SP4400

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S mHop Microelectronics C orp.a SP4400 Symbol VDS VGS IDM EAS W A PD -55 to 150 ID UnitsParameter V V±20 TC=25°C Gate-Source Voltage Drain-Source Voltage THERMAL CHARACTERISTICS mJ PRODUCT SUMMARY (DIE 1) VDSS ID RDS(ON) (mΩ) Max 40V 28A 34 @ VGS=4.5V 23 @ VGS=10V Dual N-Channel Enhancement Mode Field Effect Transistor ABSOLUTE MAXIMUM RATINGS (TC=25°C unless otherwise noted ) Die 1 Drain Current-Continuous c -Pulsed a c A Sigle Pulse Avalanche Energy d Maximum Power Dissipation Operating Junction and Storage Temperature RangeTJ, TSTG www.samhop.com.tw Mar,19,2015 Details are subject to change without notice. 4Thermal Resistance, Junction-to-CaseR JC TC=25°C PRODUCT SUMMARY (DIE 2) VDSS ID RDS(ON) (mΩ) Max 40V 66A 15 @ VGS=4.5V 10 @ VGS=10V 114 Die 2 TC=70°C A22.4 52.8

20 WTC=70°C

°C/W 12149 Ver 1.0 Green Product 1.6 S 2 S 2 S 2 G 2 G 1 PDFN 5x6 S1/D2 S1/D2

IGSS ±100 nA VGS(th) V gFS S CISS 533 pF COSS 87 pF CRSS 71 pF Qg nC tD(ON) ns tr ns tD(OFF) ns tf ns VDS=20V,VGS=0V SWITCHING CHARACTERISTICS VDD=20V ID=1A VGS=10V RGEN= 6 ohm Total Gate Charge Rise Time Turn-Off Delay Time Fall Time Turn-On Delay Time m ohm VGS=10V , ID=7A VDS=5V , ID=7A Input Capacitance Output Capacitance DYNAMIC CHARACTERISTICS RDS(ON) Drain-Source On-State Resistance Forward Transconductance IDSS uA Gate Threshold Voltage VDS=VGS , ID=250uA VDS=32V , VGS=0V VGS= ±20V , VDS=0V Zero Gate Voltage Drain Current Gate-Body Leakage Current DIE 1 - ELECTRICAL CHARACTERISTICS (TC=25°C unless otherwise noted ) OFF CHARACTERISTICS Parameter Conditions Drain-Source Breakdown Voltage VGS=0V , ID=250uA Reverse Transfer Capacitance ON CHARACTERISTICS VGS=4.5V , ID=6A 25 34 m ohm b f=1.0MHz b SP4400 Ver 1.0 www.samhop.com.tw Mar,19,2015 nCQgs nCQgd 1.2 3Gate-Drain Charge Gate-Source Charge VDS=20V,ID=7A, VGS=10V DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS nC5.5 VDS=20V,ID=7A,VGS=10V VDS=20V,ID=7A,VGS=4.5V VSD Diode Forward Voltage VGS=0V,IS=1A 0.77 1.2 V 1 1.8 3 Notes a.Pulse Test:Pulse Width < 10us, Duty Cycle < 1%. b.Guaranteed by design, not subject to production testing. c.Drain current limited by maximum junction temperature. d.Starting TJ=25°C,L=0.5mH,VDD = 20V.(See Figure13) e.Mounted on FR4 Board of 1 inch2 , 2oz. _ _

Ver 1.0 www.samhop.com.tw Mar,19,2015 Symbol Min Typ Max Units BVDSS 40 V IGSS ±100 nA VGS(th) V gFS S CISS 1414 pF COSS 170 pF CRSS 146 pF Qg nC tD(ON) ns tr ns tD(OFF) ns tf ns VDS=20V,VGS=0V SWITCHING CHARACTERISTICS VDD=20V ID=1A VGS=10V RGEN= 6 ohm Total Gate Charge Rise Time Turn-Off Delay Time Fall Time Turn-On Delay Time m ohm VGS=10V , ID=16.5A VDS=5V , ID=16.5A Input Capacitance Output Capacitance DYNAMIC CHARACTERISTICS RDS(ON) Drain-Source On-State Resistance Forward Transconductance IDSS uA Gate Threshold Voltage VDS=VGS , ID=250uA VDS=32V , VGS=0V VGS= ±20V , VDS=0V Zero Gate Voltage Drain Current Gate-Body Leakage Current DIE 2 - ELECTRICAL CHARACTERISTICS (TC=25°C unless otherwise noted ) OFF CHARACTERISTICS Parameter Conditions Drain-Source Breakdown Voltage VGS=0V , ID=250uA Reverse Transfer Capacitance ON CHARACTERISTICS VGS=4.5V , ID=13.5A 11 15 m ohm b f=1.0MHz b nCQgs nCQgd 6.2Gate-Drain Charge Gate-Source Charge VDS=20V,ID=16.5A, VGS=10V DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS nC12 VDS=20V,ID=16.5A,VGS=10V VDS=20V,ID=16.5A,VGS=4.5V VSD Diode Forward Voltage VGS=0V,IS=3A 0.78 1.2 V 1 1.6 3 Notes a.Pulse Test:Pulse Width < 10us, Duty Cycle < 1%. b.Guaranteed by design, not subject to production testing. c.Drain current limited by maximum junction temperature. d.Starting TJ=25°C,L=0.5mH,VDD = 20V.(See Figure13) e.Mounted on FR4 Board of 1 inch2 , 2oz. _ _

Figure 7. On-Resistance vs. Figure 8. Body Diode Forward Voltage Figure 9. Capacitance Figure 10. Gate Charge Figure 11. switching characteristics Figure 12. Maximum Safe Operating Area

25 C75 C

www.samhop.com.tw Mar,19,2015 PACKAGE OUTLINE DIMENSIONS Ver 1.0 PDFN 5x6-8L SYMBOLS MIN NOM MAX MIN NOM MAX MILLIMETERS INCHES A b c D E e L f 0.85 0.90 1.00 0.00 0.05 0.35 0.40 0.45 0.15 0.20 0.25 4.50 4.60 4.70 2.125 2.175 2.225 0.835 0.885 0.935 2.40 2.45 2.50 0.40 0.45 0.50 1.125 1.175 1.225 0.475 0.525 0.575 0.35 0.45 0.55 0.00 0.10 1.375 1.475 1.575 0.20 0.30 0.40 1.30 1.40 1.50 0.575 0.675 0.775 45° 0° 10°

5.20 BSC

5.55 BSC

6.05 BSC

1.27 BSC

0.033 0.035 0.039 0.000 0.002 0.014 0.016 0.018 0.006 0.008 0.010 0.177 0.181 0.185 0.084 0.086 0.088 0.033 0.035 0.037 0.094 0.096 0.098 0.016 0.018 0.020 0.044 0.046 0.048 0.019 0.021 0.023 0.014 0.018 0.022 0.000 0.004 0.054 0.058 0.062 0.008 0.012 0.016 0.051 0.055 0.059 0.023 0.027 0.031 45° 0° 10°

0.205 BSC

0.219 BSC

0.238 BSC

0.050 BSC

www.samhop.com.tw11 TOP MARKING DEFINITION PDFN 5x6-8L 4400 XXXXXX Product No. SamHop Logo Pin 1 Wafer Lot No. Production Month (1,2 ~ 9, A,B,C) SMC internal Code No.(A,B,C...Z) SP4400 Mar,19,2015 Ver 1.0