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Tire Pressure Monitoring Sensor SP30 TS Rev. Page of 1085 Date Sign Rev Reference Date Dok Prepared 030131 AuR 00 Arkiv 49/03 030630 HKW Checked 030625 RH 3 EM 11148 060309 Approved 030625 AuR 4 EM 12194 Stamp Datasheet Tire Pressure Monitoring Sensor SP30 Revisions dates: 00 2003-01-03 1 2004-01-15 2 2005-11-25 3 2006-03-03 4 2008-08-29 5 2009-06-30 Document history: See end of document
Tire Pressure Monitoring Sensor SP30 TS Rev. Page of 1085 Edition 2009-06-30 Published by Infineon Technologies AG Am Campeon 1-12
85579 Neubiberg, Germany
© Infineon Technologies AG 2006. All Rights Reserved. The information given in this data sheet shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Tire Pressure Monitoring Sensor SP30 TS Rev. Page of 1085
1 Product Description
1.1 Overview
The SP30 Tire Pressure Monitoring (TPM) Sensor represents Infineon’s standard pressure range TPM sensor. The SP30 offers a high level of integration by including a microcontroller, signal conditioning and LF-input stage to meet market demands for flexible, customer specific solutions and overall system cost reduction. The sensor design is based on Infineon’s proprietary and patented solutions for high reliability measurements in harsh automotive environments. Its predictable and stable quality is proven in high volume applications. The SP30 measures pressures up to 900kPa, temperature, supply voltage and acceleration (optional), and by integrating these functions with an ASIC in one package, Infineon has developed the ideal product for standard pressure TPM applications.
1.2 Features
- Integrated Sensors o Pressure o Acceleration (optional) o Temperature o Voltage
- Integrated Peripherals o Microcontroller o On board EEPROM o GPIOs o ADC for signal conditioning o 2x LF Receiver for triggering
- Measurement Ranges o Pressure Sensor 100 to 450 kPa / 100 to 900kPa o Temperature Sensor -40 to +125°C o Supply Voltage Sensor 2.1 to 3.6 V o Acceleration Sensor -12 to 115 g
1.3 Ordering Information
Product Name Product Type Ordering Code Package SP300V5.0-E106-0 100...450kPa SP000435430 P-DSOSP-14-6 SP300V5.0-E116-0 100...900kPa SP000477044 P-DSOSP-14-6 SP300V5.0-E206-0 100...450kPa, no acceleration sensor SP000477042 P-DSOSP-14-6 SP300V5.0-E216-0 100...900kPa, no acceleration sensor SP000477040 P-DSOSP-14-6
Tire Pressure Monitoring Sensor SP30 TS Rev. Page of 1085
2 Product Characteristics
The max and min values are to be understood as + and - 5σ values (Cpk = 1.67) unless otherwise specified.
2.1 Measurement performance
2.1.1 Pressure measurement
The presented performance reflects the use of 11-bit measurement of pressure signal and 10-bit measurement of temperature.
2.1.1.1 Standard pressure measurement range
Table 1 Pressure measurement specifications, 100-450kPa range SPECIFICATION AMBIENT CONDITIONS PARAMETER Min Typ Max Unit Temp [°C] VDD [V] COMMENTS Pressure range 100 450 kPa -40 to 125 2.1 to 3.6 -7 7 kPa 0 to 50 2.1 to 3.6 -9 9 kPa 50 to 70 2.1 to 3.6 Measurement error -17.5 17.5 kPa -40 to 125 2.1 to 3.6
2.1.1.2 Optional pressure measurement ranges
