SMP4050-12UTG SMC | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 5

Technical content

Features

  • ESD protection in accordance with: IEC 61000-4-2 (ESD) ±30kV (air), ±30kV (contact) IEC 61000-4-5 (lightning) 20A (8/20μs) IEC 61000-4-4 (EFT) 40A (5/50ns)
  • Low capacitance: 4.4pF typical per I/O
  • Low leakage current of 1 μA (MAX) at 2.5V

Applications

  • LCD/PDP TVs
  • Desktops
  • Game Consoles
  • Set Top Boxes
  • Notebooks Pinout Functional Block Diagram Note: Pinout diagrams above shown as device footprint on circuit board.

Technical Data Green Products Data Sheet N1737 Rev.-

  • China - Germany - Korea - Singapore - United States •
  • http://www.smc-diodes.com - sales@ smc-diodes.com • SMP4050-12UTG Ordering Information: Device Package Min. Order Qty. SMP4050-12UTG μDFN-12 (Pb-Free) 3000 Absolute Maximum Ratings: Thermal Information: Electrical Characteristics: (TOP=25°C) Characteristics Symbol Condition Min. Typ. Max. Units Reverse Stand-Off Voltage V RWM - - - 2.5 V Snap Back Voltage V SB I SB=50mA 2.0 - - V Reverse Leakage Current ILEAK VR = 2.5V, I/O to ground - 0.5 1.0 μA Clamping Voltage1 VC IPP = 1A, tp=8/20μs, Fwd - 4.5 - V IPP = 10A, tp=8/20μs, Fwd - 8.9 - V IPP = 20A, tp=8/20μs, Fwd 13.2 - V ESD With stand Voltage1 VESD IEC61000-4-2 (Contact) ±30 - - kV IEC61000-4-2 (Air) ±30 - - kV Junction Capacitance1 C I/O-GND V R = 0V, fSIG = 1MHz - 4.5 5.0 pF Junction Capacitance1 C I/O-I/O V R = 0V, fSIG = 1MHz - 2.2 - pF Note: 1. Parameter is guaranteed by design and/or device characterization. Parameter Symbol Value Unit Peak Pulse Current (tp=8/20μs) IPP 20 A Peak Pulse Power (tp=8/20μs) PPK 300 W Operating Junction Temperature Range TOP -40 to + 85 °C Storage Temperature Range T STOR -50 to + 150 °C Parameter Value Unit Storage Temperature Range -65 to + 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature(Soldering 10s) 260 °C

Technical Data Green Products Data Sheet N1737 Rev.-

  • China - Germany - Korea - Singapore - United States •
  • http://www.smc-diodes.com - sales@ smc-diodes.com • SMP4050-12UTG Marking Diagram Part Name Information Where PH12 is SMP4050-12UTG PH12 = Part Name SMP 4050 – 12 U T G Series Silicon Protection Array Number of Channels Package U = μDFN-12 T= Tape & Reel G= Green Pulse Waveform Clamping Voltage vs. IPP Insertion Loss (S21) I/O to GND Capacitance vs. Bias PH12

Technical Data Green Products Data Sheet N1737 Rev.-

  • China - Germany - Korea - Singapore - United States •
  • http://www.smc-diodes.com - sales@ smc-diodes.com • SMP4050-12UTG Mechanical Dimensions (In mm/Inches): Embossed Carrier Tape & Reel Specification μDFN-12 Symbol μDFN-12 Millimeters Inches Min Max Min Max A 0.50 0.65 0.020 0.026 A1 0.00 0.05 0.00 0.002 A2 0.150 REF 0.006REF b 0.15 0.25 0.006 0.010 b1 0.10 0.30 0.004 0.012 D 3.40 3.60 0.134 0.142 D2 2.70 0.106 E 2.40 2.60 0.095 0.103 e 0.50 BSC 0.020 BSC e1 0.60 BSC 0.024 BSC e2 1.10 BSC 0.044 BSC L 0.30 0.40 0.012 0.016 L1 0.90 1.10 0.036 0.044 L2 0.70 0.90 0.028 0.036 Symbol Millimeters Inches Min Max Min Max A0 2.63 2.83 0.104 0.112 B0 3.63 3.83 0.143 0.151 D0 1.40 1.60 0.055 0.063 E 1.65 1.85 0.065 0.073 F 5.45 5.55 0.215 0.219 K0 0.85 1.05 0.033 0.041 P0 3.90 4.10 0.154 0.161 P1 3.90 4.10 0.154 0.161 P2 1.95 2.05 0.077 0.081 T 0.18 0.22 0.007 0.009 W 11.90 12.30 0.469 0.484

Technical Data Green Products Data Sheet N1737 Rev.-

  • China - Germany - Korea - Singapore - United States •
  • http://www.smc-diodes.com - sales@ smc-diodes.com • SMP4050-12UTG DISCLAIMER: 1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales department for the latest version of the datasheet(s). 2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment, medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by means of users’ fail-safe precautions or other arrangement . 3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accid ent or any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information, products or circuits described in the datasheets. 4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any secondary damage resulting from use at a value exceeding the absolute maximum rating. 5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics (Nanjing) Co., Ltd. 6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permissio n of SMC - Sangdest Microelectronics (Nanjing) Co., Ltd. 7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and regulations..