SPB80N06S2-07 VBSEMI | Alldatasheet
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Technical content
N-Channel 60 V (D-S) MOSFET
FEATURES
- TrenchFET® power MOSFET
- Package wi th low thermal resistance
- AEC-Q101 qualified d
- 100 % Rg and UIS tested Notes a. Pac k age limited. b. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %. c. When mounted on 1" square PCB (FR4 material). d. Parametric verification ongoing. PRODUCT SUMMARY VDS (V) 60 RDS(on) (Ω) at VGS = 10 V 0.005 ID (A) 100 Configuration S ingle Package TO-263 TO-263 Top View G D S G D S D G SN-Channel MOSFET ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, u nless otherwise noted) PARAMETER SYMBOL L IMIT UNIT Drain-Source Voltage VDS 60 V Gate-Source Voltage VGS ± 20 Continuous Drain Current TC = 25 °C a ID 100 A TC = 125 °C 65 Continuous Source Current (Diode Conduction) a IS 120 Pulsed Drai n Current b IDM 450 Single Puls e Avalanche Current L = 0.1 mH IAS 65 Single Pulse A valanche Energy EAS 211 mJ Maximum Power Dissipation b TC = 25 °C PD
220 W TC = 125 °C 70
orage Temperature Range TJ, Tstg -55 to +175 °C THERMAL RESISTANCE R ATINGS PARAMETER SYMBOL L IMIT UNIT Junction-to-Ambient PCB Mount c RthJA 40 °C/WJunction-to-Case (Drain) RthJC 0.65 E-mail:China@VBsemi TEL:86-755-83251052 www.VBsemi.tw SPB80N06S2-07 A ll data sheet.com
a. Puls e te st; pulse width ≤ 300 μs, duty cycle ≤ 2 %. b. Guaranteed by design, not subj ect to production testing. c. Independent of operating temperature. Stresses beyond those li sted under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. SPECIFICATIONS (TC = 25 °C, u nless otherwise noted) PARAMETER SYMBOL T EST CONDITIONS MIN. TYP. MAX. UNIT Static Drai n-Source Breakdown Voltage VDS VGS = 0, ID = 250 μA 60 - - V Gate-So urce Threshold Voltage VGS(th) VDS = VGS, ID = 250 μA 2.0 4.0 Gate-Source Leakage IGSS V DS = 0 V, VGS = ± 20 V - - ± 100 nA Zero Gate Voltage Drain Current IDSS VGS = 0 V VDS = 60 V - - 1 μA VGS = 0 V V DS = 60 V, TJ = 125 °C - - 5 VGS = 0 V V DS = 60 V, TJ = 175 °C - - 2 On-State Drain Current a I D(on) V GS = 10 V VDS ≥ 5 V 120 - - A Drain-So urce On-State Resistance a R DS(on) VGS = 10 V ID = 30 A - 0.006 - ΩVGS = 10 V ID = 30 A, TJ = 125 °C - 0.012 - VGS = 10 V I D = 30 A, TJ = 175 °C - 0.015 - Forward Tr ansconductance b gfs VDS = 15 V, ID = 30 A - 94 - S Dynamic b Input Capacitance Ciss VGS = 0 V V DS = 25 V, f = 1 MHz - 5196 - pF Output Capacitance Coss - Revers e Transfer Capacitance Crss - Total Gate Charge c Qg VGS = 10 V V DS = 30 V, ID = 75 A -9 6 . 5 1 4 nC Gate-Source Charge Qgs -2 4 . 6- Gate-Drain Charge c Qgd -2 7 . 2- Gate Re sistance Rg f = 1 MHz 0.3 1 1.7 Ω Turn-On De lay Time c td(on) VDD = 30 V, RL = 0.4 Ω ID ≅ 75 A, VGEN = 10 V, Rg = 1 Ω -1 6 2 4 nsRise Ti me c tr -1 4 2 1 Turn-Off Delay Time c td(off) -3 4 5 1 Fall Time c tf -9 1 4 Source-Drain Diode Ratings and Characteristics b Pulsed Current a ISM -- Forward Vol tage VSD IF = 75 A, VGS = 0 - 0.9 1 .5 V 715 - 360 - A450 E-mail:China@VBsemi TEL:86-755-83251052 www.VBsemi.tw SPB80N06S2-07 A ll data sheet.com
