SPD83152C WILLSEMI | Alldatasheet

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Technical content

Features

 For surface mount application  Excellent clamping capability  Low profile package  Fast response time: Typically less than 1.0ps from 0V to 16.7V  Low inductance  GPP Mechanical Data  Case: Molded plastic  Mounting position: Any  Weight: 0.21 grams Http//:www.sh-willsemi.com SMC Schematic Diagram XXXX = Date code BEM = Device code Marking (Top View) Order information Device Dim (mm) Shipping SPD83152C-2/TR 7.8*5.8*2.3 3000/Tape&Reel SPD83152C XXXX BEM

Will Semiconductor Ltd. 2 Revision 1.2, 2017/11/15 Absolute maximum ratings Notes : 1. Mounted on 5.0mm2 (0.03mm thick) Copper Pads to each teminal Electrical characteristics (TA=25 oC, unless otherwise noted) Part Number Reverse Stand off Voltage VR (V) Breakdown Voltage VBR@ IT (V) Test Current IT (mA) Maximum Clamping Voltage VC @IPP (V) Maximum Peak Pulse Current IPP (A) (A) Maximum Reverse Leakage IR @ VR (μA) MIN MAX SPD83152C 15 16.7 19.2 1 24.4 61.5 1 Typical characteristics (TA=25oC, unless otherwise noted) Fig. 1 Peak Pulse Power Fig. 2 Pulse Derating Curve Rating Symbol Value Units Peak Pulse Power on 10/1000µ s waveform PPPM 1500 W Peak Pulse Current of on 10/1000µ s waveform IPPM 61.5 A Junction Temperature TJ -55~150 ℃ Operating Temperature TOP -40~125 ℃ Storage Temperature Range TSTG -55~150 ℃ 0.1µ s 1µ s 10µs 100µs 1ms 10ms td - Pulse Width (sec.) Non-repetitive pulse waveform 10/1000µs 0.1 100 PPPM – Peak Pulse Power – (kW) 0 25 50 75 100 125 150 TA – Ambient Temperature (℃) 100 % Of Rated Power

Will Semiconductor Ltd. 3 Revision 1.2, 2017/11/15 Package outline dimensions (Unit:mm) SMC Symbol Dimensions in millimeter Min. Typ. Max. A 2.86 -- 3.160 B 6.520 -- 7.020 C 5.520 -- 6.150 D 1.980 -- 2.590 E 0.750 -- 1.510 F - -- 0.203 G 7.640 - 8.020 H 0.152 -- 0.305 Recommend land pattern (Unit: mm) Note: This land pattern is for your reference only. Actual pad layouts may vary depending on application. 3.4 5.9 8.4 2.5 3.40