SML02SC06D2 TTELEC | Alldatasheet

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SML02SC06D2A / SML02SC06D2B Low Leakage Fast Switching Low Forward Voltage Hermetic Ceramic Surface Mount Package Suitable For General Purpose, Switching Applications Zero Equivalent Reverse Recovery Semelab Limited reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to verify that datasheets are current before placing orders. Semelab Semelab Limited Coventry Road, Lutterworth, Leicestershire, LE17 4JB Document Number: Issue: Page: 10003 1 of 5 Telephone: Fax: +44 (0) 1455 556565 +44 (0) 1455 552612 Email: sales@semelab-tt.com Website: http://www.semelab-tt.com ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise stated) VRRM Repetitive Peak Reverse Voltage 600V VRSM Surge Peak Reverse Voltage 600V VDC DC Blocking Voltage 600V IF(AVG)(1) Average Forward Current 2A PD Total Power Dissipation at TJ = 25°C 5W Derate Above 25°C 25mW/°C TJ Maximum Junction Temperature 225°C Tstg Storage Temperature Range -55 to +225°C THERMAL PROPERTIES Symbols Parameters Max. Units RθJSP(IN) Thermal Resistance, Junction To Solder Pads TSP = 25°C 40 °C/W RθJA(PCB)(2) Thermal Resistance, Junction To Ambient, On PCB (small pads) 115 °C/W RθJA(PCB)(3) Thermal Resistance, Junction To Ambient, On PCB (large pads) 175 °C/W Notes (1) IF is rated at 1.1A @ TA = 25°C for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where TJ(Max) does not exceed 225°C; This equates to RθJA(PCB) ≤ 115°C/W. at 0.8A @ TA = 25°C for PC boards where RθJA(PCB) ≤ 175°C/W. Derate at 4mA/°C above TA = 25°C in this case. ‡ Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5A device.

SML02SC06D2A / SML02SC06D2B Semelab Limited Coventry Road, Lutterworth, Leicestershire, LE17 4JB Semelab Telephone: Fax: +44 (0) 1455 556565 +44 (0) 1455 552612 Email: sales@semelab-tt.com Website: http://www.semelab-tt.com Document Number: Issue: Page: 10003 2 of 5 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise stated) Symbols Parameters Test Conditions Min. Typ. Max. Units VF Diode Forward Voltage IF = 2A TJ = 25°C 1.5 1.8 V IF = 2A TJ = 175°C 1.8 2.4 IR Leakage Current VR = 600V TJ = 25°C 50 µA VR = 600V TJ = 175°C 100 DYNAMIC CHARACTERISTICS QC(4) Total Capacitive Charge VR = 600V IF = 2A 4.8 nC di/dt = 500A/µs TJ = 25°C C Total Capacitance VR = 0V TJ = 25°C 120 pF f = 1.0MHz VR = 200V TJ = 25°C 12 f = 1.0MHz Notes (4) Indicative by the device design, not a production test.

SML02SC06D2A / SML02SC06D2B Semelab Limited Coventry Road, Lutterworth, Leicestershire, LE17 4JB Semelab Telephone: Fax: +44 (0) 1455 556565 +44 (0) 1455 552612 Email: sales@semelab-tt.com Website: http://www.semelab-tt.com Document Number: Issue: Page: 10003 3 of 5 TYPICAL CHARACTERISTICS

SML02SC06D2A / SML02SC06D2B Semelab Limited Coventry Road, Lutterworth, Leicestershire, LE17 4JB Semelab Telephone: Fax: +44 (0) 1455 556565 +44 (0) 1455 552612 Email: sales@semelab-tt.com Website: http://www.semelab-tt.com Document Number: Issue: Page: 10003 4 of 5 Notes (5) SiC Schottky Diode, no minority carrier recombination thus zero reverse recovery. Recovery time shown is due to small junction capacitance charge and is independent of junction temperature.

SML02SC06D2A / SML02SC06D2B Semelab Limited Coventry Road, Lutterworth, Leicestershire, LE17 4JB Semelab Telephone: Fax: +44 (0) 1455 556565 +44 (0) 1455 552612 Email: sales@semelab-tt.com Website: http://www.semelab-tt.com Document Number: Issue: Page: 10003 5 of 5 MECHANICAL DATA Dimensions in mm (inches) DLCC2 Variant A (D2A) PAD 1 ANODE PAD 2 CATHODE DIMENSION mm Inches A 5.00 ±0.10 0.197 ±0.004 B 2.61 ±0.10 0.103 ±0.004 C 1.08 ±0.10 0.043 ±0.004 D 1.76 ±0.10 0.069 ±0.004 DLCC2 Variant B (D2B) PAD 1 ANODE PAD 2 CATHODE PAD 3 LID CONTACT TO ANODE* DIMENSION mm Inches A 5.00 ±0.10 0.197 ±0.004 B 2.61 ±0.10 0.103 ±0.004 C 1.08 ±0.10 0.043 ±0.004 D 1.76 ±0.10 0.069 ±0.004 SOLDER PAD LAYOUT D-5A DIMENSION mm Inches A 6.25 0.246 B 1.70 0.067 C 2.67 0.105 A B C A B C A B C Lead Terminal Finish: Au DLCC2/ D-5A MELF OVERLAY