SPD9251A WILLSEMI | Alldatasheet

Document overview

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Technical content

Features

 Peak off-state voltage: ±6.0V Max  Excellent capability of absorbing transient surge  Quick response to surge voltage  Eliminate voltage overshoot caused by fast-rising transients  Low leakage current:  Solid-state silicon technology, non degenerative

Applications

 Audio/Video line  Network and telecom  Data lines and security systems  Serial ports  BNC interface  DVR http//:www.sh-willsemi.com SMA Schematic Diagram AA = Device code Y = Year code W = Week code Marking (Top View) Order information Device Package Shipping SPD9251A-2/TR SMA 5000/Tape&Reel 9251A AAYW

Will Semiconductor Ltd. 2 Revision 1.3, 2016/10/13 Electrical characteristics (TA=25 oC, unless otherwise noted) Part Number VDRM IDRM VS VBR

1 IS IH VT IT CO

V μA V V mA mA V A pF SPD9251A 6.0 1 25 6.2 800 150 4 2.2 13 9 Notes: 1) VBR is measured at IBR=1mA. Off-state capacitance is measured at f = 1MHz, VDC = 2V. Surge Ratings Notes: 1) Current waveform. 2) Voltage waveform. Part Number 8/20μs1) 5/320μs1) 1.2/50μs2) 10/700μs2) SPD9251A 140 A 2000 V

Will Semiconductor Ltd. 3 Revision 1.3, 2016/10/13 Thermal considerations Thermal considerations Typical characteristics (TA=25oC, unless otherwise noted) Definitions of electrical characteristics Peak pulse current waveform Normalized VS Change vs. Junction Temperature Normalized Hold ing Current vs. Case Temperature Parameter Symbol Rating Unit Operation junction temperature TJ -40~150 oC Storage temperature TSTG -55~150 oC Lead temperature TL 260 oC Junction to ambient thermal resistance RθJA 90 oC/W -25 0 25 50 75 100 125 150 Percent of VS Change - % Junction Temperature(TJ) - ℃ 25℃ -25 0 25 50 75 100 125 150 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 Ratio of IH/IH(TC=25℃) Case Temperature(TC) - ℃ 25℃ I VVDRM VS IDRM IH IT VT VDRM Peak off-state voltage IDRM Peak off-state current VS Switching voltage IS Switching current IH Holding current VT On-state voltage IT On-state current IS tr = rise time to peak value td = decay time to half value tdtr Waveform = tr × td Peak Value Half Value 100 IPP - Peak Pulse Current - %IPP t-Time (μs)

Will Semiconductor Ltd. 4 Revision 1.3, 2016/10/13 Package outline dimensions SMA Recommend land pattern (Unit: mm) Symbol Dimensions in millimeter Min. Typ. Max. A 3.990 - 4.500 B 2.540 - 2.790 C 4.930 - 5.280 D 1.250 - 1.650 E 0.152 - 0.305 F 1.980 - 2.290 G 0.780 - 1.520 H - - 0.203 Notes: This recommended land pattern is for reference purposes only. Please consult your manufacturing group to ensure your PCB design guidelines are met.