramp time ▪ 100Hz to 100kHz frequency ▪ 0.2% to 100% duty cycle at 20kHz
• Programmable current sink turn on/off ramp time and shape
• Selectable boost converter switching frequency 1MHz or 500kHz with 20% shift up option
• Programmable input PWM hysteresis to minimize jitter at low PWM duty cycle
• Programmable OVP (25.9V/32V) and current limit (2.6A/1.8A)
• Programmable flash current and timeout
• LED open/short protection
• Status reporting through I2C interface

Applications

• Smartphone/Tablet Backlight and Selfie Flash Brief Description KTD3134 is the ideal power solution for LED backlighting and selfie flash in medium to large size LCD panels. It is a highly integrated step-up DC-DC converter operating with an input voltage from 2.7V to 5.5V, accommodating 1 -cell lithium ion batteries or 5V supply. It includes a high voltage power NMOS, as well as two current sinks, resulting in a simpler and smaller solution with fewer external components. High switching frequency allows the use of a smaller inductor and capacitor. Each of the two regulated current sinks can regulate up to 29.8mA in backlight mode. With a maximum of 32V at the output of the step-up converter, each string can connect up to 8-LED in series for a 16-LED application. KTD3134 is equipped with I 2C interface for various controls. For additional flexibility, PWM dimming with wide range frequency and duty cycle is included to support Content Adaptive Brightness Control (CABC). KTD3134 also adds selfie flash function to the existing backlight solution by bo osting the sink current up to 59.6mA/Ch and integrating a flash timeout of up to 1.5sec. Various protection features are built into KTD3134, including cycle -by-cycle inductor current limit protection, output over voltage protection, LED fault (open or short) protection and thermal shutdown protection. KTD3134 is available in a RoHS compliant 12-ball 1.19mm x 1. 64mm WLCSP or a 16 -lead 3mm x 3mm x 0.75mm Thin-QFN package. Typical Application SCL AGND PGND VOUTLX VIN CIN 10µF L VIN 2.7V to 5.5V White LEDs Up to 8 in series PWM SDAMCU HWEN D 10µH VOUT COUT 1µF KTD3134 High Efficiency 2-Channel LED Backlight with Flash Function

t KTD3134 April 2019 - Revision 04a Page 2 Company Confidential Pin Description Pin # Name Function WLCSP-12 TQFN33-16 A1 13 PWM PWM dimming input pin. There is an internal 400kΩ pull-down resistor at this pin to GND. A2 14 SDA Bi-directional data pin of the I2C interface. A3 16 HWEN Active high hardware enable pin. There is an internal 400kΩ pull-down resistor at this pin to GND. B1 10 S1 Regulated output current sink #1. B2 15 SCL Clock input pin of the I2C interface. B3 1 VIN Input supply pin for the IC. C1 11 S2 Regulated output current sink #2. C2, D1 2, 3, 8, 9 AGND Analog ground pin. C3 4 PGND Power ground pin. D2 7 VOUT Output voltage sense pin of the step-up converter. D3 5, 6 LX Switching pin of the step-up converter. MC Metal chassis. Connect to ground for electrical and thermal usage. MC is internally connected to AGND pin. WLCSP-12 Top View 12-Bump 1.19mm x 1.64mm x 0.62mm Top Mark WW = Device ID Code = LI XX = Date Code, YY = Assembly Code ZZZZ = Serial Number TQFN33-16 Top View 16-Lead 3mm x 3mm x 0.75mm Top Mark XX = Device Code YY = Date Code, Z = Assembly Code TOP VIEW TOP VIEW WW XXYY ZZZZ C B A 1 2 3 PWM SDA SCL AGND HWEN VIN PGND AGND VOUT LXD 5 76 8 16 1415 13 VIN AGND AGND PGND LX VOUTLX AGND NC AGND HWEN SDASCL PWM MC

