TLE5014D INFINEON | Alldatasheet
Document overview
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Technical content
Features
- Giant Magneto Resistance (GMR)-based principle
- Two identical dies in one package (providing channel 1 and channel 2 output)
- Fully redundant 2-channel solution for highest functional safety requirements
- High voltage and reverse polarity capability
- EEPROM for storage of configuration (e.g . zero angle) and customer specific ID
- 12 bit representation of abso lute angle value on the output
- Max. 1° angle error over li fetime and temperature range
- Developed according to ISO26262 wi th process complying to ASIL-D
- Internal safety mechanisms with diag nostic coverage >97% for each channel
- Interfaces: PWM, SPC, SE NT (based on SAE J2716-2010)
- 32 point look-up table to co rrect for systematic angle errors (e.g. magnetic circuit)
- 112 bit customer ID (programmable)
- Automotive qualified Q100, Grade 1: -40°C to 125°C (ambient temperature) Functional Safety
- Safety Manual and Safety Analysis Summary Report available on request
Applications
The TLE5014 GMR-based angle sensor is designed for an gular position sensing in automotive applications. Fully redundancy of two chips in one package supporting highest functional safety requirements.
Description
Table 0-1 Derivative Ordering codes (see Chapter 4 for description of derivatives) Product Type Marking Order ing Code Package Comment TLE5014S16D 014SD SP001410046 PG-TDSO-16 SENT Interface TLE5014C16D 014CD SP001410042 PG-TDSO-16 SPC Interface TLE5014P16D 014PD SP001673472 PG-TDSO-16 PWM Interface
Final Datasheet 2 Rev. 1.0 2018-04-04 TLE5014D
1.1 Pin Description 3
4.1 TLE5014C16D 6
4.2 TLE5014S16D 6
4.3 TLE5014P16D 7
5.1 Package Parameters 8
5.2 Package Outline 9
5.3 Footprint 10
5.4 Packing 10
5.5 Marking 11
Final Datasheet 3 Rev. 1.0 2018-04-04 TLE5014D Pin Configuration
1 Pin Configuration
Figure 1-1 Pin configuration (top view)
1.1 Pin Description
The following table describes the pin-out of the chip. Pins 1-8 correspond to channel 1 of the sensor (top IC in the package). Pins 9-16 correspond to channel 2 (bottom IC in the package). The two sensors are galvanically decoupled. Table 1-1 Pin Description Pin No. Symbol In/Out Function
1 IF1-1 I address coding for programming in bus mode,
channel 1 (see TLE5014 datasheet) connect to GND for SENT / PWM interface
2 IF2-1 I address coding for programming in bus mode,
channel 1 (see TLE5014 datasheet) connect to GND for SENT / PWM interface
3 IF3-1 I connect to IFC
4 VDD-1 - supply voltage, positive for channel 1
5 GND-1 - supply voltage, ground for channel 1
6 IFA-1 - connect to GND
7 IFB-1 I/O SENT / SPC / PWM / SICI interface for channel 1
8 IFC-1 O address coding for programming in bus mode,
channel 1 (see TLE5014 datasheet) connect to IF3 10111213141516 87654321 Center of Sensitive area
Final Datasheet 4 Rev. 1.0 2018-04-04 TLE5014D Dual Sensor Angle Output
2 Dual Sensor Angle Output
The bottom sensor element of the Pr oduct_Short is flipped relative to the orientation of the top sensor element Therefore the rotation direction sensed by th e bottom element is opposite to the top element. This is advantageous for safety critical applications, as the two sensor elements do generally not output the same angle. Figure 2-1 shows the output of the two sensor ICs for a given external magnetic field orientation. Figure 2-1 Dual die angle output For applications where an identical angle output of both ICs is desired, the rotation direction and angle offset of one sensor IC can be reconfigured by changing the settings in the ANG_BASE register of the EEPROM.
9 IFC-2 O address coding for programming in bus mode,
channel 2 (see TLE5014 datasheet) connect to IF3
10 IFB-2 I/O SENT / SPC / PWM / SICI interface for channel 2
11 IFA-2 - connect to GND
12 GND-2 - supply voltage, ground for channel 2
13 VDD-2 - supply voltage, positive for channel 2
14 IF3-2 I connect to IFC
15 IF2-2 I address coding for programming in bus mode,
channel 2 (see TLE5014 datasheet) connect to GND for SENT / PWM interface
16 IF1-2 I address coding for programming in bus mode,
channel 2 (see TLE5014 datasheet) connect to GND for SENT / PWM interface Table 1-1 Pin Description (cont’d) Pin No. Symbol In/Out Function 0 ° 9 0 ° 1 8 0 °2 7 0 °3 6 0 ° 90° 180° 270° 360° top sensor output bottom sensor output external magnetic field angle sensor output angle
Final Datasheet 5 Rev. 1.0 2018-04-04 TLE5014D Absolute Maximum Ratings
3 Absolute Maximum Ratings
Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the device. Table 3-1 ESD protection Parameter Symbol Values Unit Notes Min. Max. Electro-Static-Discharge voltage (HBM), according to ANSI/ESDA/JEDEC JS-001 V HBM ±4.0 kV HBM contact discharge for pins VDD, GND, IFB; ground pins connected V HBM ±2.0 kV HBM contact discharge for all pins, ground pins not connected Electro-Static-Discharge voltage (CDM), according to JESD22-C101 VCDM ±0.5 kV for all pins except corner pins ±0.75 kV for corner pins only
Final Datasheet 6 Rev. 1.0 2018-04-04 TLE5014D Pre-Configured Derivatives
4 Pre-Configured Derivatives
Derivatives of the TLE5014D are available with differ ent pre-configured register settings for specific application (“settings”). For each derivative with such settings, the interface ty pe is locked and cannot be changed. Only the derivatives with such settings have been released for production by Infineon. Other settings/parameters for other applications could be adjusted but such adjusted settings would not have been released for production by Infineon. Furthermore, the available safety analysis and safety manual does only include these preconfigured derivatives.
