SMM310 INFINEON | Alldatasheet

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Data Sheet, V1.1, May 2008 Small Signal Discretes

81726 München, Germany

© Infineon Technologies AG 2008. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

Data Sheet 3 V1.1, 2008-05-28 SMM310 Revision History: 2008-05-28, V1.1 Previous Version: 2007-08-31, V1.0 Page Subjects (major changes since last revision)

4 Halogen-free package

9 Typical measurement of output impedance added

11 Marking layout example removed

Data Sheet 4 V1.1, 2008-05-28 SMM310 Silicon MEMS Microphone Silicon MEMS Microphone

Applications

The SMM310 is designed for

  • Mobile Phones (Handsets, Headsets)
  • Consumer (Game Consoles, PDA’s)
  • Computer (Personal Computers, Notebooks)
  • Cameras (Digital Still Cameras, Video Cameras) Product Description Miniature Silicon MEMS (Micro Electro Mechanical System) omni-directional Microphone with single-ended analog interface designed for automated reflow soldering assembly as SMD (Surface Mounted Device) component. It is an alternative to conventional ECMs (Electret Condenser Microphones). Due to its robust design with a metallic lid and monolithic integrated EMI-blocking capacitors and utilization of Silicon MEMS technology, the SMM310 shows high immunity to EMI (Electromagnetic Interference) and heat. The capped Chip-On-Board package solution contains the micromechanical sensor chip and an amplifier chip. The RoHS-compliant halogen-free device has a size of 4.72 x 3.76 x 1.25 mm Figure 1 Block Diagram

Features

  • SMD MEMS microphone for automated surface mount assembly
  • Reflow soldering up to 260 °C (lead free)
  • High long-term temperature stability
  • Stable sensitivity over power supply range of 1.5 - 3.3 V
  • Low current consumption of 80 µA
  • Excellent power supply rejection of -55 dB
  • High integrated immunity to EMI
  • RoHS-compliant, halogen-free package with small footprint and low height of 1.25 mm Type Package Marking SMM310 HG-MMA-4-2 S310 VDD (4) OUT (1) GND (2,3)

Data Sheet 5 V1.1, 2008-05-28 Pin Definition and Function Maximum Ratings ESD robustness Acoustical and Electrical Characteristics Table 1 Pin Definition and Function Pin No. Symbol Function

1 OUT Output

2 GND Ground

3 GND Ground

4 VDD Power

Storage Temperature TSTG -40 °C - 125 °C Operating Temperature Range TA -40 °C - 85 °C Operating Voltage Range VDD 1.5 V - 3.3 V Table 3 Typical robustness to electrostatic discharge ESD capability all pins (HBM, JESD22-A114) VESD_HBM ± 4k V ESD capability all pins (MM, JESD22-A115) VESD_MM ± 400 V Table 4 Unless otherwise noted, typical test conditions are TA =2 3° C , VDD = 2.1 V and R.H. = 50 % measured in a pressure chamber test setup. All voltages refer to GND node Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Sensitivity 1 kHz S1kHz -45 -42 -39 dB(V/Pa) 1 kHz, 94 dB SPL Relative Sensitivity 4 kHz ∆S4kHz -1 +4 dB Relative to sensitivity 1 kHz Relative Sensitivity 240 Hz ∆S240Hz -1 +1 dB Relative to sensitivity 1 kHz Equivalent Noise Level ENL 29.5 32.5 dB(pso) CCITT-weighted 1) 1) Psophometrically weighted noise measurement with CCITT-filter (ITU-T Rec. P.53) 35 dB(A) A-weighted 2) 2) Noise measurement with A-weighting filter (IEC 651) Signal-to-Noise Ratio SNR 61.5 64.5 dB(pso) CCITT-weighted 59 dB(A) A-weighted Total Harmonic Distortion THD 0.1 0.5 % 104 dB SPL, 1 kHz Current Consumption ICC 80 140 µA VDD =2 . 1V Power Supply Rejection Ratio PSRR -55 -40 dBr 100 mV superimposed on VDD =2 . 1V , 1k H z DC Output Voltage VOUT 1.2 V DC Voltage at Pin 1 Output Impedance ZOUT 7 Ω 1k H z

Data Sheet 11 V1.1, 2008-05-28 Solder Reflow Recommended Vacuum Handling Figure 12 Recommended minimum distance between so und port hole and vacuum pick tool opening is 0.50 mm Table 6 Solder Reflow Conditions Solder Reflow Profile Compliant to J-STD-020-C Maximum Peak Temperature 260 °C Number of Reflow 3 times reflow soldering Board washing after Reflow Board washing can damage the microphone if the sound inlet hole is uncovered Moisture Sensitivity Level MSL 2 classified 0. 5mm MIN

Data Sheet 12 V1.1, 2008-05-28 SMM310 Silicon MEMS Microphone Tape Outline Figure 13 Tape Outline, 1) Cumulative tolerance of 10 sprocket holes is ±0.2 mm Table 7 Tape Dimensions (mm) WP 0 P1 P2 D0 A0 B0 E1 E2 FD 1 TT 1 T2 GK 0

Data Sheet 13 V1.1, 2008-05-28 Reel Outline Figure 14 Table 8 Reel Dimension (mm) and Quantity per Reel AW 1 W2 N Quantity per Reel Ø 330 12.4±1.5 18.4 MAX Ø 100 4000