SM5108E SMI | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 6
Technical content
DOC # 40DS5168.03 SM5108E Series OEM Silicon Pressure Die
DESCRIPTION
The SM5108E is an all silicon micro-machined, piezoresistive pressure sensing chip. The die is extremely small (0.69 mm x 0.69 mm) and has been optimized to provide the highest possible accuracy for a die of this size. Performance is achieved through careful resistor placement and mechanical configuration. The small die results in a significant cost saving when compared to larger sensor die. FEA TURES
- High performance absolute pressure sensor die
- 0.690 x 0.690 x 0.400 mm size
- 100 millivolt output This sensor is intended for high volume applications, such as consumer tire pressure gauges, or stable performance disposable gauges. The SM5108E is available as an absolute pressure sensor in a full-scale range of 30, 60 & 100 PSI. It is designed to be mounted on ceramic or PC board substrates by high-volume OEM manufacturers. Wafers are probed, visually inspected and shipped on tape. Minimum order quantities apply to this product. Medical Industrial Automotive Wound therapy Barometric Sensing Engine Control Pneumatic Gauges Automotive Tire Pressure Monitoring (TPMS) Hand-Held Meters Barometric pressure Page 1
DOC # 40DS5168.03 SM5108E Series www.si-micro.com Absolute Maximum Ratings All parameters are specified at VSUPPLY = 5.00 V supply voltage at 25oC, unless otherwise noted. No. Characteristic Symbol Minimum Maximum Units 1 Excitation Voltage(a,b) VDD - 6.5 V
2 Operating Temperature TOP -40 +125 °C
3 Storage Temperature(a) TSTG -55 +150 °C
4 ESD Rating, Human Body Model VESD - 2000 V
5 Static Acceleration Level Withstand SAW - 2500 g
6 Mechanical Shock Withstand MSW - 2000 g
No. Product Number Operating Pressure Proof Pressure (PPROOF)(c) Burst Pressure (PBURST)(c)
7 SM5108E-030-A 0 to 30 PSI 90 PSI 150 PSI
8 SM5108E-060-A 0 to 60 PSI 180 PSI 300 PSI
9 SM5108E-100-A 0 to 100 PSI 300 PSI 500 PSI
Notes: a. Bridge shall be driven with the positive voltage applied to the V+ pad. b. Voltage must not exceed 6.5 V under any operating conditions Page 2 Notes: c. Tested on a sample basis.
DOC # 40DS5168.03 SM5108E Series www.si-micro.com No. Characteristic Over Pressure Symbol Minimum Typical Maximum Units
11 Span (FS PRANGE)(d,e)
30 PSI
VSPAN 65 100 135 mV 60 PSI
100 PSI
12 Zero Offset VZERO -35 - 35 mV
13 Pressure Nonlinearity, Max Absolute
Value at 25oC (e,f) NL 0 ±0.12 0.2 %FS
14 Pressure Nonlinearity, Max Absolute
Value Between -40oC and +125oC (e,f) 0 +0.16 0.2 %FS 15 Input Resistance RB 5.0 6.2 7.0 kΩ
16 Pressure Hysteresis(e)
Maximum Absolute Value PHYST 0 0.1 0.25 %FS 17 TC Span(e,g) TCS -0.24 -0.2 -0.155 %FS/°C 18 TC Zero Offset (e,g) TCZ -0.07 - +0.07 %FS/°C
19 TC Resistance (e,g) TCR 1750 2100 2650 ppm°C
20 Temperature Zero Offset Hysteresis(e,g)
Maximum Absolute Value THYST 0 0.13 0.6 %FS Operating Characteristics - Specifications All parameters are specified at Vdd = 5.0 V supply voltage at 25oC, unless otherwise noted. Page 3 Operating Characteristics For SM5108E Die The operating characteristics are based on packaged die. The sensor performance may vary depending on the die attach and gel coating materials and the assembly process. The die attach and gel coating materials and the assembly process should minimize the stress transferred to the sensor die. All parameters are specified at VSUPPLY = 5.00 V supply voltage at 25oC, unless otherwise noted. Notes: d. Span is the difference between the output at the maximum operating pressure and the output at zero pressure. It is then normalized to the supply voltage. e. Tested on a sample basis f. Defined as best fit straight line. g. Determined by measurements taken over -40°C to 125°C.
