SM3022-005-G-D

SM30G SMI | Alldatasheet

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Technical content

DOC # 40DS3022.02 AccuStable™ SM30G Platinum Family OEM Silicon Pressure Die

DESCRIPTION

The SM30G-Platinum is a silicon micro-machined, piezoresistive pressure sensing die. This device will be available with a full-scale range of 5 to 30 PSI and is ideal for OEM and high-volume applications. The device has platinum bond-pads to enable its use in harsh environments. FEA TURES

• Platinum bond-pads enable use in harsh environments
• Qualified using Grade 0 AEC-Q100 automotive standards
• Enhanced stability with an integrated field shield
• Extended operating temperature range: -40oC to 150oC
• Small size 1.35 x 1.35 mm
• <1% Output shift over life
• Differential or gage configuration
• Available 5, 15, & 30 PSI
• Ratiometric with supply voltage up to 10 V
• Manufactured according to ISO9001 and ISO/TS 16949 standards
• RoHS & REACH compliant Provided in die form, these sensors can be mounted on ceramic on a variety of substrates or packages as part of an OEM system. They also may be packaged into proprietary or application specific sensor lines. The devices are electrically probed, diced, inspected and shipped on tape. Electronic wafer maps are provided with each wafer. Medical Industrial Automotive Patient Monitors Industrial Controls Diesel Particulate Filter (DPF) Blood Pressure Monitors Compressors & Pumps Exhaust Gas Recirculation (EGR) Oxygen Concentrators Pressure Switches Automotive Systems Fluid Evacuation Gas Particulate Filter (GPF) Page 1

DOC # 40DS3022.02 SM30G Platinum Series www.si-micro.com Absolute Maximum Ratings No. Characteristic Symbol Minimum Typical Maximum Units

1 Excitation Voltage(a) VDD - - 10 V

2 Operating Temperature TOP -40 - +150 °C

3 Storage Temperature(a) TSTG -55 - +150 °C

4 ESD Rating - Human Body Model VESD 2 kV

No. Product Number Legacy Product Number Operating Pressure(c) Proof Pressure (PPROOF)(b) Burst Pressure (PBURST)(b)

5 SM30G-H-ND-005S-0010A SM3022-005-G-D

±5 PSI 0 to 5 PSI 0 to -5 PSI

25 PSI 40 PSI

6 SM30G-H-ND-015S-0010A SM3022-015-G-D

±15 PSI 0 to 15 PSI 0 to -15 PSI

45 PSI 75 PSI

7 SM30G-H-ND-030S-0010A SM3022-030-G-D

±30 PSI 0 to 30 PSI 0 to -30 PSI

90 PSI 150 PSI

Notes: b. Tested on a sample basis. The burst and proof pressure values are limited by pressure applied to the backside of the die. The burst and proof pressure values are higher than shown here when pressure is applied to the topside of the die. c. Can be operated as topside gauge, backside gage & differential. Notes: a. The device can only be driven with the supply voltage connected to the pins as shown. Page 2

DOC # 40DS3022.02 SM30G Platinum Series www.si-micro.com No. Characteristic Symbol Minimum Typical Maximum Units

8 Topside

Span (FS PRANGE) 5, 15 PSI (c, d) VSPAN 60 90 120 mV

30 PSI (c, d) 55 80 105

9 Backside

Span (FS PRANGE) 5, 15 PSI (c, d) VSPAN 60 90 120 mV

10 Zero Offset VZERO -45 -5 +25 mV

11 TC Span (c, e, f) TCS -0.24 -0.19 -0.155 %/°C

12 TC Zero Offset(c, e, f) TCZ -75 - 75 µV/°C

13 TC Resistance(c, e, f) TCR 0.24 0.275 0.33 %/°C 14 Linearity - Topside (c, f, g) NLTS -0.15 <±0.10 0.15 %/FS

15 Linearity – Backside

5 PSI (c, f, h)

-0.3 <±0.2 0.3 %/FS

16 Bridge Resistance RB 4 5 6 kΩ

17 Pressure Hysteresis(c) PHYS <±0.1 %FS 18 Thermal Hysteresis(c, e) THYS <±0.3 %FS Operating Characteristics - Specifications All parameters are specified at Vdd = 5.0 V supply voltage at 25oC, unless otherwise noted. OPERATING CHARACTERISTICS FOR SM30G Platinum Series The operating characteristics are based on packaged die. The sensor performance may vary depending on the die attach material and process. The die attach material and process should minimize the stress transferred to the sensor die. The sensor can be operated with the highest pressure applied to the topside of the die (topside operation) or the highest pressure applied to the backside of the die (backside operation). With topside operation, increasing topside pressure will result in an increasing sensor output. Notes: c. Tested on a sample basis d. For other pressures, please contact SMI sales at +1-(408) 577-0100 or email at sales@si-micro.com e. Determined by measurements taken over -40°C to 150°C f. Defined as best fit straight line g. Topside linearity is with the highest pressure applied to the topside of the die h. Backside linearity is with the highest pressure applied to the backside of the die Page 3