t KTD3134 April 2019 - Revision 04a Page 3 Company Confidential Absolute Maximum Ratings1 (TA = 25C unless otherwise noted) Symbol Description Value Units VIN Input Voltage -0.3 to 6 V LX, VOUT High Voltage Nodes -0.3 to 35 V S1, S2 High Voltage Nodes -0.3 to 22 V SCL, SDA, PWM, HWEN Control Pins -0.3 to VIN+0.3 V TJ Junction Operating Temperature Range -40 to 150 °C TS Storage Temperature Range -65 to 150 °C TLEAD Maximum Soldering Temperature (at leads, 10 sec) 300 °C Thermal Capabilities2 Symbol Description Value Units WLCSP-12 θJA Thermal Resistance – Junction to Ambient 89 C/W PD Maximum Power Dissipation at TA ≤ 25°C 1410 mW ΔPD/ΔT Derating Factor Above TA = 25°C -11.3 mW/°C TQFN33-16 θJA Thermal Resistance – Junction to Ambient 42 C/W PD Maximum Power Dissipation at TA ≤ 25°C 2976 mW ΔPD/ΔT Derating Factor Above TA = 25°C 23.8 mW/°C

Ordering Information

Part Number Marking3 Operating Temperature Package KTD3134EUS-TR LIXXYYZZZZ -40°C to +85°C WLCSP-12 KTD3134EFJ-TR LIYYZ -40°C to +85°C TQFN33-16 1. Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional operation at conditions other than the operating conditions specified is not implied. Only one Absolute Maximum rating should be applied at any one time. 2. Junction to Ambient thermal resistance is highly dependent on PCB layout. Values are based on thermal properties of the device when soldered to an EV board. 3. “XXYYZZZZ” / “YYZ” are the date code, assembly code and serial number / the date code and assembly code.

t KTD3134 April 2019 - Revision 04a Page 4 Company Confidential Electrical Characteristics4 Unless otherwise noted, the Min and Max specs are applied over the full operation temperature range of –40°C to +85°C, while Typ values are specified at room temperature (25°C). VIN = 3.6V. Symbol Description Conditions Min Typ Max Units IC Supply VIN Input operating range 2.7 5.5 V UVLO Input under voltage lockout Rising edge 2.45 2.65 V UVLOHYST UVLO hysteresis 0.05 V IQ IC operating VIN current Switching 1.9 mA ISHDN IC shutdown VIN current Vin = 5.5V, HWEN = GND 0.5 µA ISB IC standby VIN current Standby, VIN = 4.2V, HWEN = SDA = SCL = 1.8V 7 µA Step-Up Converter RDS(ON) NMOS on-resistance 0.2 Ω ILIM Peak NMOS current limit Default setting 2.6 A FSW Oscillator frequency Default setting 1.0 MHz DMAX Maximum duty cycle FSW = 1MHz 94 % VOVP OVP threshold Default setting 32 V Current Sink ISINK Output current accuracy Current setting = 1mA, TA = 25°C -4 4 % Current setting = 20.2mA, TA = 25°C -1.5 1.5 % Current setting = 59.6mA, TA = 25°C -3.5 3.5 % Output current matching5 Current setting = 1mA, TA = 25°C -1.2 1.2 % Current setting = 20.2mA, TA = 25°C -0.8 0.8 % Current setting = 59.6mA, TA = 25°C -0.6 0.6 % VSOV Current sink over voltage threshold 12 V TFAULT Current sink fault delay 6 µs TTIMEOUT Flash timeout Default setting 500 ms Logic Control VTH-L HWEN/PWM logic low threshold 0.4 V VTH-H HWEN/PWM logic high threshold 1.4 V FPWM PWM dimming frequency 0.1 100 kHz TPWM_ON PWM on time 0.1 µs TPWM_OFF PWM off pulse low width 20 ms RPull-Down HWEN/PWM pull down resistors 400 k 4. KTD3134 is guaranteed to meet performance specifications over the –40°C to +85°C operating temperature range by design, characterization and correlation with statistical process controls. 5. The current matching among channels is defined as |ISINK-IAVG|MAX/IAVG.

Figure 1. I2C Compatible Interface Timing characterization and correlation with statistical process controls.

t KTD3134 April 2019 - Revision 04a Page 6 Company Confidential Typical Characteristics VIN = 3.6V, 2P7S LEDs, I LED = 20 .2mA, L = 10µH ( Murata LQH3NPN100MJR ), C IN = 10µF, C OUT = 1µF, I2C register default settings, Temp = 25°C unless otherwise specified. LED Driver Efficiency vs. VIN LED Driver Efficiency vs. LED Current (ILED = 20.2mA) (2P7S) Operating Current (Switching) Switching Frequency vs. VIN HWEN Logic Threshold Voltage PWM Logic Threshold Voltage Efficiency (%) Input Voltage (V) 100 0 5 10 15 20 Efficiency (%) LED Current (mA) Operating Current (mA) Input Voltage (V) 0.8 0.9 1.0 1.1 1.2 1.3 1.4 Switching Frequency (MHz) Input Voltage (V) 0.6 0.7 0.8 0.9 1.0 1.1 1.2 Vth (V) Input Voltage (V) High Low 0.6 0.7 0.8 0.9 1.0 1.1 1.2 Vth (V) Input Voltage (V) High Low 1MHz with 20% shift up 1MHz

t KTD3134 April 2019 - Revision 04a Page 7 Company Confidential Typical Characteristics VIN = 3.6V, 2P7S LEDs, I LED = 20.2mA, L = 10µH ( Murata LQH3NPN100MJR), C IN = 10µF, C OUT = 1µF, I2C register default settings, Temp = 25°C unless otherwise specified. LED Current vs. Current Ratio Code LED Current vs. Current Ratio Code (11 bits, Exponential) (11 bits, Linear) LED Current vs. PWM Duty Cycle (20kHz) LED Current Line Regulation 0 512 1024 1536 2048 LED Current (mA) Current Ratio Code (Dec) 0 512 1024 1536 2048 LED Current (mA) Current Ratio Code (Dec) 0 10 20 30 40 50 60 70 80 90 100 LED Current (mA) Dimming Duty (%) 19.0 19.3 19.6 19.9 20.2 20.5 20.8 21.1 LED Current (mA) Input Voltage (V)

t KTD3134 April 2019 - Revision 04a Page 8 Company Confidential Typical Characteristics VIN = 3.6V, 2P7S LEDs, I LED = 20.2mA, L = 10µH ( Murata LQH3NPN100MJR ), C IN = 10µF, C OUT = 1µF, I2C register default settings, Temp = 25°C unless otherwise specified. Turn On by PWM Turn Off by PWM Turn On by I2C Turn Off by I2C Ramp Up/Down Exponential (256ms) Ramp Up/Down Linear (256ms) Inductor Current 500mA / div 4ms / div VOUT 10V / div PWM 5V / div Inductor Current 500mA / div 4ms / div VOUT 10V / div PWM 5V / div Inductor Current 500mA / div 4ms / div VOUT 10V / div SDA 5V / div Inductor Current 500mA / div 4ms / div VOUT 10V / div SDA 5V / div IS1 20mA / div 100ms / div PWM 2V / div IS1 20mA / div 100ms / div PWM 2V / div

t KTD3134 April 2019 - Revision 04a Page 9 Company Confidential Typical Characteristics VIN = 3.6V, 2P7S LEDs, I LED = 20.2mA, L = 10µH ( Murata LQH3NPN100MJR ), C IN = 10µF, C OUT = 1µF, I2C register default settings, Temp = 25°C unless otherwise specified . Steady State Switching PWM Dimming (20kHz) Turn On with LED Open (OVP = 32V) Turn On with LED Open (OVP = 25.9V) Flash On/Off (100ms timeout) Backlight to Flash to Backlight Inductor Current 500mA / div 1µs / div VOUT AC Coupled 500mV / div LX 20V / div IS1 10mA / div 40µs / div VOUT AC Coupled 200mV / div PWM 2V / div Inductor Current 100mA / div 400µs / div VOUT 10V / div Inductor Current 100mA / div 400µs / div VOUT 10V / div 20ms / div IS1 20mA / div 20ms / div IS1 20mA / div

