MFC2010-R007FT5

MFC TTELEC | Alldatasheet

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Tolerance to ±0.5% TCR to ±50ppm/°C High power density AEC-Q200 qualified (excluding 0.5% tolerance) Resistors 10.20 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc www.ttelectronics.com/resistors BI Technologies IRC Welwyn All parts are Pb-free and comply with EU Directive 2011/65/EU amended by (EU) 2015/863 (RoHS3) 0402 0603 0805 1206 2010 2512 Resistance range mΩ 10 - 50 3 - 100 30 - 100 3 - 100 30 - 100 3 - 100 30 - 100 3 - 100 30 - 100 101 - 200 2 - 100 AEC-Q200 qualified Tolerance ±% 1, 2, 5 0.5 1, 2, 5 0.5 1, 2, 5 0.5 1, 2, 5 0.5 1, 2, 5 TCR (-55°C to +125°C) ±ppm/°C 100 <R01: 200, ≥R01: 100 <R01: 100, ≥R01: 50 R002: 200, R003 – R009: 100, ≥R01: 50 Standard values E24 plus integer milliohm values below R01 preferred Operating temperature °C -55 to +155 Dimensions (mm) and weight (mg) Size Value (mΩ) L W C A T max Wt 2010 1.6±0.3 0.73 334 – 5 1.3±0.3 >5 0.85±0.35 2512 2.3±0.3 0.95 543 – 4 1.8±0.4 5 – 7 1.15±0.35 >7 1.05±0.45 Electrical Data Physical Data Construction Marking Solvent Resistance Metal foil resistor material is bonded onto an alumina substrate and connected to wraparound terminations with nickel barrier and 100% Sn finish. Protec- tion and marking are applied and each resistor is measured immediately before packing into tape. MFC0402 parts are not marked. Larger MFC sizes are marked with 2, 3 or 4 characters indicating ohmic value. Where “R” is used it indicates the decimal Reels are marked with type, value, tolerance, date code and quantity. The body protection and marking are resistant to all normal industrial cleaning solvents suitable for printed circuits. Precision Surface Mount Resistors 03.11 © Welwyn Components Limited Bedlington Northumberland NE22 7AA, UK Telephone: +44 (0) 1670 822181 Facsimile: +44 (0) 1670 829465 Email: info@welwyn-tt.com Website: www.welwyn-tt.com PCF Series >0.05% tolerance 0603 to 2512 0.25% 0.3% 0.5% 0.25% 0.1% 0.2% Load life Humidity Short term overload High temperature operation Temperature cycle Resistance to solder heat Solderability Maximum change (+0.05R) Chip size 0201, 0402 0.5% 0.3% 0.5% 0.25% 0.1% 0.2% ≤0.05% tolerance 0603 to 2512 0.05% 0.05% 0.05% 0.25% 0.05% 0.05% ConditionsTest Parameters 1000 hours rated load @ 70°C 1000 hours @ 40°C, 90 - 95%RH 6.25 x rated Power , or 2 x LEV, for 5 sec 1000 hours at 125°C 5 cycles -55 C, 125°C 270°C, 10 sec 235°C, 2 sec 95% minimum coverage 0.5% 0.5% 0.5% 0.5% 0.25% 0.2% 95% minimum coverage Load life Humidity Short term overload High temperature operation Temperature cycle Resistance to solder heat Solderability Maximum change (+0.05R)ConditionsTest Parameters 1000 hours rated load @ 70°C 1000hrs @ 40°C, 90 - 95%RH 6.25 x rated Power, or 2 x LEV, for 5 sec 1000 hours at 155°C 5 cycles -55°C, 150°C 270°C, 10 sec 235°C, 2 sec 0603 to 2512 0.05% 0.05% 0.02% 0.05% 0.02% 0.02% Load life Humidity Short term overload High temperature operation Temperature cycle Resistance to solder heat Solderability Maximum change (+0.05R)ConditionsTest Parameters 1000 hours rated load @ 70°C 1000hrs @ 40°C, 90 - 95%RH 6.25 x rated Power, or 2 x LEV, for 5 sec 1000 hours at 125°C 5 cycles -55 C, 125°C 270°C, 10 sec 235°C, 2 sec 95% minimum coverage 0402 0.25% 0.5% 0.1% 0.5% 0.1% 0.1% Performance Data - Standard Range Performance Data - High Power Range Performance Data - Passivated Range Construction A thin-film material is selectively deposited on a 96% alumina substrate together with metallic contacts at each end of the resistor. The unadjusted resistors are heat treated to give the required TCR and stability, then a precisely controlled laser trim process adjusts the resistance value. Epoxy protection is applied and wrap-around terminations are added and plated with Nickel then Tin. Each resistor is measured immediately before packing into tape. Terminations The standard termination is 100% Sn matte plated wrap-around suitable for soldering. SnPb plated option is available for standard range PCF over the restricted range below. Physical Data Dimensions (mm) and Weight (mg) L W T max A C Wt T WA A L Wrap-around terminations (3 faces) C