Table 2 Pressure measurement specifications, 100-700kPa range SPECIFICATION AMBIENT CONDITIONS PARAMETER Min Typ Max Unit Temp [°C] VDD [V] COMMENTS Pressure range 100 700 kPa -40 to 125 2.1 to 3.6 -11 11 kPa 0 to 50 2.1 to 3.6 -14 14 kPa 50 to 70 2.1 to 3.6 Measurement error -28 28 kPa -40 to 125 2.1 to 3.6 Table 3 Pressure measurement specifications, 100-800kPa range SPECIFICATION AMBIENT CONDITIONS PARAMETER Min Typ Max Unit Temp [°C] VDD [V] COMMENTS Pressure range 100 800 kPa -40 to 125 2.1 to 3.6 -12.5 12.5 kPa 0 to 50 2.1 to 3.6 -16 16 kPa 50 to 70 2.1 to 3.6 Measurement error -19.5 19.5 kPa -40 to 125 2.1 to 3.6 Table 4 Pressure measurement specifications, 100-900kPa range SPECIFICATION AMBIENT CONDITIONS PARAMETER Min Typ Max Unit Temp [°C] VDD [V] COMMENTS Pressure range 100 900 kPa -40 to 125 2.1 to 3.6 -14 14 kPa 0 to 50 2.1 to 3.6 -18 18 kPa 50 to 70 2.1 to 3.6 Measurement error -35 35 kPa -40 to 125 2.1 to 3.6
Tire Pressure Monitoring Sensor SP30 TS Rev. Page of 1085
2.1.2 Acceleration measurement
The presented performance reflects the use of 12-bit measurement of acceleration signal and 10-bit measurement for temperature. Table 5 Acceleration measurement specifications SPECIFICATION AMBIENT CONDITIONS PARAMETER Min Typ Max Unit Temp [°C] VDD [V] COMMENTS Input range -12 115 g -40 to 90 2.1 to 3.6 Sensitivity accuracy -18.75 18.75 % -40 to 90 2.1 to 3.6 -6 6 g -20 to 70 2.1 to 3.6 Offset accuracy -8.5 8.5 g -40 to 90 2.1 to 3.6
2.1.3 Temperature measurement
The presented performance reflects the use of 10-bit measurement of temperature. Table 6 Temperature measurement specifications SPECIFICATION AMBIENT CONDITIONS PARAMETER Min Typ Max Unit Temp [°C] VDD [V] COMMENTS -3 3 °C -20 to 70 2.1 to 3.6 -5 5 °C -40 to 90 2.1 to 3.6 Measurement error -3 7 °C 90 to 125 2.1 to 3.6
2.1.4 Supply voltage measurement
The presented performance reflects the use of 9-bit measurement of supply voltage. Table 7 Supply voltage measurement specifications SPECIFICATION AMBIENT CONDITIONS PARAMETER Min Typ Max Unit TEMP [°C] VDD [V] COMMENTS Measurement error -100 +100 mV -40 to 125 V THR to 3.6
Tire Pressure Monitoring Sensor SP30 TS Rev. Page of 1085
2.2 Current consumption
Table 8 Current consumption SPECIFICATION AMBIENT CONDITIONS PARAMETER Min Typ Max Unit Temp [°C] VDD [V] COMMENTS Power down current 0.4 0.6 µA 25 3.0 Power down current 13 20 µA 125 3.0 IDLE current 30 50 µA 25 3.0 IDLE current 50 75 µA 125 3.0 RUN current 0.53 0.8 mA 25 3.0 RUN current 0.65 1.0 mA 125 3.0 Pressure measurement 4 12 µAs -40 to 125 2.1 to 3.6 11 bit A/D conversion, excl. temperature meas Acceleration measurement 6 16 µAs -40 to 125 2.1 to 3.6 12 bit A/D conversion, excl. temperature meas Temperature measurement 0.9 2.5 µAs -40 to 125 2.1 to 3.6 10 bit A/D conversion Supply voltage measurement 0.3 2.5 µAs -40 to 125 2.1 to 3.6 9 bit A/D conversion Peak current 1.6 2.5 mA 25 3.0 Pressure measurement and 1 LF channel on, duration is 1280µs for 11 bit measurement for the peak current only. 1 channel LF current 2.6 4.6 µA 25 3.0 1 channel LF current 3.0 6.7 µA 125 3.0 2 channel LF current 4.5 5.5 µA 25 3.0 2 nd LF channel is optional 2 channel LF current 6.5 11 µA 125 3.0 2 nd LF channel is optional Thermal shutdown current 18 25 µA 125 3.0 Thermal shutdown current 30 50 µA 150 3.0
2.3 Tmax
ϑSHTD represents the temperature at which the Thermal Shut-down function can be enabled and ϑREL represents the temperature at which the Master Reset state is released. The ϑSHTD is always higher than ϑREL. Table 9 Trigger temperatures for thermal shutdown SPECIFICATION AMBIENT CONDITIONS PARAMETER Min Typ Max Unit TEMP [°C] VDD [V] COMMENTS ϑSHTD 102 123 °C -40 to 175 2.1 to 3.6 Thermal shutdown enable ϑREL 100 121 °C -40 to 175 2.1 to 3.6 Master Reset release
2.4 Vmin
The voltage at which the Vmin-circuit will return a low battery voltage status is specified in Table 10: Table 10 Vmin specifications SPECIFICATION AMBIENT CONDITIONS PARAMETER Min Typ Max Unit TEMP [°C] VDD [V] COMMENTS Vmin 2.0 2.1 2.2 V -40 to 125 V THR to 3.6