4.1 TLE5014C16D
The sensor has SPC as predefined interface which is locked and cannot be changed. The predefined SPC configuration of TLE5014C16D is shown below: Following parameters and values are allowed to modify:
- SPC unit time: 1.5µs / 2.5µs
- Short serial message: enable / disable
- Rolling counter in CRC: enable /disable
- SPC ID: 0 / 1 / 2 / 3
4.2 TLE5014S16D
The sensor has SENT as predefined interface which is locked and cannot be changed. The predefined SENT configuration of TLE5014S16D is shown below: Following parameters and values are allowed to modify:
- Short serial message: enable / disable
- Pause pulse: enable /disable
- SENT Protocol Type: Standa rd / Single Secure Sensor Table 4-1 SPC Derivative Configuration TLE5014C16D Interface SPC unit time SPC low ti me SPC Trigger Short Serial Message SPC 2.5µs 5UT constant 90UT enabled Table 4-2 SPC Derivative Configuration TLE5014C16D Rolling Counter Rolling Counter in CR C Look-up Table SPC ID Output driver enabled disabled enabled, preconfigured 00 B open drain w/ controlled slope Table 4-3 SENT Derivative Configuration TLE5014S16D Interface SENT unit time SE NT low time SENT Protocol Type Short Serial Message SENT 3.0µs 5UT single secure sensor enabled Table 4-4 SENT Derivative Configuration TLE5014S16D SENT Error Indication SENT Data Rang e Pause Pulse Look-up Table Output driver error code 4091 enabled 1 ... 4088 enab led enabled, preconfigured push/pull
Final Datasheet 7 Rev. 1.0 2018-04-04 TLE5014D Pre-Configured Derivatives error code)
4.3 TLE5014P16D
The sensor has PWM as predefined interface which is locked and cannot be changed.
- To be compliant with the existing safety analysis no change of above parameters is allowed unless authorized by Infineon Table 4-5 PWM Derivative Configuration TLE5014P16D Interface PWM Frequency PWM Data Range PWM Fault indication PWM BIST Error or Reset Indication Table 4-6 PWM Derivative Configuration TLE5014P16D PWM Starting Level Look-up Table Output driver high (rising edge) enabled, preconfigured push/pull
Final Datasheet 8 Rev. 1.0 2018-04-04 TLE5014D
Package Information
5 Package Information
The device is qualified with a MSL level of 3. It is halogen free, lead free and RoHS compliant.
5.1 Package Parameters
Figure 5-1 Tolerance of the die in the package Table 5-1 Package Parameters Parameter Symbol Limit Values Unit Notes Min. Typ. Max. Thermal resistance R thJA 120 K/W Junction to air 1), only one chip is active 1) according to Jedec JESD51-7
100 K/W Junction to air 1), both chips
RthJC 45 K/W Junction to case RthJL 70 K/W Junction to lead Moisture Sensitively Level MSL 3 260°C 2) 2) suitable for reflow soldering wi th soldering profiles according to JEDEC J-STD-020E (December 2014) Lead Frame Cu Plating Sn 100% > 7 μm Table 5-2 Position of the die in the package Parameter Symbol Limit Values Unit Notes Min. Typ. Max. Tilt ±3 ° in respect to the z-axis and reference plane (see Figure 5-1), Rotational displacement ±3 ° in respect to the reference axis (see Figure 5-1) Placement tolerance in package ±100 µm in x and y direction, for each die in the package z Tilt angle Reference plane y x Rotational displacement Package Chip x Die pad Chip
Final Datasheet 9 Rev. 1.0 2018-04-04 TLE5014D
5.2 Package Outline
Figure 5-2 PG-TDSO-16 package dimension Figure 5-3 Position of sensing element 0.2 0.2
Final Datasheet 10 Rev. 1.0 2018-04-04 TLE5014D
5.3 Footprint
Figure 5-4 Footprint of PG TDSO-16
5.4 Packing
Final Datasheet 11 Rev. 1.0 2018-04-04 TLE5014D
5.5 Marking
Figure 5-6 Marking of PG-TDSO-16 Position Marking Description 1st Line Gxxxx G..green, 4-digit..date code 2nd Line xxxxxxxx Interface type and version ( see Table 0-1, Marking) 3rd Line xxx Lot code
Final Datasheet 12 Rev. 1.0 2018-04-04 TLE5014D
Revision History
6 Revision History
1.0 2018-03-26 initial version
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