DOC # 40DS3022.02 SM30G Platinum Series www.si-micro.com SM30G Diagrams and Dimensions Typical Operation PAD # PAD DESCRIPTION PAD LABEL TYPE VALUE Coordinate X-Axis (µm) Coordinate Y-Axis (µm)

1 Negative Sensor Output S- - Analog Output - 0 0

2 Negative Sensor Output S2- - Analog Output - 0 1100

3 Negative Supply Voltage V3- Power 0 V 890 1100

4 Negative Supply Voltage V2- Power 0 V 1100 890

5 Negative Supply Voltage V- Power 0 V 1100 0

6 Positive Sensor Output S+ + Analog Output - 840 0

7 Positive Supply Voltage V+ Power +5 V 260 0

NOTES:

• Closed bridge configuration: Pads 3, 4, & 5 are connected
• Open bridge configuration: Pads 4 & 5 are connected, and pad 3 is the second negative supply voltage connection All dimensions are in micron. Page 4 Platinum bond-pad size = 110x110µm Assembly Recommendations (a) Use soft RTV for die-attachment (b) A bond line thickness of 180-220 µm is recommended (c) The RTV should not go up the inside of the die cavity by more than 50% of the die thickness.

DOC # 40DS3022.02 SM30G Platinum Series www.si-micro.com Order Code Legacy Product Number Configuration Full-Scale Pressure Range* Minimum Order Quantity SM30G-H-ND-005S-0010A SM3022-005-G-D Closed Bridge 5 PSI

1 Wafer (1 wafer = 6,000 ±10%) SM30G-H-ND-015S-0010A SM3022-015-G-D Closed Bridge 15 PSI

SM30G-H-ND-030S-0010A SM3022-030-G-D Closed Bridge 30 PSI

Ordering Information

For qualification specifications, please contact Sales at sales@si-micro.com Page 5 NOTE: Part numbers of engineering samples are subject to change * Topside 0 to +5 PSI, 0 to -5 PSI or ± FS Pressure

DOC # 40DS3022.02 Silicon Microstructures Warranty and Disclaimer: Silicon Microstructures, Inc. reserves the right to make changes without further notice to any products herein and to amend the contents of this data sheet at any time and at its sole discretion. Information in this document is provided solely to enable software and system implementers to use Silicon Microstructures, Inc. products and/or services. No express or implied copyright licenses are granted hereunder to design or fabricate any silicon- based microstructures based on the information in this document. Silicon Microstructures, Inc. makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Microstructures, Inc. assume any liability arising out of the application or use of any product or silicon-based microstructure, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Silicon Microstructure’s data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Silicon Microstructures, Inc. does not convey any license under its patent rights nor the rights of others. Silicon Microstructures, Inc. makes no representation that the circuits are free of patent infringement. Silicon Microstructures, Inc. products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Silicon Microstructures, Inc. product could create a situation where personal injury or death may occur. Should Buyer purchase or use Silicon Microstructures, Inc. products for any such unintended or unauthorized application, Buyer shall indemnify and hold Silicon Microstructures, Inc. and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Silicon Microstructures, Inc. was negligent regarding the design or manufacture of the part. Silicon Microstructures, Inc. warrants goods of its manufacture as being free of defective materials and faulty workmanship. Silicon Microstructures, Inc. standard product warranty applies unless agreed to otherwise by Silicon Microstructures, Inc. in writing; please refer to your order acknowledgement or contact Silicon Microstructures, Inc. directly for specific warranty details. If warranted goods are returned to Silicon Microstructures, Inc. during the period of coverage, Silicon Microstructures, Inc. will repair or replace, at its option, without charge those items it finds defective. The foregoing is buyer’s sole remedy and is in lieu of all warranties, expressed or implied, including those of merchantability and fitness for a particular purpose. In no event shall Silicon Microstructures, Inc. be liable for consequential, special, or indirect damages. While Silicon Microstructures, Inc. provides application assistance personally, through its literature and the Silicon Microstructures, Inc. website, it is up to the customer to determine the suitability of the product for its specific application. The information supplied by Silicon Microstructures, Inc. is believed to be accurate and reliable as of this printing. However, Silicon Microstructures, Inc. assumes no responsibility for its use. Silicon Microstructures, Inc. assumes no responsibility for any inaccuracies and/or errors in this publication and reserves the right to make changes without further notice to any products or specifications herein Silicon Microstructures, Inc.TM and the Silicon Microstructures, Inc. logo are trademarks of Silicon Microstructures, Inc. All other service or product names are the property of their respective owners. © Silicon Microstructures, Inc. 2001-2019. All rights reserved. SM30G Platinum Series www.si-micro.com Page 6