SLE66C681PE INFINEON | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 8

Technical content

Security & Chip Card ICs SLE 66C681PE 8/16-Bit Security Controller with enhanced instruction set for large memories in 0.22 µm CMOS Technology 136-Kbytes ROM, 4352 bytes RAM, 68-Kbytes EEPROM, Preliminary Short Product Information 02.04

SLE 66C681PE Short Product Information Ref.: SPI_SLE66C681PE_0204 This document contains preliminary information on a new product under development. Details are subject to change without notice. Revision History: Current Version 02.04 Previous Releases: Page Important: Further information is confidential and on request. Please contact: Infineon Technologies AG in Munich, Germany, Security & Chip Card ICs, Tel +49 - (0)89 234-80000 Fax +49 - (0)89 234-81000 E-Mail: security.chipcard.ics@infineon.com Edition 2004 Published by Infineon Technologies AG, CC Applications Group St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 2002 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non -infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives world-wide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Te chnologies Components may only be used in life -support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

Preliminary - Short Product Information 3 / 9 02.04 8/16-Bit Security Controller with enhanced instruction set for large memories in 0.22µm CMOS Technology, 136-Kbyte ROM, 4352 bytes RAM, 68-Kbyte EEPROM

Features

  • 8/16-bit microcomputer in 0.22 µm CMOS technology
  • Instruction set opcode compatible with standard SAB 8051 processor
  • Downward compatibility to existing SLE 66CxxxP products for existing masks (without using the new features)
  • Addressable memory up to 16 Mbyte
  • Additional enhanced instructions for direct physical memory access of >64kByte
  • Typically saves up to 90 % code space and increases execution speed up to 80%.
  • Dedicated, non-standard architecture with execution time 6 times faster than standard SAB 8051 processor at same external clock. (Up to 18 times faster using internal frequency PLL x 3 compared to external clock).
  • 136 Kbytes User ROM for application programs
  • 68 Kbytes MicroSlim-EEPROM for increased memory requirements in mobile applications
  • 4 Kbytes XRAM, 256 bytes internal RAM
  • Enhanced Memory Management and Protection Unit (MMU) with application and user defined segments
  • DES in software
  • True Random Number Generator with Firmware test function
  • CRC Module
  • 16-bit Interrupt Module
  • Code executions during E²-programming for faster personalization
  • EEPROM programming voltage generated on chip
  • Internal Clock with up to 33 MHz: Programmable internal frequency (PLL x1, x2, x3, x4 and free running mode(s)).
  • Adjustable internal frequency according to available power or required performance
  • Increased internal frequency for maximum performance
  • Internal frequency is automatically adjusted to guarantee a given limited power consumption
  • Two 16-bit Autoreload Timer
  • Power saving sleep mode
  • Ext. Clock freq. 1 up to 7.5 MHz
  • UART for handling serial interface in accordance with ISO/IEC 7816 part 3 supporting transmission protocols T=1 and T=0
  • Supply voltage range:1.8 V, 3.0 V, 5.0 V
  • Support of current consumption limits by GSM / UICC

applications

< 10 mA @ 5.5 V < 6 mA @ 3.3 V < 4 mA @ 1.98 V

  • Operating Temperature range: -25 to +85°C
  • Storing temperature range: – 40° to +125°C
  • ESD protection larger than 6 kV (HBM) MicroSlim-EEPROM
  • Typical Erase + Write time ≤ 2.9 ms
  • Enhanced ECC module controlled by OS
  • Reading and programming byte by byte
  • Platform prepared for flash-like erasing of E²-segments up to 2 kB
  • Flexible page mode for 1 to 64 bytes write/erase operation
  • 32 bytes security area (OTP)
  • Fast personalization mode ≤ 1.0 ms
  • Minimum of 500.000 write/erase cycles @ 25°C per page. Maximum of 16.500.000 write/erase cycles per sector
  • Typical data retention of 10 years @ 25°C New New New New New New New New New

Preliminary - Short Product Information 4 / 9 02.04 Memory Management and Protection Unit

  • Addressable memory of up to 16 Mbyte
  • Separates OS (system mode) and application (user mode)
  • System routines called by interrupts
  • OS can restrict access to peripherals in application mode
  • Variable application orientated segments defined and controlled by OS
  • Code execution from XRAM possible
  • Enhanced multi-application support by 16 descriptors for system / application mode. Security Features
  • Enhanced sensor concept:
  • Low and high voltage sensors
  • Frequency sensors and filters
  • Light Sensor
  • Glitch Sensors
  • Temperature Sensor
  • Life Test Function for Sensors (UMSLC)
  • Bus confusion
  • Security reset detection
  • Current control oscillator (ICO) Memory Security
  • Sparkling SFR encryption for DDES and ACE, CRC module and RNG
  • 32 bytes security PROM, hardware protected for batch-, wafer-, die-individual security data. Unique chip identification number for each chip
  • Additional memory for customer-defined security FabKey on request
  • MED – memory encryption/decryption device for XRAM, ROM and EEPROM
  • Security optimized layout and layout scrambling
  • Fast IRAM erase
  • Enhanced Error correction unit (ECU) Testmode
  • Irreversible Lock - Out of test-mode Anti Snooping
  • Automatic randomization smoothing of power profile
  • Effective HW-countermeasures against SEMA/DEMA, SPA/DPA, DFA and Timing-Attacks
  • Non standard dedicated Smart Card CPU – Core
  • Active Shield with automatic and user controlled attack detection
  • Hardware countermeasures controlled by True Random Number Generator Targeted Certifications
  • CAST Support
  • HW-& SW-Tools (Emulator, ROM Monitor, Card Emulator, Simulator, Softmasking)
  • Application notes Supported Standards
  • ISO/IEC 7816
  • EMV 2000
  • GSM 11.11, 11.12, 11.18
  • ETSI TS 102 221 Document References
  • Confidential Data Book SLE66CxxxPE
  • Qualification report
  • Chip delivery specification for wafer w ith chip -layout (die size, orientation,...)
  • Module specification containing description of package, etc.
  • Qualification report module Development Tools Overview
  • Short Product Information Software Development Kit SDK CC
  • Short Product Information Card Emulator CE66PE
  • Short Product Information ROM Monitor RM66PE
  • Short Product Information Emulator ET66P E Hitex or ET66PE KSC
  • Short Product Information Smart Mask Package New New New

