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For surface mount application Excellent clamping capability Low profile package Fast response time: Typically less than 1.0ps from 0V to 64.4V Low inductance GPP Mechanical Data Case: Molded plastic Mounting position: Any Weight: 0.093 grams http//:www.sh-willsemi.com SMB Schematic Diagram YY = Year Code WW = Week Code DG = Device Code Marking (Top View) Order information Device Dim (mm) Shipping SPD82582B-2/TR 5.3*3.5*2.3 3000/Tape&Reel YYWW DG
Will Semiconductor Ltd. 2 Revision 1.4, 2017/11/16 Absolute maximum ratings Notes: 1. Mounted on 5.0mm2 (0.03mm thick) Copper Pads to each terminal. Electrical characteristics (TA=25 oC, unless otherwise noted) Typical characteristics (TA=25oC, unless otherwise noted) Rating Symbol Value Units Peak Pulse Power on 10/1000µ s waveform PPPM 600 W Peak Pulse Current of on 10/1000µ s waveform IPPM 6.4 A Junction Temperature TJ -55~150 ℃ Operating Temperature TOP -40~125 ℃ Storage Temperature Range TSTG -55~150 ℃ Part Number Reverse Stand-off Voltage VR (V) Breakdown Voltage VBR@ IT (V) Test Current IT (mA) Maximum Clamping Voltage VC@IPP (V) Maximum Peak Pulse Current IPP (A) Maximum Reverse Leakage IR @ VR (μA) Min. Max. SPD82582B 58 64.4 74.1 1 93.6 6.4 1 0.1 1 10 100 1000 10000 0.1 100 1000 Non-repetitive pulse waveform 10/1000μs PPPM - Peak Pulse Power(kW) Peak Pulse Power Rating 0 25 50 75 100 125 150 100 Peak Pulse Power(PPP) of Current(IPP) Derating In Percentage, % TA - Ambient temperature ( o
Will Semiconductor Ltd. 3 Revision 1.4, 2017/11/16 Package outline dimensions (Unit: mm) SMB Recommend land pattern (Unit: mm) Symbol Dimensions in millimeter Min. Typ. Max. A 4.06 4.57 B 3.30 3.94 C 1.95 2.62 D 5.08 5.59 E 0.13 0.31 F 0.76 1.52 G 0.20 Max. H 2.10 2.30 2.50 I 1.78 2.00 2.20 Notes: This recommended land pattern is for reference purposes only. Please consult your manufacturing group to ensure your PCB design guidelines are met.