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Technical content

30.05.2012 SMT870-23 1 of 4

Infrared LED, SMD AlGaAs SMT870-23 is a AlGaAs LED, mounted on a lead frame as TOP LED package with plastic ball lens. On forward bias, it emits a radiation of typical 22 mW at a peak wavelength of 870 nm. Specifications (Unit: mm)

  • Structure: AlGaAs
  • Peak Wavelength: 870 nm
  • Optical Output Power: 22 mW
  • Package: SMD, PPA resin Lead frame die: silver plated
  • Lens: epoxy resin (Ø2.6 mm) Absolute Maximum Ratings (TA=25°C) Item Symbol Value Unit Power Dissipation PD 160 mW Forward Current IF 100 mA Pulse Forward Current *1 IFP 1000 mA Reverse Voltage VR 5 V Junction Temperature TJ 100 °C Thermal Resistance Rthja 190 K/W Operating Temperature Topr -20 … +80 °C Storage Temperature Tstg -30 … +8 0 °C Soldering Temperature *2 Tsol 255 °C *1 duty = 1%, pulse width = 10 µs *2 must be completed within 3 seconds at 260°C Electro-Optical Characteristics Item Symbol Condition Min. Typ. Max. Unit Forward Voltage VF IF = 50 mA - 1.45 1.60 V Pulse Forward Voltage VFP IFP = 100mA, tP = 20ms - 1.50 1.80 V Reverse Current IR VR = 5 V - - 10 µA Total Radiated Power PO IF = 50 mA 16 22 - mW IFP = 100mA, tP = 20ms - 44 - Radiant Intensity IE IF = 50 mA - 40 - mW/sr IFP = 100mA, tP = 20ms - 80 - Peak Wavelength λP IF = 50 mA 855 870 885 nm Half Width Δλ IF = 50 mA - 40 - nm Viewing Half Angle Θ1/2 IF = 50 mA - ±15 - deg. Rise Time tr IF = 50 mA - 15 - ns Fall Time tf IF = 50 mA - 10 - ns Radiated Power is measured by Photodyne #500 Radiant Intensity is measured by Tektronix J-6512 Note: The above specifications are for reference purpose only and subjected to change without prior notice.

30.05.2012 SMT870-23 2 of 4

Typical Performance Curves Forward Current – Forward Voltage Radiant Intensity – Forward Current Power Dissipation – Ambient Temperature Forward Current – Ambient Temperature Relative Radiant Intensity – Ambient Temperature Allowed Forward Voltage – Ambient Temperature

30.05.2012 SMT870-23 3 of 4

Relative Spectral Emission Peak Wavelength – Ambient Temperature Radiation Characteristics

30.05.2012 SMT870-23 4 of 4

  1. Cautions
  • DO NOT look directly into the emitting area of the LED during operation!
  • WARNING: LED is emitting invisible light! 2. Soldering Conditions
  • DO NOT apply any stress to the lead particularly when heat.
  • After soldering the LEDs should be protected from mechanical shock or vibration until the LEDs return to room temperature.
  • When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize the mechanical stress on the LEDs. Recommended Land Layout Soldering Conditions (Unit: mm) 3. Static Electricity
  • The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended that a wrist band and/or an anti - electrostatic glove be used when handling the LEDs.
  • All devices, equipment and machinery must be grounded properly. It is recommended that precautions should be taken against surge voltage to the equipment that mounts the LEDs. 4. Heat Generation
  • Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in the specification.
  • The operating current should be decided after considering the ambient maximum temperature of LEDs. 5. Storage
  • The LEDs shou ld be stored at 30°C or less and 60%RH or less after being shipped and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with nitrogen atmosphere and moisture absorbent material at less than 30%RH.
  • Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur.