SP3220EB

SP3220EBCY-L SIPEX | Alldatasheet

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Technical content

Rev: A Date:12/11/03 SP3220EB/EU +3.0 to +5.0V RS-232 Transceivers © Copyright 2002 Sipex Corporation High Speed +3.0V to +5.5V RS-232 Driver/Receiver Pair SP3220EB/EU

DESCRIPTION

■ Meets True RS-232 Protocol Operation From A +3.0V to +5.5V Power Supply ■ Minimum 250 Kbps Data Rate (SP3220EB) or 1Mbps Data Rate (SP3220EU) under Fully Load ■ 1µA Low-Power Shutdown With Receivers Active ■ Interoperable With EIA/TIA - 232 and adheres to EIA/TIA - 562 Down to +2.7V Power Source ■ Pin-Compatible With The MAX3221E Device Without The AUTO ON-LINE ® Feature ■ ESD Specifications: +15kV Human Body Model +15kV IEC1000-4-2 Air Discharge +8kV IEC1000-4-2 Contact Discharge The SP3220EB/EU device is an RS-232 driver/receiver solution intended for portable or hand- held applications such as notebook or palmtop computers. The SP3220EB/EU device has a high- efficiency, charge-pump power supply that requires only 0.1µF capacitors in 3.3V operation. This charge pump allows the SP3220EB/EU device to deliver true RS-232 performance from a single power supply ranging from +3.3V to +5.0V. The ESD tolerance of the SP3220EB/EUE device is over ±15kV for both Human Model and IEC1000-4-2 Air discharge test methods. The SP3220EB/EU device has a low-power shutdown mode where the driver outputs and charge pumps are disabled. During shutdown, the supply current falls to less than 1µA. SP3220EB/EU GND T1IN T1OUT C1+ C1- C2+ C2- VCC 0.1µF 0.1µF 0.1µF *C3 0.1µF 0.1µF

13 RS-232

5kΩ R1INR1OUT9 8LOGIC OUTPUTS *can be returned to either VCC or GND EN1 SHDN 16 SP3220EB/EU

Rev: A Date:12/11/03 SP3220EB/EU +3.0 to +5.0V RS-232 Transceivers © Copyright 2002 Sipex Corporation NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V. ABSOLUTE MAXIMUM RATINGS These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability and cause permanent damage to the device. V Input Voltages +25V Output Voltages Short-Circuit Duration Power Dissipation Per Package 16-pin Wide SOIC (derate 11.2mW/oC above+70oC) 900mW SPECIFICATIONS Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.0V with TAMB = TMIN to TMAX . Typical Values apply at VCC = +3.3V or +5.0V and TAMB = 25oC, C1-4=0.1µF. RETEMARAP. NIM. PYT. XAMS TINUS NOITIDNOC SCITSIRETCARAHCCD tnerruCylppuS3 .00 .1A mT ,daolon BMA 52+= o V,C CC V3.3= VroDNG=NIxT CC tnerruCylppuSnwodtuhS0 .10 1 µA ,DNG=NDHST BMA 52+= o V,C CC V3.3+= VroV0=NIxT CC STUPTUOREVIECERDNASTUPNICIGOL WOLdlohserhTcigoLtupnI8 .0V 2 etoN,NDHS,NE,NIxT HGIHdlohserhTcigoLtupnI0 .2V V CC ro2etoN,V3.3=2 etoN,V0.5 tnerruCegakaeLtupnI1 0.0±0 .1± µA ,NDHS,NE,NIxT T BMA 52+= o VC NI VotV0= CC tnerruCegakaeLtuptuO5 0.0±0 1± µA VdelbasiDsrevieceR TUO VotV0= CC WOLegatloVtuptuO4 .0V I TUO Am6.1= HGIHegatloVtuptuOV CC 6.0-V CC 1.0-V I TUO Am0.1-= STUPTUOREVIRD gniwSegatloVtuptuO0 .5±4 .5±V k 3 Ω ,stuptuorevirdllatadnuorgotdaol T BMA 52+= oC ecnatsiseRtuptuO0 03 Ω V CC T,V0=-V=+V= TUO =+ V2 tnerruCtiucriC-trohStuptuO5 3±0 6±A mV TUO V0= tnerruCegakaeLtuptuO5 2± µA V TUO =+ V,V21 CC delbasidsrevird,V5.5otV0= V CC GND

