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SMCG AND SMCJ5.0 THRU 170CA SURFACE MOUNT T RANS ZORB ™ TRANSIENT VOLTAGE SUPPRESSOR Stand-off Voltage -5.0 - 170 Volts Peak Pulse Power - 1500 Watts
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¤ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ¤ For surface mounted applications in order to optimize board space ¤ Low profile package ¤ Built-in strain relief ¤ Glass passivated junction ¤ Low inductance ¤ 1500W peak pulse power capability with a 10/1000ms waveform, repetition rate (duty cycle): 0.01% ¤ Excellent clamping capability ¤ Fast response time: typically less than 1.0ps from 0 Volts to V(BR) for uni-directional and 5.0ns for bi-directional types ¤ For devices with V(BR)‡10V, ID are typically less than 1.0mA ¤ High temperature soldering guaranteed: 250°C/10 seconds at terminals MECHANICAL DATA Case: JEDEC DO214AB / DO215AB molded plastic over passivated junction Terminals:Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: For unidirectional types the color band denotes the cathode, which is postitive with respect to the anode under normal TVS operation Mounting Position: Any Weight:0.007 ounces, 0.21 gram DEVICES FOR BI-DIRECTIONAL APPLICATIONS Electrical characteristics apply in both directions. MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS VALUE UNITS Peak pulse power dissipation with a 10/1000ms waveform(NOTES 1, 2, FIG. 1) PPPM Minimum 1500 Watts Peak pulse current with a 10/1000ms waveform (NOTE 1, FIG. 3) IPPM SEE TABLE 1 Amps Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) (NOTES 2, 3)- uni-directional only IFSM 200.0 Amps Maximum instantaneous forward voltage at 100A(NOTE 3) uni-directional only V F 3.5 Volts Operating junction and storage temperature range T J, TSTG -55 to +150 °C NOTES: (1) Non-repetitive current pulse, per Fig.3 and derated above TA=25°C per Fig. 2 (2) Mounted on 0.31 x 0.31” (8.0 x 8.0mm) copper pads to each terminal (3) Measured on 8.3ms single half sine-wave. For uni-directional devices only. Dimensions in inches and (millimeters) DO-215AB GULL WING DO-214AB MODIFIED J-BEND 0.280 (7.11) 0.260 (6.60) 0.016 (0.41) 0.006 (0.15) 0.020 (0.51) MAX. 0.058 (1.47) 0.038 (0.97) 0.400 (10.16) 0.380 (9.64) 0.032 (8.10) 0.024 (6.10) 0.008 (0.20) 0.004 (0.10) SEATING PLANE 0.245 (6.22) 0.130 (5.72) 0.125 (3.17) 0.115 (2.92) 0.095 (2.41) 0.075 (1.90) 0.006 (0.152) 0.012 (0.305) 0.030 (0.76) 0.305 (7.75) 0.320 (8.13) 0.260 (6.60) 0.280 (7.11) 0.079 (2.06) 0.103 (2.62) 0.220 (5.59) 0.114 (2.90) MAX. 1/25/99
ELECTRICAL CHARACTERISTICS at (T A =25°C unless otherwise noted) TABLE 1 Breakdown Maximum Maximum Device Voltage Reverse Peak Pulse Maximum Device Type Device Type Marking V (BR)(Volts) Test Stand-off Leakage Surge Clamping Gull Wing Modified Code (NOTE 1) Current Voltage at V WM Current IPPM Voltage at IPPM Lead “J” Bend Lead UNI BI (MIN / MAX) at I T (mA) V WM (Volts) (NOTE 3) ID (mA) (NOTE 2) (Amps) V C (Volts) GDD GDE GDF GDG BDH BDK GDL GDM BDN BDP BDG BDR BDS BDT BDU BDV BDW BDX GDY GDZ BED BEE GEF GEG BEH BEK BEL BEM GEN GEP GEQ GER BES BET BEU BEV BEW BEX BEY BEZ BFD BFE BFF BFG BFH BFK BFL BFM BFN BFP BFQ BFR BFS BFT GFU GFV GFW GFX GFY GFZ
ELECTRICAL CHARACTERISTICS at (T A =25°C unless otherwise noted) TABLE 1 (Cont’d) Breakdown Maximum Maximum Device Voltage Reverse Peak Pulse Maximum Device Type Device Type Marking V (BR)(Volts) Test Stand-off Leakage Surge Clamping Gull Wing Modified Code (NOTE 1) Current Voltage at V WM Current IPPM Voltage at IPPM Lead “J” Bend Lead UNI BI (MIN / MAX) at I T (mA) V WM (Volts) (NOTE 3) ID (mA) (NOTE 2) (Amps) V C (Volts) SMCG75 SMCJ75 GGQ 83.3 / 102 1.0 75 5.0 11.2 134 SMCG78 SMCJ78 GGS 86.7 / 106 1.0 78 5.0 10.8 139 SMCG85 SMCJ85 GGU 94.4 / 115 1.0 85 5.0 9.9 151 SMCG85A SMCJ85A GGV 94.4 / 104 1.0 85 5.0 10.9 137 SMCG90 SMCJ90 GGW 100 / 122 1.0 90 5.0 9.4 160 SMCG90A SMCJ90A GGX 100 / 111 1.0 90 5.0 10.3 146 SMCG100 SMCJ100 GGY 111 / 136 1.0 100 5.0 8.4 179 SMCG100A SMCJ100A GGZ 111 / 123 1.0 100 5.0 9.3 162 SMCG110 SMCJ110 GHD 122 / 149 1.0 110 5.0 7.7 196 SMCG110A SMCJ110A GHE 122 / 135 1.0 110 5.0 8.5 177 SMCG120 SMCJ120 GHF 133 / 163 1.0 120 5.0 7.0 214 SMCG120A SMCJ120A GHG 133 / 147 1.0 120 5.0 7.8 193 SMCG130 SMCJ130 GHH 144 / 176 1.0 130 5.0 6.5 231 SMCG130A SMCJ130A GHK 144 / 159 1.0 130 5.0 7.2 209 SMCG150 SMCJ150 GHL 16.7 / 204 1.0 150 5.0 5.6 268 SMCG150A SMCJ150A GHM 167 / 185 1.0 150 5.0 6.2 243 SMCG160 SMCJ160 GHN 178 / 218 1.0 160 5.0 5.2 287 SMCG160A SMCJ160A GHP 178 / 197 1.0 160 5.0 5.8 259 SMCG170 SMCJ170 GHQ 189 / 231 1.0 170 5.0 4.9 304 SMCG170A SMCJ170A GHR 189 / 209 1.0 170 5.0 5.5 275 N0TES: (1) V(BR) measured after IT applied for 300ms square wave pulse or equivalent (2) Surge current waveform per Fig. 3 and derate per Fig. 2 (3) For bi-directional types having VWM of 10 Volts and less, the ID limit is doubled (4) For the bi-directional SMCG/SMCJ5.0CA, the maximum V(BR) is 7.25 Volts (5) All terms and symbols are consistent with ANSI/IEEE C62.35 APPLICATION N0TES These surface mountable packages are designed specifically for transient voltage suppression. The wide leads assure a large sur- face contact for good heat dissipation, and a low resistance path for surge current flow to ground. These high speed transient voltage suppressors can be used to effectively protect sensitive components such as integrated circuits and MOS devices. A 1500W (SMC) device is normally selected when the threat of transients is from lightning-induced transients conducted via external leads or I/0 lines. It is also used to protect against switching transients induced by large coils or industrial motors. System impedance at component level in a system is usually high enough to limit the current to within the peak pulse current (I PP ) rating of this series. RECOMMENDED PAD SIZES The pad dimensions should be 0.010” (0.25mm) longer than the contact size, in the lead axis. This allows a solder fillet to form, see figure below. Contact factory for soldering methods. 0.310" (7.87) 0.125" (3.17) 0.050" (1.27) 0.190" (4.83) 0.125" (3.17) 0.070" (1.78) MODIFIED J-BENDGULL- WING GGD GGE GGF GGG GGH GGK GGL GGM GGN GGP GGQ GGR GGS GGT GGU GGV GGW GGX GGY GGZ GHD GHE GHF GHG GHH GHK GHL GHM GHN GHP GHQ GHR
MAXIMUM RATINGS AND CHARACTERISTIC CURVES SMCG AND SMCJ5.0 THRU 170CA FIG. 1 - PEAK PULSE POWER RATING CURVE PPPM , PEAK PULSE POWER, kW td, PULSE WIDTH, sec. TA, AMBIENT TEMPERATURE, °C FIG. 4 - TYPICAL JUNCTION CAPACITANCE UNI-DIRECTIONAL FIG. 3 - PULSE WAVEFORM t, TIME, ms VWM , REVERSE STAND-OFF VOLTAGE, VOLTS VWM, STAND-OFF VOLTAGE, VOLTS NUMBER OF CYCLES AT 60 H Z IPPM PEAK PULSE CURRENT, % I RSM PEAK PULSE POWER (P PP ) or CURRENT (IPP ) DERATING IN PERCENTAGE, % C J, CAPACITANCE, pF C J, JUNCTION CAPACITANCE, pF IFSM , PEAK FORWARD SURGE CURRENT, AMPERES NON-REPETITIVE PULSE WAVEFORM SHOWN in FIG. 3 T A=25°C TJ=25°C PULSE WIDTH (td) is DEFINED as the POINT WHERE the PEAK CURRENT DECAYS to 50% of I PPM tr=10msec. MEASURED at ZERO BIAS VR, MEASURED at STAND-OFF VOLTAGE, V WM 8.3ms SINGLE HALF SINE-WAVE (JEDEC Method) UNIDIRECTIONAL ONLY HALF VALUE - IPP 10/1000msec. WAVEFORM as DEFINED by R.E.A. FIG. 6 - MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT PEAK VALUE I PPM FIG. 5 - TYPICAL JUNCTION CAPACITANCE BI-DIRECTIONAL FIG. 2 - PULSE DERATING CURVE TJ=25°C f=1.0 MHZ Vsig=50mVp-p TJ=25°C f=1.0 MHZ Vsig=50mVp-p 0.31 X 0.31” (8.0 X 8.0mm) COPPER PAD AREAS MEASURED at ZERO BIAS MEASURED at STAND-OFF VOLTAGE, V WM td
MAXIMUM RATINGS AND CHARACTERISTIC CURVES SMCG AND SMCJ5.0 THRU 170CA 25 50 75 100 125 150 175 0.5 1.0 1.5 2.0 FIG. 7 - MAXIMUM CONTINUOUS POWER DISSIPATION TL, LEAD TEMPERATURE, °C PM(AV), AVERAGE POWER DISSIPATION, WATTS 60 HZ RESISTIVE OR INDUCTIVE LOAD