SPD81581A WILLSEMI | Alldatasheet

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Technical content

Features

 For surface mount application  Excellent clamping capability  Low profile package  Fast response time: Typically less than 1.0ps from 0V to 64.4V  Low inductance  GPP Mechanical Data  Case: Molded plastic  Mounting position: Any  Weight: 0.063 grams Http//:www.sh-willsemi.com SMA (DO-214AC) Schematic Diagram XXXX = Date code RG = Device code Marking (Top View) Order information Device Package Shipping SPD81581A-2/TR SMA 5000/Tape&Reel XXXX RG PIN1 PIN2 PIN1 PIN2

Will Semiconductor Ltd. 2 Revision 1.2, 2016/7/7 Absolute maximum ratings Part Number Reverse Stand off Voltage VR (V) Breakdown Voltage VBR@ IT (V) Test Current IT (mA) Maximum Clamping Voltage VC @IPP(V) Maximum Peak Pulse Current IPP (A) Maximum Reverse Leakage IR @ VR(μA) MIN MAX Thermal considerations Rating Symbol Value Units Peak Pulse Power on 10/1000µ s waveform PPPM 400 W Peak Pulse Current of on 10/1000µ s waveform IPPM 4.3 A Peak Forward Surge Current , 8.3ms Single Half Sine-wave Superimposed on Rated Load,(JEDEC Method) IFSM 40 A Operating Temperature Range TOP -55 to +150 ℃ Storage Temperature Range TSTG -55 to +150 ℃ Notes: 1. Mounted on 5.0mm2 (0.03mm thick) Copper Pads to each terminal

Will Semiconductor Ltd. 3 Revision 1.2, 2016/7/7 Typical characteristics (TA=25oC, unless otherwise noted) Fig. 1 Peak Pulse Power Fig. 2 Pulse Derating Curve 0.1µ s 1µ s 10µs 100µs 1ms 10ms td - Pulse Width (sec.) Non-repetitive pulse waveform 10/1000µs 0.1 100 PPPM – Peak Pulse Power – (kW) 0 25 50 75 100 125 150 TA – Ambient Temperature (℃) 100 % Of Rated Power

Will Semiconductor Ltd. 4 Revision 1.2, 2016/7/7 Package outline dimensions (Unit:mm) SMA Recommend land pattern (Unit: mm) Symbol Dimensions in millimeter Min. Max. A 3.990 4.500 B 2.540 2.790 C 4.930 5.280 D 1.250 1.650 E 0.152 0.305 F 1.980 2.290 G 0.780 1.520 H - 0.203 Notes: This recommended land pattern is for reference purposes only. Please consult your manufacturing group to ensure your PCB design guidelines are met.