SPD03N60S5

SPU03N60S5 INFINEON | Alldatasheet

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2004-03-30Rev. 2.1 Page 1 SPU03N60S5 SPD03N60S5 Cool MOS™ Power Transistor VDS 600 V RDS(on) 1.4 Ω ID 3.2 A Feature

• New revolutionary high voltage technology
• Ultra low gate charge
• Periodic avalanche rated
• Extreme dv/dt rated
• Ultra low effective capacitances
• Improved transconductance P-TO251.P-TO252. 321 Type Package Ordering Code SPU03N60S5 P-TO251. Q67040-S4227 SPD03N60S5 P-TO252. Q67040-S4187 Marking 03N60S5 03N60S5 Maximum Ratings Parameter Symbol Value Unit Continuous drain current TC = 25 °C TC = 100 °C ID 3.2 A Pulsed drain current, tp limited by Tjmax ID puls 5.7 Avalanche energy, single pulse ID = 2.4 A, VDD = 50 V EAS 100 mJ Avalanche energy, repetitive tAR limited by Tjmax1) ID = 3.2 A, VDD = 50 V EAR 0.2 Avalanche current, repetitive tAR limited by Tjmax IAR 3.2 A Gate source voltage VGS ±20 V Gate source voltage AC (f >1Hz) VGS ±30 Power dissipation, TC = 25°C Ptot 38 W Operating and storage temperature Tj , Tstg -55... +150 °C

2004-03-30Rev. 2.1 Page 2 SPU03N60S5 SPD03N60S5 Maximum Ratings Parameter Symbol Value Unit Drain Source voltage slope VDS = 480 V, ID = 3.2 A, Tj = 125 °C dv/dt 20 V/ns Thermal Characteristics Parameter Symbol Values Unit min. typ. max. Thermal resistance, junction - case RthJC - - 3.3 K/W Thermal resistance, junction - ambient, leaded RthJA - - 75 SMD version, device on PCB: @ min. footprint @ 6 cm2 cooling area 2) RthJA Soldering temperature, 1.6 mm (0.063 in.) from case for 10s Tsold - - 260 °C Electrical Characteristics, at Tj=25°C unless otherwise specified Parameter Symbol Conditions Values Unit min. typ. max. Drain-source breakdown voltage V(BR)DSS VGS=0V, ID=0.25mA 600 - - V Drain-Source avalanche breakdown voltage V(BR)DS VGS=0V, ID=3.2A - 700 - Gate threshold voltage VGS(th) ID=135µΑ, VGS=VDS 3.5 4.5 5.5 Zero gate voltage drain current IDSS VDS=600V, VGS=0V, Tj=25°C, Tj=150°C 0.5 µA Gate-source leakage current IGSS VGS=20V, VDS=0V - - 100 nA Drain-source on-state resistance RDS(on) VGS=10V, ID=2A, Tj=25°C Tj=150°C 1.26 3.4 1.4 Ω

2004-03-30Rev. 2.1 Page 3 SPU03N60S5 SPD03N60S5 Electrical Characteristics , at Tj = 25 °C, unless otherwise specified Parameter Symbol Conditions Values Unit min. typ. max. Characteristics Transconductance gfs VDS≥2*ID*RDS(on)max, ID=2A - 1.8 - S Input capacitance Ciss VGS=0V, VDS=25V, f=1MHz - 420 - pF Output capacitance Coss - 150 - Reverse transfer capacitance Crss - 3.6 - Turn-on delay time td(on) VDD=350V, VGS=0/10V, ID=3.2A, RG=20Ω - 35 - ns Rise time tr - 25 - Turn-off delay time td(off) - 40 - Fall time tf - 15 22.5 Gate Charge Characteristics Gate to source charge Qgs VDD=350V, ID=3.2A - 3.5 - nC Gate to drain charge Qgd - 7 - Gate charge total Qg VDD=350V, ID=3.2A, VGS=0 to 10V - 12.4 16 Gate plateau voltage V(plateau) VDD=350V, ID=3.2A - 8 - V 1Repetitve avalanche causes additional power losses that can be calculated as PAV=EAR*f. 2Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air.