Metal Foil on Ceramic Chip Resistors MFC Series 10.20 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc www.ttelectronics.com/resistors BI Technologies IRC Welwyn Test Maximum Operational Life MIL-STD-202 Method 108 1000 hours, steady state, TA=125°C at de-rated power ±ΔR% 1 Short Term Overload IEC-60115-1 4.13 Pr<2W; 5 x Pr for 5 seconds Pr=2W; 4 x Pr for 5 seconds ±ΔR% 1 Biased Humidity MIL-STD-202 Method 103 1000 hours, 85°C, 85%RH, 10% of Pr ±ΔR% 1 High Temperature Exposure MIL-STD-202 Method 108 1000 hours, 155°C ±ΔR% 0.5 Operation at Low Temperature IEC-60115-1 4.36 -55°C, 45 mins Pr, 15 mins no load ±ΔR% 1 Temperature Rapid Change IEC-60115-1 4.19 -55°C to +155°C, 5 cycles ±ΔR% 1 Voltage Proof IEC-60115-1 4.7 1.42 x max operating voltage for 1 minute ±ΔR% No breakdown or flashover Board Flex JIS-C-521-1 4.33 3mm deflection for 5 seconds ±ΔR% 1 Solderability IEC-60115-1 4.17 245±5°C for 3 seconds >95% coverage Resistance to Solder Heat MIL-STD-202 Method 210 260±5°C for 10 seconds ±ΔR% 1 Leaching JIS-S-5201-1 4.18 IEC-60068-2-58 8.2.1 260±5°C for 30 seconds ±ΔR% >90% coverage Resistance to Solvents MIL-STD-202 Method 215 Aqueous wash OKEM or equivalent. No banned solvents. No damage Performance Data Thermal Performance Data General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. BI Technologies IRC Welwyn www.ttelectronics.com/resistors © TT Electronics plc 06.18 High Pulse Double-Sided Chip Resistors HDSC Series 1 2 H D S C 2 5 1 2 - 1 0 K J T 1 8 Thermal Performance Data Packaging 0603, 0805 and 1206 resistors are supplied on 8mm carrier tape and 2010 and 2512 resistors are supplied on 12 mm carrier tape, all on 7 inch reels as per IEC 286-3. Application Notes HDSC resistors are ideally suited for handling by automatic methods due to their rectangular shape and the small dimensional tolerances. Electrical connection to a ceramic substrate or to a printed circuit board can be made by reflow or wave soldering of wrap-around terminations. Wrap-around terminations provide good leach properties and ensure reliable contact. Due to the robust construction, the HDSC can be immersed in the solder bath for 30 seconds at 260°C. This enables the resistor to be mounted on one side Ordering Procedure of a printed circuit board and wire-leaded components applied on the other side. HDSC is compatible with typical Pb-free soldering materials and temperature profiles. HDSC resistors themselves can operate at a maximum temperature of 155°C. For soldered resistors, the joint temperature should not exceed 110°C. This condition is met when the stated power levels at 70°C and recommended pad and trace areas are used. Pad and trace area is defined as the total area of the solder pad plus all copper trace within two squares of the edge of the solder pad. Allowance should be made if smaller areas of copper are used. Example: HDSC2512-10KJT18 (HDSC2512, 10 kilohms ±5%, Pb-free) 3 4 5 Type Size 3 4 Tolerance Termination & Packing HDSC 0603 E24 = 3/4 characters R = ohms K = kilohms M = megohms J = ±5% Standard Pb-free finish

0805 K = ±10%

3000/reel standard 1206 M = ±20% 1206 2010 2010

2512 T18 2512 1800/reel standard

T1 All sizes 1000/reel available SnPb finish PB All sizes Standard quantities as for Pb-free