Rev: A Date:12/11/03 SP3220EB/EU +3.0 to +5.0V RS-232 Transceivers © Copyright 2002 Sipex Corporation SPECIFICATIONS (continued) Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.0V with TAMB = TMIN to TMAX . Typical Values apply at VCC = +3.3V or +5.0V and TAMB = 25oC, C1-4=0.1µF. NOTE 2: Driver input hysteresis is typically 250mV. RETEMARAP. NIM. PYT. XAMS TINUS NOITIDNOC STUPNIREVIECER egnaRegatloVtupnI5 2-5 2+V WOLdlohserhTtupnI6 .0 8.0 2.1 5.1 VV CC V3.3= V CC V0.5= HGIHdlohserhTtupnI5 .1 8.1 4.2 4.2 VV CC V3.3= V CC V0.5= siseretsyHtupnI3 .0V ecnatsiseRtupnI3 5 7 k Ω SCITSIRETCARAHCGNIMIT etaRataDmumixaM0 52s pbKR L k3= Ω C, L )BE0223PS(Fp0001= etaRataDmumixaM0 001s pbKR L k3= Ω C, L )UE0223PS(Fp052= revieceRy aleDnoitagaporPr5 1.0 51.0 µs µs t LHP C,TUOxRotNIxR, L Fp051= t LHP C,TUOxRotNIxR, L Fp051= emiTelbanEtuptuOrevieceR0 02s n emiTelbasiDtuptuOrevieceR0 02s n wekSrevirD0 01s nt | LHP t- HLP T,| BMA 52= oC wekSrevieceR0 5s nt | LHP t- HLP | etaRwelSnoigeR-noitisnarT 03/ V µs /V µs V CC R,V3.3= L K3= Ω T, BMA 52= o ,C V0.3+otV0.3-morfnekatstnemerusaem )BE0223PS(V0.3-otV0.3+ro )UE0223PS(

Table 1. Device Pin Description

Figure 10. Pinout Configurations for the SP3220EB/EU

Figure 11. SP3220EB/EU Typical Operating Circuits

Rev: A Date:12/11/03 SP3220EB/EU +3.0 to +5.0V RS-232 Transceivers © Copyright 2002 Sipex Corporation The SP3220EB/EU device meets the EIA/TIA- 232 and V.28/V.24 communication protocols and can be implemented in battery-powered, portable, or hand-held applications such as notebook or palmtop computers. The SP3220EB/ EU device features Sipex's proprietary on- board charge pump circuitry that generates 2 x V CC for RS-232 voltage levels from a single +3.0V to +5.5V power supply. This series is ideal for +3.3V-only systems, mixed +3.0V to +5.5V systems, or +5.0V-only systems that re- quire true RS-232 performance. The SP3220EB device has a driver that can operate at a data rate of 250Kbps fully loaded. The SP3220EU can Operate at 1000Kbps The SP3220EB/EU is a 1-driver/1-receiver de- vice ideal for portable or hand-held applications. The SP3220EB/EU features a 1µA shutdown mode that reduces power consumption and ex- tends battery life in portable systems. Its receiv- ers remain active in shutdown mode, allowing external devices such as modems to be monitored using only 1µA supply current. THEORY OF OPERATION The SP3220EB/EU device is made up of three basic circuit blocks: 1. Drivers, 2. Receivers, and 3. the Sipex proprietary charge pump. Drivers The drivers are inverting level transmitters that convert TTL or CMOS logic levels to +5.0V EIA/TIA-232 levels inverted relative to the input logic levels. Typically, the RS-232 output voltage swing is +5.5V with no load and at least +5V minimum fully loaded. The driver outputs are protected against infinite short-circuits to ground without degradation in reliability. Driver outputs will meet EIA/TIA-562 levels of +3.7V with supply voltages as low as 2.7V. The SP3220EB drivers typically can operate at a data rate of 250Kbps fully loaded with 3KΩ in parallel with 1000pF, ensuring compatibility with PC-to-PC communication software. The SP3220EU drivers can guarantee a data rate of 1000Kbps fully loaded with 3 in parallel with 250pF. The slew rate of the SP3220EB output is inter- nally limited to a maximum of 30V/µs in order to meet the EIA standards (EIA RS-232D 2.1.7, Paragraph 5). The transition of the loaded output from HIGH to LOW also meets the monotonicity requirements of the standard. Figure 12 shows a loopback circuit used to test the RS-232 driver. Figure 13 shows the test results of the loopback circuit with the SP3220EB driver active at 250Kbps with an RS-232 load in parallel with a 1000pF capacitor. Figure 14 shows the test results where the SP3220EU driver was active at 1000Kbps and loaded with an RS-232 receiver in parallel with a 250pF capacitor. A solid RS-232 data transmission rate of 250Kbps provides compatibility with many designs in personal computer peripherals and LAN applications. The SP3220EB/EU driver's output stage is turned off (high-Z) when the device is in shutdown mode. When the power is off, the SP3220EB/ EU device permits the outputs to be driven up to +12V. The driver's input does not have pull-up resistors. Designers should connect an unused input to VCC or GND. In the shutdown mode, the supply current falls to less than 1µA, where SHDN = LOW. When the SP3220EB/EU device is shut down, the device's driver output is disabled (high-Z) and the charge pump is turned off with V+ pulled down to VCC and V- pulled to GND. The time required to exit shutdown is typically 100µs. Connect SHDN to V CC if the shutdown mode is not used. SHDN has no effect on RxOUT. Note that the driver is enabled only when the magnitude of V- exceeds approximately 3V.