DOC # 40DS5168.03 SM5108E Series www.si-micro.com SM5108E Diagrams and Dimensions Typical Operation Pad Coordinate PAD # PAD DESCRIPTION PAD LABEL TYPE VALUE Coordinate X-Axis (µm) Coordinate Y-Axis (µm) 1 -Vexc V- Negative Power 0 V 0 0 2 +Vsig S+ Positive Analog Out - 0 459 3 +Vexc V+ Positive Power +5 V 459 459
4 Vsig S- Negative Analog Out - 459 0
All dimensions are in microns. Bond pad opening size = 100x100 µm Page 4 400 + 5
DOC # 40DS5168.03 SM5108E Series www.si-micro.com Order Code Full-Scale Pressure Range Pressure Type Shipping Method Minimum Order Quantity SM5108E-030-A 30 PSI Absolute Diced on UV Release Tape 1 Wafer (1 wafer = 44,000 ±5%) SM5108E-060-A 60 PSI SM5108E-100-A 100 PSI
Ordering Information
For qualification specifications, please contact Sales at sales@si-micro.com Page 5
DOC # 40DS5168.03 Silicon Microstructures Warranty and Disclaimer: Silicon Microstructures, Inc. reserves the right to make changes without further notice to any products herein and to amend the contents of this data sheet at any time and at its sole discretion. Information in this document is provided solely to enable software and system implementers to use Silicon Microstructures, Inc. products and/or services. No express or implied copyright licenses are granted hereunder to design or fabricate any silicon- based microstructures based on the information in this document. Silicon Microstructures, Inc. makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Microstructures, Inc. assume any liability arising out of the application or use of any product or silicon-based microstructure, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Silicon Microstructure’s data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Silicon Microstructures, Inc. does not convey any license under its patent rights nor the rights of others. Silicon Microstructures, Inc. makes no representation that the circuits are free of patent infringement. Silicon Microstructures, Inc. products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Silicon Microstructures, Inc. product could create a situation where personal injury or death may occur. Should Buyer purchase or use Silicon Microstructures, Inc. products for any such unintended or unauthorized application, Buyer shall indemnify and hold Silicon Microstructures, Inc. and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Silicon Microstructures, Inc. was negligent regarding the design or manufacture of the part. Silicon Microstructures, Inc. warrants goods of its manufacture as being free of defective materials and faulty workmanship. Silicon Microstructures, Inc. standard product warranty applies unless agreed to otherwise by Silicon Microstructures, Inc. in writing; please refer to your order acknowledgement or contact Silicon Microstructures, Inc. directly for specific warranty details. If warranted goods are returned to Silicon Microstructures, Inc. during the period of coverage, Silicon Microstructures, Inc. will repair or replace, at its option, without charge those items it finds defective. The foregoing is buyer’s sole remedy and is in lieu of all warranties, expressed or implied, including those of merchantability and fitness for a particular purpose. In no event shall Silicon Microstructures, Inc. be liable for consequential, special, or indirect damages. While Silicon Microstructures, Inc. provides application assistance personally, through its literature and the Silicon Microstructures, Inc. website, it is up to the customer to determine the suitability of the product for its specific application. The information supplied by Silicon Microstructures, Inc. is believed to be accurate and reliable as of this printing. However, Silicon Microstructures, Inc. assumes no responsibility for its use. Silicon Microstructures, Inc. assumes no responsibility for any inaccuracies and/or errors in this publication and reserves the right to make changes without further notice to any products or specifications herein Silicon Microstructures, Inc.TM and the Silicon Microstructures, Inc. logo are trademarks of Silicon Microstructures, Inc. All other service or product names are the property of their respective owners. © Silicon Microstructures, Inc. 2001-2018. All rights reserved. SM5108E Series www.si-micro.com Page 6