SPD82152B WILLSEMI | Alldatasheet
Document overview
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Technical content
Features
For surface mount application Excellent clamping capability Low profile package Fast response time: Typically less than 1.0ps from 0V to 16.7V Low inductance GPP Mechanical Data Case: Molded plastic Mounting position: Any Weight: 0.093 grams Http//:www.sh-willsemi.com SMB Schematic Diagram YY = Year Code WW = Week Code BM = Device Code Marking (Top View) Order information Device Dim (mm) Shipping SPD82152B-2/TR 5.3*3.5*2.3 3000/Tape&Reel YYWW BM
Will Semiconductor Ltd. 2 Revision 1.4, 2017/11/20 Absolute maximum ratings Notes : 1. Mounted on 5.0mm2 (0.03mm thick) Copper Pads to each teminal Electrical characteristics (TA=25 oC, unless otherwise noted) Part Number Reverse Stand off Voltage VR (V) Breakdown Voltage VBR@ IT (V) Test Current IT (mA) Maximum Clamping Voltage VC @IPP (V) Maximum Peak Pulse Current IPP (A) (A) Maximum Reverse Leakage IR @ VR (μA) MIN MAX SPD82152B 15 16.7 19.2 1 24.4 24.6 1 Typical characteristics (TA=25oC, unless otherwise noted) Rating Symbol Value Units Peak Pulse Power on 10/1000µ s waveform PPPM 600 W Peak Pulse Current of on 10/1000µ s waveform IPPM 24.6 A Junction Temperature TJ -55~150 ℃ Operating Temperature TOP -40~125 ℃ Storage Temperature Range TSTG -55~150 ℃
Will Semiconductor Ltd. 3 Revision 1.4, 2017/11/20 Package outline dimensions (Unit:mm) SMB Symbol Dimensions in millimeter Min. Typ. Max. A 4.06 -- 4.58 B 3.30 -- 3.95 C 2.00 -- 2.30 D 5.05 -- 5.60 E 0.15 -- 0.30 F 0.75 -- 1.50 G 0.00 -- 0.20 H 2.00 -- 2.50 I 1.95 -- 2.25 Recommend land pattern (Unit: mm) Note: This land pattern is for your reference only. Actual pad layouts may vary depending on application. 2.26 4.42 6.58 2.16 2.75