Table 2. Truth Table Logic for Shutdown and receiver outputs can be found in Table 2. have a typical hysteresis margin of 300mV. CC ) over the +3.0V to +5.5V range. bypass capacitor at C5 (refer to Figures 11). capacitors as close to the IC as possible. regulated to a minimum voltage of -5.5V. to VCC and the negative side is connected to GND. voltage potential across C2 is 2 times VCC .

Rev: A Date:12/11/03 SP3220EB/EU +3.0 to +5.0V RS-232 Transceivers © Copyright 2002 Sipex Corporation Phase 4 — V DD transfer — The fourth phase of the clock connects the negative terminal of C2 to GND, and transfers this positive generated voltage across C2 to C4, the VDD storage capacitor. This voltage is regulated to +5.5V. At this voltage, the internal oscillator is disabled. Simultaneous with the transfer of the voltage to C4, the positive side of capacitor C1 is switched to VCC and the negative side is connected to GND, allowing the charge pump cycle to begin again. The charge pump cycle will continue as long as the operational conditions for the internal oscillator are present. Since both V + and V– are separately generated from VCC ; in a no–load condition V+ and V– will be symmetrical. Older charge pump approaches that generate V– from V+ will show a decrease in the magnitude of V– compared to V+ due to the inherent inefficiencies in the design. The clock rate for the charge pump typically operates at 250kHz. The external capacitors can be as low as 0.1µF with a 16V breakdown voltage rating. ESD Tolerance The SP3220EB/EU device incorporates rugge- dized ESD cells on all driver output and receiver input pins. The ESD structure is improved over our previous family for more rugged applications and environments sensitive to electro-static discharges and associated transients. The im- proved ESD tolerance is at least ±15kV without damage nor latch-up. There are different methods of ESD testing applied: a) MIL-STD-883, Method 3015.7 b)IEC1000-4-2 Air Discharge c)IEC1000-4-2 Direct Contact The Human Body Model has been the generally accepted ESD testing method for semiconductors. This method is also specified in MIL-STD-883, Method 3015.7 for ESD testing. The premise of this ESD test is to simulate the human body’s potential to store electro-static energy and discharge it to an integrated circuit. The simulation is performed by using a test model as shown in Figure 20. This method will test the IC’s capability to withstand an ESD transient during normal handling such as in manufacturing areas where the ICs tend to be handled frequently. The IEC-1000-4-2, formerly IEC801-2, is gen- erally used for testing ESD on equipment and system manufacturers, they must guarantee a certain amount of ESD protection since the system itself is exposed to the outside enviroment and human presence. The premise with IEC1000- 4-2 is that the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the equipment that are accesible to personnel during normal usage. The transceiver IC receives most of the ESD current when the ESD source is applied to the connector pins. The test circuit for IEC-1000-4- 2 is shown in Figure 21. There are two methods within IEC-4-2, the Air Discharge method and the Contact Discharge method. With the Air Discharge Method, an ESD voltage is applied to the equipment under test (EUT) trough air. This simulates an electrically charged person ready to connect a cable onto the rear of the system only to find an unpleasent zap just before the person touches the back panel. The high energy potential on the person discharges through an arcing path to the rear panel system before he or she even touches the system. This energy, weather discharged directly or through air, is predominantly a function of the discharge cur- rent rather than the discharge voltage. Variables with an air discharge such as ap- proach speed of the object carrying the ESD potential to the system and humidity will tend to change the discharge current. For example, the rise time of the discharge current varies with the approach speed.