Tire Pressure Monitoring Sensor SP30 TS Rev. Page of 1085
2.5 Clock sources
2.5.1 System clock (MCLK)
Table 11 System clock (MCLK) specifications SPECIFICATION AMBIENT CONDITIONS PARAMETER Min Typ Max Unit TEMP [°C] VDD [V] COMMENTS
2.5.2 Low Power (LP) oscillator
Table 12 LP oscillator specifications SPECIFICATION AMBIENT CONDITIONS PARAMETER Min Typ Max Unit TEMP [°C] VDD [V] COMMENTS del2t 25, 50, 75 or 100 ms -40 to 125 2.1 to 3.6 Delay to extra tick LP oscillator accuracy -20 20 % -40 to 125 2.1 to 3.6
2.5.3 External clock
Table 13 External clock specifications SPECIFICATION AMBIENT CONDITIONS PARAMETER Min Typ Max Unit TEMP [°C] VDD [V] COMMENTS External clock 3.5 MHz -40 to 125 2.1 to 3.6
2.6 LF input
SPECIFICATION AMBIENT CONDITIONS PARAMETER Min Typ Max Unit TEMP [°C] VDD [V] COMMENTS Modulation ASK -40 to 125 2.1 to 3.6 Carrier frequency 121.25 125 128.75 kHz -40 to 125 2.1 to 3.6 Preamble period 4 ms -40 to 125 2.1 to 3.6 Settling time 2 ms -40 to 125 2.1 to 3.6 Time from LF interface is turned on by RISC to the LF interface is active Detection threshold 5 mVp-p -40 to 125 2.1 to 3.6 Input capacitance 10 12 pF -40 to 125 2.1 to 3.6 Input resistance 500 kΩ -40 to 125 2.1 to 3.6 Other The input signals from the enabled LF channels are rectified and real time summed
Tire Pressure Monitoring Sensor SP30 TS Rev. Page of 1085 Table 15 LF Carrier Detection SPECIFICATION AMBIENT CONDITIONS PARAMETER Min Typ Max Unit TEMP [°C] VDD [V] COMMENTS Carrier frequency 121.25 125 128.75 kHz -40 to 125 2.1 to 3.6 4 mVp-p 0 to 90 2.1 to 3.6 3.5 mVp-p 90 to 125 2.1 to 3.6 3.5 mVp-p -40 to 0 2.1 to 3.0 Maximum sensitivity not to detect, 2 amplifiers enabled 2.9 mVp-p -40 to 0 3.0 to 3.6 10 mVp-p 0 to 90 2.1 to 3.6 12.2 mVp-p 90 to 125 2.1 to 3.6 Minimum sensitivity to detect, 2 amplifiers enabled 12.2 mVp-p -40 to 0 2.1 to 3.6 0.8 mVp-p -40 3.6 0.25 mVp-p -40 2.1 to 3.0 Maximum sensitivity not to detect, 3 amplifiers enabled 0.25 mVp-p 0 to 125 2.1 to 3.6 Guaranteed by ASIC characterization Minimum sensitivity to detect, 3 amplifiers enabled 2.5 mVp-p -40 to 125 2.1 to 3.6 Guaranteed by ASIC characterization
2.7 Power-on reset
Table 16 Power-on reset level SPECIFICATION PARAMETER Min Typ Max Unit COMMENTS Power-on reset level, VTHR 1.8 1.85 1.9 V
2.8 Digital I/O
Table 17 Digital I/O specifications SPECIFICATION PARAMETER Min Typ Max Unit COMMENTS Digital output high V DD-0.3 V At 1 mA load current Digital output low 0.3 V At 1 mA load current Digital input high 0.8⋅VDD V Digital input low 0.2⋅VDD V Input current ±1 µA
3 Recommended Operating Conditions
Table 18 Recommended operating conditions SPECIFICATION PARAMETER Min Typ Max Unit COMMENTS Supply voltage V THR 3.6 V Unless otherwise specified Ambient temperature -40 125 °C
Tire Pressure Monitoring Sensor SP30 TS Rev. Page of 1085
4 Absolute Maximum Ratings
Table 19 Absolute maximum ratings SPECIFICATION PARAMETER Min Typ Max Unit COMMENTS Ambient temperature, operating -40 150 °C Max 24 hrs accumulated over life time Ambient temperature, storage -40 150 °C Max 1000 hours Transient temperature1 175 °C Max 3 min Supply Voltage -0.3 4.0 V Input voltage -0.3 Vdd+0.3 V Input current, any pin (DC) -10 10 mA Input current, any pin (transient) -100 100 mA Input current, LF pins -1 1 mA Maximum input pressure 1400 kPa Burst pressure 2000 kPa Static acceleration 2000 g Mechanical shock 4000 g Half sine, 0.3ms 2 kV Human body model AEC-Q100 ESD
200 V Machine model AEC-Q100
Attention: Stress beyond the absolute maximum ratings may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the device.
