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Technical content

14.06.2013 SPD64-02 1 of 2

Silicone PD, 5 mm package SPD64-02 is a PIN-photodiode containing a chip with 0.8x 0.8 mm active area, mounted into on a lead frame with a clear epoxy lens. This device is featuring excellent responsibility of 10ns and a high pho tocurrent. It’s designed to be easy of setting up optically with a wide angle of half sensitivity of ±15 degrees. Specifications (Unit: mm)

  • Spectral Responsivity (Peak): 900 nm
  • Chip Size: 1.0 x 1.0 mm
  • Active Area: 0.8 x 0.8 mm
  • Package: 5mm molding Type: Lead frame Resin Material: Epoxy resin Absolute Maximum Ratings (TA=25°C) Item Symbol Value Unit Reverse Breakdown Voltage V(BR)R 170 V Operating Temperature Topr -25 … +100 °C Storage Temperature Tstg -30 … +125 °C Soldering Temperature *1 Tsol 240 °C *1 must be completed within 3 seconds at 240°C Electro-Optical Characteristics Item Symbol Condition Min. Typ. Max. Unit Reverse Photo Current IL VR=10V, L=1000Lx - 20 - µA Reverse Dark Current ID VR=10V - 10 nA Open Circuit Voltage VOC VR=10V, L=1000Lx - 410 - mV Spectral Responsivity (Peak) λP - 900 - nm Half Angle of Sensitivity Θ1/2 ±15 - deg Total Capacitance CT VR=10V, f=1MHz - 6 - pF Rise Time (10-90%) tr RL=1KΩ, VR=10V - 10 - ns Fall Time (10-90%) tf - 10 - ns Note: The above specifications are for reference purpose only and subjected to change without prior notice.

14.06.2013 SPD64-02 2 of 2

  1. Lead Forming
  • Lead forming should be done before soldering.
  • When forming leads, the leads should be bent at a point at least 3 mm from the base of the lead. DO NOT use the base of the lead frame as a fulcrum during lead forming!
  • DO NOT apply any bending stress to the base of the lead. The stress to the base may damage the P D’s characteristics or it may break the PDs.
  • When mounted the PDs onto the printed circuit board, the holes on the circuit board should be exactly aligned with the leads of PDs. If the PDs are mounted with stress at the leads, it causes deterioration of the lead and it will degrade the PDs. Recommended Land Layout (Unit: mm) 2. Soldering Conditions
  • Solder the PDs no closer than 3 mm from the base of the lead.
  • DO NOT apply any stress to the lead particularly when heat.
  • After soldering the PDs, the lead should be protected from mechanical shock or vibration until the PDs return to room temperature.
  • The PDs must not be reposition after soldering.
  • When it is necessary to clamp the P Ds to prevent soldering failure, it is important to minimize the mechanical stress on the PDs.
  • Cut the PD leads at room temperature. Cutting t he leads at high temperature may cause the failure of the PDs. Soldering Conditions 3. Static Electricity
  • The PDs are very sensitive to Static Electricity and surge voltage. So it is recommended that a wrist band and/or an anti - electrostatic glove be used when handling the PDs.
  • All devices, equipment and machinery must be grounded properly. It is recommended that precautions should be taken against surge voltage to the equipment that mounts the PDs.