SMC1050 ROITHNER | Alldatasheet
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Technical content
www.roithner-laser.com 1 SMC1050 rev 1.1, 18.07.2017
Description
SMC1050 is a surface mount InGaAsP LED with a typical peak wavelength of 1050 nm and radiation of 1.3 mW. It comes in SMD package (ceramic) and is sealed with silicone or epoxy resin. Maximum Ratings (TCASE=25°C) Parameter Symbol Values Min. Max. Unit Power Dissipation PD 130 mW Forward Current IF 100 mA Pulse Forward Current *1 IFP 1000 mA Reverse Voltage VF 5 V Thermal Resistance RTHJA 80 K/W Junction Temperature TJ 120 °C Operating Temperature TCASE - 40 + 85 °C Storage Temperature TSTG - 40 + 100 °C Lead Solder Temperature *2 TSLD + 250 °C *1 duty=1%, pulse width = 10 µs *2 must be completed within 3 seconds Electro-Optical Characteristics (TCASE=25°C) *1 measured by G8370-85 *2 measured by Ando Optical Multi Meter AQ2140 & AQ2742 Parameter Symbol Conditions Values Min. Typ. Max. Unit Peak Wavelength λP IF=50mA 1000 1100 nm Half Width ∆λ IF=50mA 50 nm Forward Voltage VF IF=50mA 1.2 1.3 V IFP=1A 1.9 Radiated Power *1 PO IF=50mA 5.0 mW IFP=1A 30 Radiant Intensity *2 IE IF=50mA 2.2 mW/sr IFP=1A 13 Viewing Angle φ IF=50mA 132 deg. Rise Time tr IF=50mA 80 ns Fall Time tf IF=50mA 30 ns
www.roithner-laser.com 2 Typical Performance Curves Forward Current vs. Forward Voltage Rel. Radiant Intensity vs. Forward Current Forward Current [mA] Relative Radiant Intensity [A.U.] Forward Voltage [V] Forward Current [mA] Forward Current vs. Pulse Duration Allowed Forward Current vs. Ambient Temperature Forward Current [mA] Allowable Forward Current [mA] Duration tw [ms] Ambient Temperature [°C] Forward Voltage vs. Ambient Temperature Rel. Radiant Intensity vs. Ambient Temperature Forward Voltage [V] Relative Radiant Intensity [A.U.] Ambient Temperature [°C] Ambient Temperature [°C]
www.roithner-laser.com 3 Outline Dimensions All Dimensions in mm Peak Wavelength vs. Ambient Temperature Relative Spectral Emission Peak Wavelength [nm] Relative Radiant Intensity [A.U.] Ambient Temperature [°C] Wavelength [nm] Radiation Characteristics Radiation Characteristics Relative Radiant Intensity [A.U.] Angle [deg.] Relative Radiant Intensity [A.U.] Angle [edg.] SMC1050 flat
www.roithner-laser.com 4 Precautions Soldering: Do avoid overheating of the LED Do avoid electrostatic discharge (ESD) Do avoid mechanical stress, shock, and vibration Do only use non-corrosive flux Do not apply current to the LED until it has cooled down to room temperature after soldering Recommended soldering conditions: This LED is designed to be reflow soldered on to a PCB. If dip soldered or hand soldered, its reliability cannot be guarantee. Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation, caused by heat and/or atmosphere. IR Reflow Soldering Profile (Lead-free Solder) Recommended Soldering Patterns Unit: mm Above table specifies the maximum allowed duration and temperature during soldering. It is strongly advised to perform soldering at the shortest time and lowest temperature possible. Cleaning: Cleaning with isopropyl alcohol, propanol, or ethyl alcohol is recommended DO NOT USE acetone, chloroseen, trichloroethylene, or MKS DO NOT USE ultrasonic cleaners Static Electricity: LEDs are sensitive to electrostatic discharge (ESD) . Precautions against ESD must be taken when handling or operating these LEDs. Surge voltage or electrostatic discharge can result in complete failure of the device. Radiation: Those LEDs do emit invisible light, which is invisible and may cause cancer. Do avoid exposure to the emitted light. It is further advised to attach a warning label on products/systems. Operation: Do only operate LEDs with a current source. Running these LEDs from a voltage source will result in complete failure of the device. Current of a LED is an exponential function of the voltage across it. Usage of current regulated drive circuits is mandatory. © All Rights Reserved The above specifications are for reference purpose only and subjected to change without prior notice