1 Will withstand standard reflow soldering process (JEDEC JESD22-B102-C)
Tire Pressure Monitoring Sensor SP30 TS Rev. Page of 1085
5 Physical Dimensions and Marking
5.1 Physical Dimensions
Figure 1: Physical Dimensions – Drawing P-DSOSP-14-6 1) Dimension does not include mold flash, protrusions or gate burrs. Mold flash, protrusions and gate burrs do not exceed 0.15mm (0.006 inch) per side. 2) Dimension does not include inter-lead flash or protrusions. Inter-lead flash and protrusions do not exceed 0.25mm (0.010 inch) per side.
Tire Pressure Monitoring Sensor SP30 TS Rev. Page of 1085
5.2 Marking
Figure 2 Marking of the SP30 The variables in Figure 2 have the following meaning: KKJWWNNNSXX: Infineon Lot Number YYWW: Date Code (YY = Year, WW = week) ZZZZZ: Product NNNNN: Optional Marking O: Pin 1 Marking
Tire Pressure Monitoring Sensor SP30 TS Rev. Page of 1085
6 Pin Configuration
Figure 3: Pin Configuration. Top view, not to scale Table 20 Pin Description PIN NAME FUNCTION
1 IN4 LF receiver channel 2, negative input
2 P10 General purpose I/O with external wakeup, internal pull-up/pull-down
3 P11 General purpose I/O with external wakeup, internal pull-up/pull-down
4 MSDA Monitor Serial Data I/O, internal pull-up
5 MSCL Monitor Serial Clock input
6 VDD Supply pad VDD (ba ttery, positive terminal)
7 VSS Common ground (battery, negative terminal)
8 VSS Common ground (battery, negative terminal)
9 P17 General purpose I/O (or digital modulator output)
10 P15 General purpose I/O or external clock
11 P14 General purpose I/O (or digital modulator output)
12 IN1 LF receiver channel 1, positive input
13 IN2 LF receiver channel 1, negative input
14 IN3 LF receiver channel 2, positive input
Tire Pressure Monitoring Sensor SP30 TS Rev. Page of 1085
7 Document history
Rev Paragraphs Description
00 First issue of TS1085 (identical to TS0212P rev C)
1 1.1.1.2 Added objective specification for 1400 kPa sensor 1 1.1.3 Temperature accuracy above +90 °C improved to –3 °C 1 1.2 Temperature measurement max value 2.5 µAs 1 1.2 Supply voltage measurement max value 2.5 µAs 1 1.2 Added peak current measurement 1 1.2 1 channel LF current, 25 °C, max value 4.6 µA 1 1.2 1 channel LF current, 125 °C, max value 6.7µA 1 1.6 LF input capacitance max value included 1 1.6 LF input resistor min value included, typical value removed, comment removed 1 3 Ambient temperature, storage, max 1000 hrs 1 3 Input currents specified 1 3 Maximum input pressure and burst pressure values listed in minimum column 2 1.1.1 (All tables) Added specification point between 50 and 70 °C to meet ISO standard 2 1.1.1 Added specification for 800 kPa 2 4.1 Updated reference to physical dimensions and marking 3 1.1.1 Improved specification for 800 kPa, outer temperatures 3 1.6 LF CD updated 3 1.8 Output high/low values corrected (min/max swapped)
4 Removed “Confidential” Marking
4 Added Disclaimer
4 1 Added Section “Product Description” 4 5 Added Section “Physical Dimension and Marking” 4 6 Added Section “Pin Configuration” 4 4 Added note to maximum ratings 4 2.1.1.2 Removed 1400kPa option 5 5.2 Updated marking