SPD4200B WILLSEMI | Alldatasheet

Document overview

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Technical content

Features

 Peak off-state voltage: 400V Max  Excellent capability of absorbing transient surge  Quick response to surge voltage  Eliminate voltage overshoot caused by fast-rising transients  Low capacitance: CJ = 55pF Max.  Low peak off-state current: <5μA  Solid-state silicon technology, no degradation

Applications

 Broadband Equipment such as ADSL/VDSL  Baseband Equipment such as ISDN  CATV Equipment  Customer Premises Equipment ( CPE) such as telephones, fax machines, modems and VoIP  Data lines and security systems http//:www.sh-willsemi.com SMB (DO-214AA) Schematic Diagram P4200SC = Device code YYWW = Date code Marking (Top View) Order information Device Package Shipping SPD4200B-2/TR SMB 3000/Tape&Reel

Will Semiconductor Ltd. 2 Revision 1.25, 2014/04/15 Electrical characteristics (TA=25 oC, unless otherwise noted) Notes: 1) Vs is measured at 100kV/s. 2) Off-state capacitance is measured at f = 1MHz, VDC = 2V. Surge rating Notes: 1) Current waveform. 2) Voltage waveform. I VVDRM VS IDRM IH IT VT VDRM Peak off-state voltage IDRM Peak off-state current VS Switching voltage IS Switching current IH Holding current VT On-state voltage IT On-state current IS Definitions of electrical characteristics Part Number VDRM IDRM VS 1) IS IH VT IT CO V μA V mA mA V A pF Max. Max. max Max. Max. SPD4200B 400 5 500 800 150 4 2.2 55 Part Number 8/20μs1) 5/310μs1) 10/1000μs1) 1.2/50μs2) 10/700μs2) 10/1000μs2) SPD4200B 500 200 100

Will Semiconductor Ltd. 3 Revision 1.25, 2014/04/15 Thermal considerations Typical characteristics (TA=25oC, unless otherwise noted) Peak pulse current waveform Normalized holding current vs. Case temperature Parameter Symbol Rating Unit Operation junction temperature TJ -40~150 oC Storage temperature TSTG -55~150 oC Lead temperature TL 260 oC Junction to ambient thermal resistance RθJA 90 oC/W 100 Front time: T1= 1.25 T Time to half-value: T2 Peak pulse current (%) Time (s)T -40 -20 0 20 40 60 80 100 120 140 160 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 o C Ratio of IH / IH (TC = 25 o TC - Case temperature ( o

Will Semiconductor Ltd. 4 Revision 1.25, 2014/04/15 Package outline dimensions SMB Symbol Dimensions in millimeter Min. Typ. Max. A 4.30 -- 4.70 B 3.30 -- 3.75 C 2.00 -- 2.35 D 4.95 -- 5.55 E 0.10 -- 0.30 F 0.80 -- 1.50 G 0.00 -- 0.30 H 2.10 -- 2.60 I 1.85 -- 2.15 Recommend land pattern (Unit: mm) Note: This land pattern is for your reference only. Actual pad layouts may vary depending on application.