ACTERISTICS (TA = 25 °C, unless o therwise noted) Output Characteristics Transf er Characteristics On-Resistance vs. Drain Current Transfer Characteristics Transconductance Capacitance 100 125 150 175 200 225 0 4 8 12 16 20 ID - Drain Current (A VDS -D r a i n- t o -Source Voltage (V) VGS = 10 V thru 7 V VGS = 6 V VGS = 4 V 0.0 0.3 0.6 0.9 1.2 1.5 0 2 4 6 8 10 ID - Drain Current (A VGS - Gate-to-Source Voltage (V) TC = 25 °C TC = -55 °CTC = 125 °C 0.000 0.004 0.008 0.012 0.016 0.020 0 20 40 60 80 100 120 RDS(on) -O n - R esis tance (Ω) ID - Drain Current (A) VGS = 10 V 120 150 0 2 4 6 8 10 ID - Drain Current (A VGS - Gate-to-Source Voltage (V) TC = -55 °CTC = 125 °C TC = 25 °C 120 160 200 0 1 42 84 25 67 gfs -T r a nsconducta nce (S) ID - Drain Cu rrent (A) TC = 125 °C TC = -55 °C TC = 25 °C 2000 4000 6000 8000 10 000 0 10 20 30 40 50 60 C - Capacitance (pF) VDS -D r a i n- t o -Source Voltage (V) Ciss Coss Crss E-mail:China@VBsemi TEL:86-755-83251052 www.VBsemi.tw SPB80N06S2-07 A ll data sheet.com
ACTERISTICS (TA = 25 °C, unless o therwise noted) Gate Charge Source Drain Diode Forward Voltage Threshold Vo ltage On-Resistance vs. Junction Temperature On-Resistance vs. Gate-to-Source Voltage Drain Source Breakdown vs. Junction Temperature 0 20 40 60 80 100 VGS - Gate-to-Source Voltage (V) Qg -T o t a l G ate Charge (nC) ID = 110 A VDS = 20 V 0.001 0.01 0.1 100 IS - Source Current (A) VSD - Source-to-Drain Vol tage (V) TJ = 25 °C TJ = 150 °C -1.8 -1.4 -1.0 -0.6 -0.2 0.2 0.6 -50 -25 0 25 50 75 100 125 150 175 VGS(th) Variance (V) TJ -T e m p e r a t u r e (°C) ID = 250 μA ID = 5 mA 0.6 0.9 1.2 1.5 1.8 2.1 -50 -25 0 25 50 75 100 125 150 175 RDS(on) -O n - R esis tance(Normalized) TJ - Junction Temperature (°C) ID = 10 A VGS = 10 V 0.00 0.01 0.02 0.03 0.04 0.05 02468 1 0 RDS(on) -O n - R esis tance (Ω) VGS - Gate-to-Source Voltage (V) TJ = 150 °C TJ = 25 °C -50 -25 0 25 50 75 100 125 150 175 VDS -D r a i n- t o -Source Voltage (V) TJ - Junction Temperature (°C) ID = 10 mA E-mail:China@VBsemi TEL:86-755-83251052 www.VBsemi.tw SPB80N06S2-07 A ll data sheet.com
THERMAL RATINGS (TA = 25 °C, un less otherwise noted) Safe Operati ng Area Normalized Thermal Transient Impedance, Junction-to-Ambient 0.01 0.1 100 1000 0.01 0.1 1 10 100 ID - Drain Current (A VDS -D r a i n- t o -Source Voltage (V) * VGS > minimum VGS at which RDS(on) is specified 100 ms Limited by RDS(on)* 1 ms IDM Limited TC = 25 °C Single Pu lse BVDSS Limited 10 ms 100 μs 1 s, 10 s, DC ID Limited 10-4 10-3 10-2 10-1 1 10 100 1000 0.01 0.001 0.1 0.0001 Square Wave Puls e Duration (s) Normalized Effective Transient Thermal Impedance E-mail:China@VBsemi TEL:86-755-83251052 www.VBsemi.tw SPB80N06S2-07 A ll data sheet.com