Preliminary - Short Product Information 5 / 9 02.04

Ordering Information

(int. clock frequency Frequency Range (ext. clock frequency) SLE 66C681PE C Die (sawn, unsawn) SLE 66C681PE M5 M5.1 or 3.0 V; 5.0 V – 25°C to + 70°C or – 25°C to + 85°C Up to 33 MHz

1 MHz - 5 MHz

1 MHz - 7.5 MHz For ordering information please refer to the databook and contact your sales representative. Production sites for SLE 66C681PE:

  • Dresden (Germany), UMC (Taiwan), Altis (France). 1 available as wire-bonded module (M5) for embedding in plastic cards or as die (C) for customer packaging

Preliminary - Short Product Information 6 / 9 02.04 Pin Configuration SLE 66C681PE CLK RST I/O VCC GND Figure 1: Pin Configuration Pin Definitions and Functions Symbol Function VCC Operating voltage RST Reset input CLK Processor clock input GND Ground I/O Bi-directional data port

Preliminary - Short Product Information 7 / 9 02.04 General Description The SLE66C681PE is another member of the improved 66PE -series of Infineon Technologies and the successor of the SLE66C640P . This high performance security crypto controller is manufactured in advanced 0.22 µm CMOS technology. It is downward compatible to exist ing 66P controller derivatives. The well known ECO2000 8/16 bit CPU provides the high efficiency of the SAB 8051 instruction set extended by additional powerful instructions together with enhanced performance, me mory sizes and security features compared to existing 66P derivatives. Performance: The internal clock frequency can be adjusted to a level up to 33 MHz either as a multiple of 1,2,3,4 to the external frequency or independent of the clock rate of the terminal with the help of the internal clock. It is adjustable according to either available power requirements or required performance:

  • Increased internal clock frequency for maximum performance, e.g. for high performance with max. frequency in payment applications or crypto operations.
  • Automatically adjusted frequency for a max. given power consumption, e.g. by GSM or UMTS requirements. Memory: The SLE66C681PE offers 136 Kbytes of User-ROM, 256 byte internal RAM, 4352 byte XRAM and 68 Kbytes MicroSlim-EEPROM, to fulfill the increased requi rements of GSM and UMTS applications. The large ROM size allows to place applications in the ROM -mask and to keep the E²PROM free for customer data. In addition it saves mask development costs, as one mask may be used for different customer projects.

68 Kbyte of EEPROM thus allows to include SIM Application Toolkit, Wireless Application Protocol (WAP),

WML-Browser and JavaCard API implementations into the NVM. The enhanced Memory Management and Protection Unit allows a secure separation of the operating system and different applications. It allows to separate the memories in application orientated segments, which can be controlled by the OS. Furthermore, the MMU makes a secure downloading of applications possible even after personalization of a card. These new features suit the requirements of the next generation of multi application operating systems. EEPROM

68 Kbyte

4 Kbyte

136 Kbyte

Figure 2: Block Diagram SLE 66C681PE The new platform is designed to address up to 16 Mbyte. However this feature is only available upon request and will clearly require a change in the existing tool environment. In addition, new instructions have been implemented in the design for an efficient direct access of physical memory >64Kbyte up to 16 Mbyte. New

Preliminary - Short Product Information 8 / 9 02.04 Security features: Since the very beginning, security is an integrated part of Infineons product development, as proved by various certificates (ITSEC, CC, Proton, VISA, ZKA, Mondex). The so called “integral security concept” for the 66P series ensures:

  • A secret storage of any confidential code, data and keys
  • Protection against side channel attacks such as: Simple Power Analysis (SPA) , Differential Power Analysis (DPA),
  • Protection against Differential Fault Analysis (DFA), Electromagnetic Emanation Attack (EMA) and other possible HW or SW attacks Peripherals: The CRC module allows the easy generation of checksums according to ISO/IEC 3309 (16-Bit- CRC). To minimize the overall power consumption, the chip card controller IC offers a sleep mo de. The UART supports the half -duplex transmission protocols T=0 and T=1 according to ISO/IEC 7816 -3. All relevant transmission parameters can be adjusted by software, as e.g. the clock division factor, direct/inverse convention and the number of stop bits . Additionally, the I/O port can be driven by communication routines realized in software. Symmetric algorithms can be processed in software. The random number generator (RNG) is able to supply the CPU with true random numbers on all conditions. The advanc ed sensor concept includes various sensors for any kind of attack scenarios and even more important a “Life Test ” for sensors. As an important feature, the chip provides an on -chip security, which fulfills the strong security requirements of a Common Criteria evaluation at an EAL5+ level. The SLE 66C681PE fulfills all requirements of today's chip card applications, and is especially designed for mainstream GSM applications . In addition it offers a powerful platform for multi application cards and supports the migration to enhanced GSM (incl. WAP), OTA, GPRS and UMTS value added services. The SLE6 6C681PE integrates outstanding memory sizes, additional peripherals in combination with enhanced performance and optimized power consumption on a minimized die size.