2004-03-30Rev. 2.1 Page 4 SPU03N60S5 SPD03N60S5 Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol Conditions Values Unit min. typ. max. Inverse diode continuous forward current IS TC=25°C - - 3.2 A Inverse diode direct current, pulsed ISM - - 5.7 Inverse diode forward voltage VSD VGS=0V, IF=IS - 1 1.2 V Reverse recovery time trr VR=350V, IF=IS , diF/dt=100A/µs - 1000 1700 ns Reverse recovery charge Qrr - 2.3 - µC Typical Transient Thermal Characteristics Symbol Value Unit Symbol Value Unit typ. typ. Thermal resistance Rth1 0.054 K/W Rth2 0.103 Rth3 0.178 Rth4 0.757 Rth5 0.682 Rth6 0.202 Thermal capacitance Cth1 0.00005232 Ws/K Cth2 0.0002034 Cth3 0.0002963 Cth4 0.0009103 Cth5 0.002084 Cth6 0.024 External Heatsink Tj Tcase Tamb Cth1 Cth2 Rth1 Rth,n Cth,n Ptot (t)

2004-03-30Rev. 2.1 Page 5 SPU03N60S5 SPD03N60S5

1 Power dissipation

Ptot = f (TC) 0 20 40 60 80 100 120 °C 160 TC W SPU03N60S5 Ptot

2 Safe operating area

ID = f ( VDS ) parameter : D = 0 , TC=25°C 10 0 10 1 10 2 10 3 V VDS -2 10 -1 10 0 10 1 10 A ID tp = 0.001 ms tp = 0.01 ms tp = 0.1 ms tp = 1 ms DC

3 Transient thermal impedance

ZthJC = f (tp) parameter: D = tp/T 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 s tp -2 10 -1 10 0 10 1 10 K/WZthJC 4 Typ. output characteristic ID = f (VDS); Tj=25°C parameter: tp = 10 µs, VGS 0 5 10 15 V 25 VDS A ID 7.5V 8.5V 10V 6.5V 20V 12V

2004-03-30Rev. 2.1 Page 6 SPU03N60S5 SPD03N60S5

5 Drain-source on-state resistance

RDS(on) = f (Tj) parameter : ID = 2 A, VGS = 10 V -60 -20 20 60 100 °C 180 Tj Ω SPU03N60S5 RDS(on) typ 98% 6 Typ. transfer characteristics ID= f ( VGS ); VDS≥ 2 x ID x RDS(on)max parameter: tp = 10 µs 0 4 8 12 V 20 VGS A ID 7 Typ. gate charge VGS = f (QGate) parameter: ID = 3.2 A pulsed 0 2 4 6 8 10 12 14 16 nC 19 QGate V SPU03N60S5 VGS

0.2 VDS max

0.8 VDS max

8 Forward characteristics of body diode

IF = f (VSD) parameter: Tj , tp = 10 µs VSD -2 10 -1 10 0 10 1 10 A SPU03N60S5 IF Tj = 25 °C typ Tj = 25 °C (98%) Tj = 150 °C typ Tj = 150 °C (98%)

2004-03-30Rev. 2.1 Page 7 SPU03N60S5 SPD03N60S5

9 Avalanche SOA

IAR = f (tAR) par.: Tj ≤ 150 °C 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 4 µs tAR 0.5 1.5 2.5 A 3.5 IAR Tj(START)=25°C Tj(START)=125°C

10 Avalanche energy

EAS = f (Tj) par.: ID = 2.4 A, VDD = 50 V 20 40 60 80 100 120 °C 160 Tj mJ 120 EAS

11 Drain-source breakdown voltage

V(BR)DSS = f (Tj) -60 -20 20 60 100 °C 180 Tj 540 560 580 600 620 640 660 680 V 720 SPU03N60S5 V(BR)DSS 12 Typ. capacitances C = f (VDS) parameter: VGS=0V, f=1 MHz 0 10 20 30 40 50 60 70 80 V 100 VDS 0 10 1 10 2 10 3 10 4 10 pF C Ciss Coss Crss

2004-03-30Rev. 2.1 Page 8 SPU03N60S5 SPD03N60S5 Definition of diodes switching characteristics

2004-03-30Rev. 2.1 Page 9 SPU03N60S5 SPD03N60S5 P-TO-252-3-1 (D-PAK) P-TO-251-3-1 (I-PAK) GPT09050 5.4 ±0.1 -0.106.5+0.15 A 6.22-0.2 1±0.1 0.15 ±0.1 max per side 3 x 0.75 2.28 4.56 +0.08 -0.040.9 2.3 -0.10 +0.05 B +0.08 -0.040.5 BA0.25 M ±0.49.3 C 1.0 C All metal surfaces tin plated, except area of cut.

2004-03-30Rev. 2.1 Page 10 SPU03N60S5 SPD03N60S5 Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.