t KTD3134 April 2019 - Revision 04a Page 10 Company Confidential Functional Block Diagram Functional Description KTD3134 is a unique current regulated step -up (boost) converter. Two current sinks are integrated to drive 2 strings of LEDs with good current matching and accuracy. The voltage step-up is accomplished by a boost topology, using an inductor-based DC-DC switching converter, in which the inductor serves as an energy storage device in the system. Unlike a traditional DC -DC boost converter with a fixed output voltage, the KTD3134 dynamically changes its output voltage depending on th e load. The use of unique control schemes maintains accurate current regulation in each of the two current sinks while leaving the output voltage at a minimum, increasing the overall conversion efficiency. The internal step-up converter dynamically c ontrols the voltage at the output high enough to drive the LED string with the highest total forward voltage. In additional to the normal bac klight control function, KTD3134 also adds the selfie flash function by boosting sink current to a higher level with the flash timeout protection. Hardware Enable & Standby Mode KTD3134 has a logic input HWEN pin to enable/disable the device. When HWEN is set low, the device goes into shutdown mode, all I2C registers are reset to default, and the I2C interface is disabled. Under this condition, the device does not respond to any I2C command. Even when SCL/SDA’s pull up voltage is much less than VIN voltage, it will not cause any extra leakage current. When HWEN is set high, the device go es into standby mode, th e I2C interface is enabled, and the device can respond to I2C command. Under this condition, if SCL/SDA’s pull up voltage is much less than VIN voltage, it can cause a small leakage current. For example, if VIN = 4.2V and SCL/SDA’s pull up voltage is 1.8V, there will be around 7µA additional leakage current from VIN in this standby mode. Based on HWEN’s connection, there are two kinds of power-up sequences, shown in Figure 2 and Figure 3.

• If HWEN is tied to VIN, once VIN goes above around 2.0V, HWEN should stay high for at least twait = 150s time before any I2C command can be accepted. PWM SDA HWEN PGNDAGND VOUTLX VIN COUT CIN L Input Range 2.7V ~ 5.5V White LEDs Up to 8 in series I2C Interface Control PWM Duty Cycle Detection UVLO Step-up Converter Control Over Voltage Protection Sink Voltage Feedback Control LED Brightness Control

2 Current

D

current change smoother. For flash mode, the current is not related to the input PWM duty cycle. change is larger or equal to the number of LSBs programmed, the output LED current starts to follow the change. accurate due to the hysteresis. Table 1. PWM Hysteresis Table 2. Register 0x06 Bits[5:3]’s Minimum Setting 11-bit dimming ratio is needed, the 3-bit LSBs should be programmed first, then the 8-bit MSBs are programmed. Only programming the 3-bit LSBs doesn’t change the current ratio until the 8-bit MSBs are programmed.

t KTD3134 April 2019 - Revision 04a Page 13 Company Confidential In linear mapping 8-bit dimming mode, the LED current per channel can be calculated as: )255~0(256 __ =+= CodeCodeDII PWMFSLEDBLLED where ILED_FS is the backlight full -scale LED current, D PWM is the input PWM duty cycle if PWM dimming is enabled, otherwise DPWM=1. In linear mapping 11-bit dimming mode, the LED current per channel can be calculated as: )2047~1(2048 __ =+= CodeCodeDII PWMFSLEDBLLED For linear mapping 11-bit dimming’s Code 0, current sink and boost converter will be disabled, LED will be turned off. In exponential mapping 8-bit dimming mode, the LED current per channel can be calculated as: )255~0(400 002931237.1 78 __ == CodeDII Code PWMFSLEDBLLED In exponential mapping 11-bit dimming mode, the LED current per channel can be calculated as: )2047~1(400 002931237.1 __ == CodeDII Code PWMFSLEDBLLED For exponential mapping 11 -bit dimming’s Code 0, current sink and boost converter will be disabled, LED will be turned off. Flash LED Current The flash LED current per channel is programmed by Flash Setting Register 0x09 Bits[3:0] (see Table 13), the equation is: ( )15~08.2916 11_ =  ++= CodemACodeI FLASHLED where Code is Flash Setting Register 0x09 Bits[3:0]’s setting. So the flash current can be programmed from 31.66mA to 59.6mA, with 59.6mA as the default setting. Flash mode current is not related to the input PWM duty cycle. Flash Timeout The flash timeout is programmed by Flash Setting Register 0x09 Bits[7:4] (see Table 13). It ranges from 100ms to 1.5sec with 100ms/step, 500ms is the default. If the switching frequency shift up by 20% is selected, the flash timeout will be decreased by 20%. Turn On/Off Ramp When backlight mode or flash mode is enabled from standby mode or disabled to standby mode, the LED current waveform’s turn on/off time is controlled by Turn On/Off Ramp Register 0x07 Bits[7:4] and Bits[3:0] respectively (see Table 11). The 16 options range from 512µs to 16384ms, with 8ms as default. The shape of the turn on/off ramp in backlight mode can also be programmed as exponential or linear through the Control Register 0x03 Bit[2], with exponential as default. Flash mode’s turn on/off ra mp shape is always linear. If the switching frequency shift up by 20% is selected, all ramp times will be decreased by 20%. I2C Dimming Transition Ramp After the turn on ramp is finished, if the LED current is changed from one value to the other by I2C dimming Register 0x04 and Register 0x05 , the transition ramp time can be programmed by Transition Ramp Register 0x08 Bits[3:0] (see Table 12). For Code 0001~1111, there are 15 programmable options (128ms ~ 1024ms) of the ramp time, it is independent of the I2C dimming code change and will keep the same no matter how big the

