SMP1005-01WTG SMC | Alldatasheet
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Technical content
Technical Data Green Products Data Sheet N1769 Rev.-
- China - Germany - Korea - Singapore - United States •
- http://www.smc-diodes.com - sales@ smc-diodes.com • SMP1005-01WTG
Description
The SMP1005 includes back-to-back Zener diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present. Features Applications
- ESD protection in accordance with: IEC 61000-4-2 (ESD) ±30kV (air), ±30kV (contact) IEC 61000-4-5 (lightning) 10A (8/20μs) IEC 61000-4-4 (EFT) 40A (5/50ns)
- Low capacitance of 30 pF @ VR=0V
- Low leakage current of 0.1 μA at 5V
- Industries smallest ESD footprint available(0201) Pinout Functional Block Diagram Application Example
- Mobile Phones
- Smart Phones
- Camcorders
- PDA
- Digital cameras
- MP3/PMP
- Portable navigation devices
- Portable Medical
- Point of sale terminals
Technical Data Green Products Data Sheet N1769 Rev.-
- China - Germany - Korea - Singapore - United States •
- http://www.smc-diodes.com - sales@ smc-diodes.com • SMP1005-01WTG Ordering Information: Device Package Marking Min. Order Qty. SMP1005-01WTG 0201 Flipship ● 10000 Absolute Maximum Ratings: CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information: Electrical Characteristics: (TOP=25°C) Characteristics Symbol Condition Min. Typ. Max. Units Reverse Stand-Off Voltage V RWM - - - 6.0 V Breakdown Voltage VBR I R = 1mA - 8.5 9.5 V Reverse Leakage Current ILEAK VR =5V with 1pin at GND - 0.1 0.5 μA Clamping Voltage1 VC IPP = 1A, tp=8/20μs, Fwd - 9.3 - V IPP = 2A, tp=8/20μs, Fwd - 10.0 - V IPP = 10A, tp=8/20μs, Fwd - 15.6 ESD With stand Voltage1 VESD IEC61000-4-2 (Contact Discharge) ±30 - - kV IEC61000-4-2 (Air Discharge) ±30 - - kV Dynamic Resistance RDYN (VC2-VC1)/(IPP2-IPP1) - 0.28 - Ω Junction Capacitance1 CD Reverse Bias=0V - 30 - pF Reverse Bias=2.5V - 23 - Note: 1. Parameter is guaranteed by design and/or device characterization. Parameter Symbol Value Unit Peak Pulse Current (tp=8/20μs) IPP 10.0 A Operating Temperature T OP -40 to + 125 °C Storage Temperature T STOR -60 to + 150 °C Parameter Value Unit Storage Temperature Range -55 to + 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C
Technical Data Green Products Data Sheet N1769 Rev.-
- China - Germany - Korea - Singapore - United States •
- http://www.smc-diodes.com - sales@ smc-diodes.com • SMP1005-01WTG Marking Diagram Part Name Information SMP 1005 – 01 W T G Series TVS Diode Arrays Number of Channels Package W: 0201 Flipchip T= Tape & Reel G= Green Pulse Waveform Clamping Voltage vs. IPP Insertion Loss (S21) I/O to GND Capacitance vs. Reverse Bias
Technical Data Green Products Data Sheet N1769 Rev.-
- China - Germany - Korea - Singapore - United States •
- http://www.smc-diodes.com - sales@ smc-diodes.com • SMP1005-01WTG Mechanical Dimensions (In mm/Inches): Embossed Carrier Tape & Reel Speciication — 0201 Flipchip Recommended Solder Pad Footprint Symbol
0201 Flipchip
A0 0.41+/-0.03 B0 0.70+/-0.03 D Φ 1.50 + 0.10 D1 Φ 0.20 +/- 0.05 E 1.75+/-0.10 F 3.50+/-0.05 K0 0.38+/-0.03 P0 2.00+/-0.05 P1 2.00+/-0.05 P2 4.00+/-0.10 W 8.00+0.30/-0.10 T 0.23+/-0.02
Technical Data Green Products Data Sheet N1769 Rev.-
- China - Germany - Korea - Singapore - United States •
- http://www.smc-diodes.com - sales@ smc-diodes.com • SMP1005-01WTG DISCLAIMER: 1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales department for the latest version of the datasheet(s). 2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment, medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by means of users’ fail-safe precautions or other arrangement . 3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accid ent or any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information, products or circuits described in the datasheets. 4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any secondary damage resulting from use at a value exceeding the absolute maximum rating. 5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics (Nanjing) Co., Ltd. 6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permissio n of SMC - Sangdest Microelectronics (Nanjing) Co., Ltd. 7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and regulations..