THERMAL RATINGS (TA = 25 °C, un less otherwise noted) Normalized Thermal Transient Impedance, Junction-to-Case Note
- The characteristics shown in the two graphs - Normalized Transient Thermal Impedance Junction-to-Ambient (25 °C) - Normalized Transient Thermal Impedance Junction-to-Case (25 °C) are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part mounted on printed circuit board - FR4, size 1" x 1" x 0.062" , double sided with 2 oz. copper, 100 % on both sides. The part ca pabilities can widely vary depending on actual application parameters and operating conditions. Square Wave Pulse Dur ation (s) 0.1 0.01 10-4 10-3 10-2 10-1 1 0.2 0.1 0.05 0.02 Duty Cycle = 0.5 Single Pulse Normalized Effective Tr ansient Thermal Impedance E-mail:China@VBsemi TEL:86-755-83251052 www.VBsemi.tw SPB80N06S2-07 A ll data sheet.com
TO-263 (D2PAK): 3-LEAD Notes 1. Plan e B includes maximum features of heat sink tab and plastic. 2. No more than 25 % of L1 ca n fall above seating plane by max. 8 mils. 3. Pin-to-pin coplanarity max. 4 mils. 4. *: Thin lead is for SUB, SYB. Thick lead is for SUM, SYM, SQM. 5. Use inches as the primary measurement. 6. This feature is for thick lead. -A- -B- A A e b E A c L2DL3 L Detail “A” K D3 6
0.010 M A M
DETAIL A (ROTATED 90°) SECTION A-A 0° - 5° M c b INCHES MILLIMETERS DIM. MIN. MAX. MIN. MAX. A 0.160 0.190 4.064 4.826 b 0.020 0.039 0.508 0.990 b1 0.020 0.035 0.508 0.889 b2 0.045 0.055 1.143 1.397 c* Thin lead 0.013 0.018 0.330 0.457 Thick lead 0.023 0.028 0.584 0.711 c1 Thin lead 0.013 0.017 0.330 0.431 Thick lead 0.023 0.027 0.584 0.685 c2 0.045 0.055 1.143 1.397 D 0.340 0.380 8.636 9.652 D1 0.220 0.240 5.588 6.096 D2 0.038 0.042 0.965 1.067 D3 0.045 0.055 1.143 1.397 D4 0.044 0.052 1.118 1.321 E 0.380 0.410 9.652 10.414 E1 0.245 - 6.223 - E2 0.355 0.375 9.017 9.525 E3 0.072 0.078 1.829 1.981 e 0.100 BSC 2.54 BSC K 0.045 0.055 1.143 1.397 L 0.575 0.625 14.605 15.875 L1 0.090 0.110 2.286 2.794 L2 0.040 0.055 1.016 1.397 L3 0.050 0.070 1.270 1.778 L4 0.010 BSC 0.254 BSC M - 0.002 - 0.050 ECN: T13-0707-Rev. K, 30-Sep-13 DWG: 5843 E-mail:China@VBsemi TEL:86-755-83251052 www.VBsemi.tw SPB80N06S2-07 A ll data sheet.com
RECOMMENDED MINIMUM PADS FOR D2PAK: 3-Lead 0.635 (16.129) Recommended Minimum Pads Dimensions in Inches/(mm) 0.420 (10.668) 0.355 (9.017) 0.145 (3.683) 0.135 (3.429) 0.200 (5.080) 0.050 (1.257) E-mail:China@VBsemi TEL:86-755-83251052 www.VBsemi.tw SPB80N06S2-07 A ll data sheet.com
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