SMP3022-01ETG SMC | Alldatasheet

Document overview

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  • PDF pages: 5

Technical content

Features

  • ESD protection in accordance with: IEC 61000-4-2 (ESD) ±30kV (air), ±20kV (contact) IEC 61000-4-5 (lightning) 3A (8/20μs) IEC 61000-4-4 (EFT) 40A (5/50ns)
  • Low capacitance of 0.35pF @ V R=0V (TYP)
  • Low leakage current of 100nA at 5.3V(MAX)
  • Extremely low dynamic resistance (0.7 Ω TYP)

Applications

  • USB 3.0/USB 2.0/MHL
  • MIPI Camera and Display
  • HDMI 2.0, DisplayPort 1.3, eSATA
  • Set Top Boxes, Game Consoles
  • Smart Phones
  • External Storage
  • Ultrabooks, Notebooks
  • Tablets, eReaders
  • High Speed Serial Interfaces Pinout Functional Block Diagram

Technical Data Green Products Data Sheet N1741 Rev.-

  • China - Germany - Korea - Singapore - United States •
  • http://www.smc-diodes.com - sales@ smc-diodes.com • SMP3022-01ETG Ordering Information: Device Package Packaging Options P0/P1 Packaging Speciications Min. Order Qty. SMP3022-01ETG SOD882 Tape & Reel - 8mm tape/7” reel 4mm/2mm EIA RS-481 10000 Absolute Maximum Ratings: CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information: Electrical Characteristics: (TOP=25°C) Characteristics Symbol Condition Min. Typ. Max. Units Reverse Stand-Off Voltage V RWM - - - 5.3 V Reverse Breakdown Voltage VBR I R=1mA 6.8 7.8 9.0 V Reverse Leakage Current ILEAK VR =5.3V - <10 100 nA Clamping Voltage1 VC IPP = 1A, tp=8/20μs, Fwd - - 12.0 V Dynamic Resistance2 RDYN TLP, tp=100ns, I/O to GND - 0.7 - Ω ESD With stand Voltage1 VESD IEC61000-4-2 (Contact) ±20 - - kV IEC61000-4-2 (Air) ±30 - - kV Junction Capacitance1 C D Reverse Bias=0V, f=1 MHz - 0.35 0.5 pF Note: 1 Parameter is guaranteed by design and/or device characterization. 2 Transmission Line Pulse (TLP) with 100ns width and 200ps rise time. Parameter Symbol Value Unit Peak Pulse Current (tp=8/20μs) IPP 3.0 A Operating Temperature T OP -40 to + 125 °C Peak Pulse Power (tP=8/20μs) PPK 20 W Parameter Value Unit Storage Temperature Range -55 to + 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C

Technical Data Green Products Data Sheet N1741 Rev.-

  • China - Germany - Korea - Singapore - United States •
  • http://www.smc-diodes.com - sales@ smc-diodes.com • SMP3022-01ETG Marking Diagram: Part Name Information SMP 3022 – 01 E T G G= Green T= Tape & Reel Package E = SOD882 Number of Channels Series TVS Diode Arrays Pulse Waveform Transmission Line Pulsing (TLP) Plot Clamping Voltage vs IPP Capacitance vs. Reverse Bias

Technical Data Green Products Data Sheet N1741 Rev.-

  • China - Germany - Korea - Singapore - United States •
  • http://www.smc-diodes.com - sales@ smc-diodes.com • SMP3022-01ETG Mechanical Dimensions (In mm/Inches): Embossed Carrier Tape & Reel Speciication — SOD882 Symbol JEDEC MO-236 Millimeters Inches Min Typ Max Min Typ Max D 0.45 0.018 Symb ol Tape Dimensions Millimeters Min Max A0 0.65 0.75 B0 1.10 1.20 K0 0.50 0.60 E 1.65 1.85 F 3.45 3.55 P0 3.90 4.10 P1 1.90 2.10 P2 1.95 2.05 T 1.95 2.05 W 7.90 8.10 Symbol Reel Dimensions (Size φ178) Millimeters Min Max M 177.0 179.0 N 59.0 61.0 W 11.0 12.0 W1 8.5 9.5 H 12.5 13.5 S 1.9 2.1 K 10.8 11.2 R 0.95 1.05 Recommended Soldering Pad Layout

Technical Data Green Products Data Sheet N1741 Rev.-

  • China - Germany - Korea - Singapore - United States •
  • http://www.smc-diodes.com - sales@ smc-diodes.com • SMP3022-01ETG DISCLAIMER: 1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales department for the latest version of the datasheet(s). 2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment, medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by means of users’ fail-safe precautions or other arrangement . 3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accid ent or any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information, products or circuits described in the datasheets. 4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any secondary damage resulting from use at a value exceeding the absolute maximum rating. 5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics (Nanjing) Co., Ltd. 6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permissio n of SMC - Sangdest Microelectronics (Nanjing) Co., Ltd. 7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and regulations..