t KTD3134 April 2019 - Revision 04a Page 14 Company Confidential dimming code change is. For Code 0000, the slope of the ramp is fixed as 1us/step, so the final transition ramp time is dependent on the 11-bit I2C dimming code change. When the system switches between backlight mode and flash mode, the LED current transition ramp will always choose Code 0000 to minimize the transition time . If the switching frequency shift up by 20% is selected, all transition times will be decreased by 20%. PWM Dimming Transition Ramp After the turn on ramp is finished, if the LED current is changed from one value to the other by PWM dimming duty cycle, the transition ramp time can be programmed by Transition Ramp Register 0x08 Bits[6:4] (see Table 12). For this transition ramp, its slope is fixed, so the final transition ramp time is dependent on the change of the PWM duty cycle. If the switching frequency shift up by 20% is selected, all transition times will be decreased by 20%. Channel Enable/Disable To disable any channel, there are two options.

• Connect the associated sink pin to GND. During the startup, the IC will automatically detect and disable the corresponding channel.
• Program PWM Register 0x06 Bits[1:0] (See Table 10) to enable/disable the channel(s), with enable as default. Switching Frequency The step-up converter’s switching frequency can be programmed to 1MHz or 500kHz by Control R egister 0x03 Bit[6] (See Table 7), with 1MHz as default. The adjustment of the switching frequency can optimize the efficiency under different load current conditions. The frequency can also be programmed to shift up by 20% using the Control Register 0x03 Bit[7], with no shift as default. The frequency shift function is to prevent noise interference if the selected switching frequency is within the sensitive frequency range of the system. Over Voltage Protection (OVP) The output voltage of the step-up converter is protected by OVP, its threshold can be programmed by the Control Register 0x03 Bit[5] (See Table 7) as 32V or 25.9V, with 32V as default. Inductor Current Limit Protection The step -up converter is protected by cycle -by-cycle inductor current limit protection, its threshold can be programmed by the Control Register 0x03 Bit[3] (See Table 7) as 2.6A or 1.8A, with 2.6A as default. Software Reset All the I2C registers can be reset to their default settings by writing ‘1’ to the Software Reset Register 0x01 Bit[0] (see Table 5), this bit will be reset to ‘0’ automatically after the software reset. LED Fault Protection Each current sink is protected against LED short or open conditions. If LED short circuit condition arises, the current sink continues to regulate until the sink node voltage goes above VSOV (12V) for more than 6µs, then the Current Sink Fault Protection is triggered, the boost converter will be stopped to prevent VOUT from rising up, and current sink will be kept on to discharge VOUT. In case of an LED failing open, the current sink voltage of the failed string will go close to ground and dominate the boost conv erter control loop. As a result, the output voltage will increase until it reac hes the over voltage threshold. Once the over voltage incident is triggered , the boost converter will be turned off, and all the other healthy channels will be on to discharge VOUT. During the rise of VOUT, if the healthy channels’ sink voltages reach VSOV (12V) for 6µs before VOUT reaches its over voltage threshold, this will trigger LED short protection, not LED open protection. After LED open or short protection, user needs to restart the IC by toggling HWEN or sending software reset command or resetting backlight/flash mode. UVLO Under voltage lock-out (UVLO) featured is included to monitor the input voltage VIN. Once VIN drops below UVLO falling threshold, the current sinks are disabled and the boost converter stop s switching. After VIN increases above UVLO rising threshold, the boost converter and the current sinks will resume to their previous setting.

