SPD81052A WILLSEMI | Alldatasheet
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Technical content
Features
For surface mount application Excellent clamping capability Low profile package Fast response time: Typically less than 1.0ps from 0V to 6.40V Low inductance GPP Mechanical Data Case: Molded plastic Mounting position: Any Weight: 0.063 grams Http//:www.sh-willsemi.com SMA (DO-214AC) Schematic Diagram YY = Year Code WW = Week Code TE = Device Code Marking (Top View) Order information Device Dim (mm) Shipping SPD81052A-2/TR 5.1*2.6*2.1 5000/Tape&Reel YYWW TE
Will Semiconductor Ltd. 2 Revision 1.2, 2017/11/16 Absolute maximum ratings Notes : 1. Mounted on 5.0mm2 (0.03mm thick) Copper Pads to each teminal Electrical characteristics (TA=25 oC, unless otherwise noted) Part Number (Bi) Reverse Stand off Voltage VR (V) Breakdown Voltage VBR@ IT (V) Test Current IT (mA) Maximum Clamping Voltage VC @IPP (V) Maximum Peak Pulse Current IPP (A) (A) Maximum Reverse Leakage IR @ VR (μA) MIN MAX Typical characteristics (TA=25oC, unless otherwise noted) Fig. 1 Peak Pulse Power Fig. 2 Pulse Derating Curve Rating Symbol Value Unit s Peak Pulse Power on 10/1000µ s waveform PPPM 400 W Peak Pulse Current of on 10/1000µ s waveform IPPM 43.5 A Junction Temperature TJ -55~150 ℃ Operating Temperature TOP -40~125 ℃ Storage Temperature Range TSTG -55~150 ℃ 0.1µ s 1µ s 10µs 100µs 1ms 10ms td - Pulse Width (sec.) Non-repetitive pulse waveform 10/1000µs 0.1 100 PPPM – Peak Pulse Power – (kW) 0 25 50 75 100 125 150 TA – Ambient Temperature (℃) 100 % Of Rated Power
Will Semiconductor Ltd. 3 Revision 1.2, 2017/11/16 Package outline dimensions (Unit:mm) SMA Symbol Dimensions in millimeter Min. Max. A 3.990 4.500 B 2.540 2.790 C 4.930 5.280 D 1.250 1.650 E 0.152 0.305 F 1.980 2.290 G 0.780 1.520 H - 0.203 Recommend land pattern (Unit: mm) D B A C E F G H Notes: This recommended land pattern is for reference purposes only. Please consult your manufacturing group to ensure your PCB design guidelines are met. 2.1 2.1 1.8 2.0