Figure 22. ESD Test Waveform for IEC1000-4-2

Rev: A Date:12/11/03 SP3220EB/EU +3.0 to +5.0V RS-232 Transceivers © Copyright 2002 Sipex Corporation D EH PACKAGE: PLASTIC SHRINK SMALL OUTLINE (SSOP) DIMENSIONS (Inches) Minimum/Maximum (mm) 20–PIN A Ø LBe A B D E e H L Ø 0.068/0.078 (1.73/1.99) 0.002/0.008 (0.05/0.21) 0.010/0.015 (0.25/0.38) 0.278/0.289 (7.07/7.33) 0.205/0.212 (5.20/5.38)

0.0256 BSC

(0.65 BSC) 0.301/0.311 (7.65/7.90) 0.022/0.037 (0.55/0.95) 0°/8° (0°/8°) 24–PIN 0.068/0.078 (1.73/1.99) 0.002/0.008 (0.05/0.21) 0.010/0.015 (0.25/0.38) 0.317/0.328 (8.07/8.33) 0.205/0.212 (5.20/5.38) (0.65 BSC) 0.301/0.311 (7.65/7.90) 0.022/0.037 (0.55/0.95) 0°/8° (0°/8°) 28–PIN 0.068/0.078 (1.73/1.99) 0.002/0.008 (0.05/0.21) 0.010/0.015 (0.25/0.38) 0.397/0.407 (10.07/10.33) 0.205/0.212 (5.20/5.38) (0.65 BSC) 0.301/0.311 (7.65/7.90) 0.022/0.037 (0.55/0.95) 0°/8° (0°/8°) 16–PIN 0.068/0.078 (1.73/1.99) 0.002/0.008 (0.05/0.21) 0.010/0.015 (0.25/0.38) 0.239/0.249 (6.07/6.33) 0.205/0.212 (5.20/5.38) (0.65 BSC) 0.301/0.311 (7.65/7.90) 0.022/0.037 (0.55/0.95) 0°/8° (0°/8°)

Rev: A Date:12/11/03 SP3220EB/EU +3.0 to +5.0V RS-232 Transceivers © Copyright 2002 Sipex Corporation D EH PACKAGE: PLASTIC SMALL OUTLINE (SOIC) DIMENSIONS (Inches) Minimum/Maximum (mm) A Ø LBe A B D E e H L Ø 16–PIN 0.090/0.104 (2.29/2.649) 0.004/0.012 (0.102/0.300) 0.013/0.020 (0.330/0.508) 0.398/0.413 (10.10/10.49) 0.291/0.299 (7.402/7.600)

0.050 BSC

(1.270 BSC) 0.394/0.419 (10.00/10.64) 0.016/0.050 (0.406/1.270) 0°/8° (0°/8°) 18–PIN 0.090/0.104 (2.29/2.649)) 0.004/0.012 (0.102/0.300) 0.013/0.020 (0.330/0.508) 0.447/0.463 (11.35/11.74) 0.291/0.299 (7.402/7.600) (1.270 BSC) 0.394/0.419 (10.00/10.64) 0.016/0.050 (0.406/1.270) 0°/8° (0°/8°)

Rev: A Date:12/11/03 SP3220EB/EU +3.0 to +5.0V RS-232 Transceivers © Copyright 2002 Sipex Corporation PACKAGE: PLASTIC THIN SMALL OUTLINE (TSSOP) DIMENSIONS in inches (mm) Minimum/Maximum 16–PIN A Ø LBe A B D E e L Ø - /0.043 (- /1.10) 0.002/0.006 (0.05/0.15) 0.007/0.012 (0.19/0.30) 0.193/0.201 (4.90/5.10) 0.169/0.177 (4.30/4.50)

0.026 BSC

(0.65 BSC)

0.126 BSC

(3.20 BSC) 0.020/0.030 (0.50/0.75) 0°/8° D - /0.043 (- /1.10) 0.002/0.006 (0.05/0.15) 0.007/0.012 (0.19/0.30) 0.252/0.260 (6.40/6.60) 0.169/0.177 (4.30/4.50) (0.65 BSC) (3.20 BSC) 0.020/0.030 (0.50/0.75) 0°/8° 20–PIN E

Rev: A Date:12/11/03 SP3220EB/EU +3.0 to +5.0V RS-232 Transceivers © Copyright 2002 Sipex Corporation

ORDERING INFORMATION

Model Temperature Range Package Type Corporation ANALOG EXCELLENCE Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the application or use of any product or circuit described hereing; neither does it convey any license under its patent rights nor the rights of others. Sipex Corporation Headquarters and Sales Office

233 South Hillview Drive

Milpitas, CA 95035 TEL: (408) 934-7500 FAX: (408) 935-7600 Sales Office

22 Linnell Circle

Billerica, MA 01821 TEL: (978) 667-8700 FAX: (978) 670-9001 e-mail: sales@sipex.com