t KTD3134 April 2019 - Revision 04a Page 15 Company Confidential Thermal Shutdown Thermal shutdown feature is included to monitor the IC’s junction temperature. If it reaches 150°C, the current sinks are disabled and the boost converter stop s switching. Once it drops 15°C to approximately 135 °C, the boost converter and the current sinks will resume to their previous setting. Status Report Various status conditions can be reported through I 2C interface by the read-only Status Register 0x0A (See Table 14), including channel fault (LED open or short), flash timeout, OVP, UVLO, OCP (inductor current limit) and thermal shutdown. Channel fault, UVLO and thermal shutdown are real -time results when backlight/flash mode is enabled and it can be reset by toggling backlight/flash mode. The remaining faults are latched results and can be reset by reading back Status Register 0x0A through I 2C interface or toggling backlight/flash mode. All the status bits can also be reset by VIN power on reset, software reset or toggling HWEN.

Application Information

KTD3134 supports the I2C bus protocol. A device that sends data onto the bus is defined as a transmitter and a device receiving data as a receiver. The device that controls the bus is called a master, whereas the devices controlled by the master are known as slaves. A master device mu st generate the serial clock (SCL), control bus access and generate START and STOP conditions to control the bus. KTD3134 operates as a slave on the I2C bus. Within the bus specifications a standard mode (100kHz maximum clock rate) and a fast mode (400kHz maximum clock rate) are defined. KTD3134 works in both modes. Connections to the bus are made through the open-drain I/O lines SDA and SCL. The following bus protocol has been defined in Figure 4:

• Data transfer may be initiated only when the bus is not busy.
• During data transfer, the data line must remain stable whenever the clock line is HIGH. Changes in the data line while the clock line is high are interpreted as control signals. Accordingly, the following bus conditions have been defined: Bus Not Busy Both data and clock lines remain HIGH. Start Data Transfer A change in the state of the data line, from HIGH to LOW, while the clock is HIGH, defines a START condition. Stop Data Transfer A change in the state of the data line, from LOW to HIGH, while the clock line is HIGH, defines the STOP condition. Data Valid The state of the data line represents valid data when, after a START condition, the data line is stable for the duration of the HIGH period of the clock signal. The data on the line must be changed during the LOW period of the clock signal. There is one clock pulse per bit of data. Each data transfer is initiated with a START condition and terminated with a STOP condition. The number of data bytes transferred between START and STOP conditions are not limited, and are determined by the master device. The information is transferred byte-wise and each receiver acknowledges with a ninth bit. Acknowledge Each receiving device, when addressed, is obliged to generate an acknowledge after the reception of each byte. The master device must generate an extra clock pulse that is associated with this acknowledge bit. A device that acknowledges must pull down the SDA line during the acknowledge clock pulse in such a way that the SDA line is stable LOW during the HIGH period of the acknowledge -related clock pulse. Setup and hold times must also be taken into account.

the register address first to define which register data to read. Figure 6 shows the steps of the I2C read cycle. Figure 6. I2C Read Cycle

• Master generates start condition.
• Master sends 7-bit slave address (0110110 for KTD3134) and 1-bit data direction ‘0’ for write.
• Slave sends acknowledge if the slave address is matched.
• Master sends 8-bit register address.
• Slave sends acknowledge.
• Master generates repeated start condition.
• Master sends 7-bit slave address (0110110 for KTD3134) and 1-bit data direction ‘1’ for read.
• Slave sends acknowledge if the slave address is matched.
• Slave sends the data byte of that addressed register.
• If master sends acknowledge, the register address will be incremented by one after each acknowledge and the slave will continue to send the data for the updated addressed register.
• If master sends no acknowledge, the slave will stop sending the data.
• Master generate stop condition to finish the read cycle. I2C Register Map Table 3 summarizes KTD3134’s 11 I2C registers, their read/write settings and default values. They can be reset to default values by VIN power on reset, toggling HWEN or I2C software reset.