Metal Foil on Ceramic Chip Resistors MFC Series 10.20 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc www.ttelectronics.com/resistors BI Technologies IRC Welwyn Mounting Recommendations Size Resistance Value L a b 0402 10 - 50 0.5 0.6 0.5 0603 3 - 4 0.4 1.2 5 - 9 0.6 1.1 10 - 100 0.5 0.9 1 0805 3 - 4 0.5 1.4 1.35 5 - 9 0.8 1.2 10 - 100 1.3 1.3 1206 3 - 4 0.8 1.8 1.8 5 - 9 1.8 1.3 10 - 100 1.5 1.7 1.4 2010 3 - 9 1.6 2.9 2.4 10 - 100 2.7 1.8 2512 2 - 4 1 3.4 3.5 5 - 200 3.8 2.1 Packaging MFC0402 is packed on 8mm paper tape at 2mm component pitch. MFC0603, 0805 & 1206 are packed on 8mm paper tape at 4mm component pitch. MFC2010 & 2512 are packed on 12mm plastic tape at 4mm component pitch. All sizes are on 178mm diameter reels. Low Resistance Metal Alloy Resistor LRMA Series Temperature Derating 20% 40% 60% 80% 100% -30 20 70 120 170 Ambient Temperature (°C) Proportion of Pr Typical Temperature Rise 100 120 Proportion of Pr Temperature Rise (°C) Joint Hot spot Construction Marking The components are marked with ohmic value, e.g. “R002”= 2mΩ, “R010”= 10 mΩ. Solvent Resistance The Due to space restrictions, for LRMAM1206-R001, "01" = 1mΩ is used, and for LRMAM0805, “2” = 2mΩ, “010” = 10 mΩ are used. component is resistant to all normal industrial cleaning solvents suitable for printed circuits. Performance Data Maximum (%) Typical (%) Load at rated power (cyclic load, 1000 hours at 70°C) ±∆R 0805: 1.5 Others 1 0805: 1 Others 0.5 0805: 1 Others 0.5 0805: 1.5 Others 0.5 0805: 1 Others 0.5 0.3 Short term overload (5 x rated power for 5s) ±∆R 0.5 0.15 Humidity (1000 hours, 85°C, 85%RH) ±∆R 0.15 Temperature cycle (-40 to +125°C, 1000 cycles, 15 minute dwell) ±∆R 0.15 Resistance to solder heat (260°C ±5°C for 20s ±1s) ±∆R 0.5 0.3 Solderability (245°C ±5°C for 2s ±0.5s) >95% coverage Dry heat (1000 hours at 170°C) ±∆R 0.3 Low temperature storage (1000 hours at -55°C) ±∆R 0.5 0.15 Substrate bending (board 1.6mm, fulcrum spacing 90mm, deflection 2mm) ±∆R 0.3 Insulation resistance (1 minute @ 100Vdc) >100M Thermal Performance & Mounting Copper electrode with nickel then tin plating Coating (UL94-V0) Low TCR resistance alloy plate The temperature rise shown is highly dependent on mounting conditions. Reference conditions assume 20 copper with thermal vias to multiple layers. The self-heating in the current tracks should be kept negligible, or allowed for by temperature derating.SenseCurrent L b a Standard 4-terminal probe pitches for measuring unmounted parts are 2.8 x 1.7mm (0612), 0.4 x 1.83mm (0805), ±0.02mm. Reference Pad Dimensions (mm) Size a b L 1206 1.8 1.8 1.7 2.3 1.6 1.0 1.4 3.8 0.7 0.7 1.21.15 3.4 3.51.5 0815 2010 0805 0612 7.9 1.5 0.9 2512 ≤R0031 <R002 1206 ≥R002 4.0 3.1 1.3 2512 >R0031 4.0 2.1 4.1 1225 7.0 1.0 2.3 Note 1 - This applies to LRMAT2512 and LRMAM2512. For LRMAP2512 this threshold is R004 General Note TT Electronics reserves the right to make changes in product specificaon without noce or liability. All informaon is subject to TT Electronics’ own data and is considered accurate at me of going to print. BI Technologies IRC Welwyn hps://www.electronics.com/resistors © TT Electronics plc Metal Foil on Ceramic Chip Resistors MFC Series Resistors Mounng Recommendaons Size Resistance Value L a b 0402 10 - 50 0.5 0.6 0.5 0603 3 - 4 0.4 1.2 5 - 9 0.6 1.1 10 - 100 0.5 0.9 1 0805 3 - 4 0.5 1.4 1.35 5 - 9 0.8 1.2 10 - 100 1.3 1.3 1206 3 - 4 0.8 1.8 1.8 5 - 9 1.8 1.3 10 - 100 1.5 1.7 1.4 2010 3 - 9 1.6 2.9 2.4 10 - 100 2.7 1.8 2512 2 - 4 1 3.4 3.5 5 - 200 3.8 2.1 Packaging MFC0402 is packed on 8mm paper tape at 2mm component pitch. MFC0603, 0805 & 1206 are packed on 8mm paper tape at 4mm component pitch. MFC2010 & 2512 are packed on 12mm plasc tape at 4mm component pitch. All sizes are on 178mm diameter reels. Ordering Procedure Example: MFC0603-R005FT5 (0603, 5 milliohms ±1%, Pb-free) M F C 0 6 0 3 - R 0 0 5 F T 5 1 2 3 4 5 1 2 3 4 5 Type Size Value Tolerance Packing MFC 0402 E24 3/4 characters R = ohms D = ±0.5% T10 0402 10,000/reel

0603 F = ±1% T5 0603 to 1206 5000/reel

0805 T4 2010, 2512 4000/reel

J = G = ±2% ±5%