Table 3. I2C Register Map

Table 4. Device ID Register (0x00) Table 5. SW Reset Register (0x01) Note: Writing software reset bit to ‘1’ will reset all I2C registers to their default values, then this bit will be internally reset back to ‘0’. Table 6. Mode Register (0x02) Flash Mode bit is reset to ‘0’ automatically. Table 7. Control Register (0x03) Note: When Backlight Current Mapping setting is changed, the LED current change will not take effect until Register 0x05 is programmed. Table 8. Brightness Register LSB (0x04) Table 9. Brightness Register MSB (0x05)

1. If only using 8-bit current ratio, keep the 3-bit LSBs as ‘111’ and only program the 8-bit MSBs.
2. If using 11-bit current ratio, the 3-bit LSBs should be programmed first, then the 8-bit MSBs can be programmed to take effect. Even if
3. For 11-bit program code 11’b00000000000, both boost converter and current sinks are turned off.

Table 10. PWM Register (0x06) Table 11. Turn On/Off Ramp Register (0x07) Note: If the switching frequency shift up by 20% is selected, all the ramp times will be decreased by 20%.

Table 12. Transition Ramp Register (0x08)

1. If the switching frequency shift up by 20% is selected, all the transition times will be decreased by 20%.
2. The PWM Dimming Transition Ramp Time in the table is defined as the time to change between minimum PWM duty cycle and the

maximum PWM duty cycle. The final transition time is the multiplication of the time in the table and the change of the PWM duty cycle.

1. For I2C Dimming Transition Ramp Time in the table, all the ramp times are fixed when current ramps from one level to the other except

"0000" setting. For "0000" setting, the ramp slope is 1us/step, the final ramp time is proportional to the 11-bit current steps. Table 13. Flash Setting Register (0x09) Note: If the switching frequency shift up by 20% is selected, the flash timeout will be decreased by 20%. Table 14. Status Register (0x0A)

1. CH1/2 fault, UVLO and thermal shutdown are real-time results when backlight/flash mode is enabled and can be reset by toggling
2. Flash timeout, OVP and OCP are latched results and can be reset by reading back Status Register 0x0A through I2C or toggling
3. All the status bits can be reset by VIN power on reset, software reset or toggling HWEN.

the recommended capacitor vendors. Table 15. Recommended Capacitor Vendors efficiency under that condition. Table 16 shows recommended inductors under different application conditions. Table 16. Recommended Inductors setting. Table 17 shows the recommended schottky diode. Table 17. Recommended Schottky Diode

12 MAXOUT

t KTD3134 April 2019 - Revision 04a Page 23 Company Confidential Packaging Information WLCSP34-12 (1.190mm x 1.640mm x 0.62mm) Recommended Footprint WLCSP 1.21x1.65 2 X 0.400mm A1 Corner Top Side Die Coating Top View Bottom ViewSide View 0.620 ± 0.045mm 0.025 ± 0.003mm 1.190 ± 0.030mm 1.640mm ± 0.030mm

12 X Ø

0.25 ± 0.025mm 3 X 0.400mm 0.220 ± 0.022mm WLCSP Recommended Footprint (KTD2682) (NSMD Pad Type) * Dimensions are in millimeters. 0.40mm 0.40mm 0.22mm Copper Pad Diameter 0.32mm Solder Mask Opening 1.20mm 0.80mm

t KTD3134 April 2019 - Revision 04a Page 24 Company Confidential TQFN33-16 (3.00mm x 3.00mm x 0.75mm) Recommended Footprint Kinetic Technologies cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Kinetic Technologies product. No intellectual property or circuit patent licenses are implied. Kinetic Technologies reserves the right to change the circuitry and specifications without notice at any time. D E Pin 1 Dot By Marking 912 Detail “A” L 129 Detail “B” b e Detail “B” S C A1 A2 A Detail “A” R 0.3 (4x) max Round Corner Pin 1 Identification Top View Bottom View Side View 0.50 0.8 0.8 0.23 1.7 1.7 2.1 2.1 0.23 0.50 * Dimensions are in millimeters. Dimension mm Min. Typ. Max. A 0.65 0.75 0.85 A1 0.000 0.025 0.050 A2 0.154 0.203 0.280 b 0.18 0.23 0.30 C 0.3REF D 2.95 3.00 3.05 D1 1.7REF E 2.95 3.00 3.05 E1 1.7REF e 0.45 0.50 0.55 L 0.30 0.40 0.50 S 0.25REF