SKT10100AJ3 CYSTEKEC | Alldatasheet
Document overview
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Technical content
Features
150℃ operating junction temperature Softest, fast switching capability Reduced ultra-low forward voltage drop (VF) ; better efficiency and cooler operation. Lead-Free Finish; RoHS Compliant Halogen and Antimony Free. “Green” Device Trench technology provides a superior avalanche capability Mechanical Data Case: TO-252 molded plastic Weight: 0.34 grams approximately Terminals: Pure tin plated, lead-free, solderable per MIL-STD-750 method 2026 Epoxy: UL 94V-0 rate flame retardant Polarity : As marked. Equivalent Circuit Outline TO-252 IF(A V) 10A VRRM 100V VF at 125°C 0.58V Tj 150°C
CYStech Electronics Corp. Spec. No. : C174J3 Issued Date : 2015.04.10 Revised Date : Page No. : 2/6 SKT10100AJ3 CYStek Product Specification Maximum Ratings and Electrical Characteristics (Rating at 25C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. ) Parameter Symbol Min. Typ. Max. Units Maximum DC blocking voltage VDC 100 V Maximum Recurrent peak reverse voltage VRRM 100 V Maximum RMS voltage VRMS 70 V instantaneous forward voltage at IF=5A TC=25°C VF 0.54 - V TC=125°C 0.50 - instantaneous forward voltage at IF=10A TC=25°C VF 0.65 0.72 V TC=125°C 0.58 0.66 Maximum instantaneous reverse current at VR=100 V, TC=25℃ IR 25 200 μA VR=100 V, TC=125℃ 12 25 mA Maximum Average forward rectified current IF(AV) 10 A Non-repetitive peak forward surge current @ IFSM 150 A 8.3ms single half sine wave superimposed on rated load (JEDEC method) Peak Repetitive Reverse Surge Current (2uS-1Khz) IRRM 2 A Storage temperature range Tstg -55 150 ℃ Operating junction temperature range TJ -55 150 ℃ Thermal Data Parameter Symbol Value Unit Typical Thermal Resistance, Junction-to-case Rth,j-c 3 C/W Typical Thermal Resistance, Junction-to-ambient Rth,j-a 125 C/W
Ordering Information
(Pb-free lead plating and Halogen-free package) 2500/Tape & Reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T3 : 2500 pcs / tape & reel, 13” reel Product rank, zero for no rank products Product name
CYStech Electronics Corp. Spec. No. : C174J3 Issued Date : 2015.04.10 Revised Date : Page No. : 3/6 SKT10100AJ3 CYStek Product Specification Typical Characteristics 0 25 50 75 100 125 150 175 Average Forward Current---Io(A) Case Temperature---TC(℃) Forward Current Derating Curve resistive or inductive load 100 1000 10000 100000 0 0.2 0.4 0.6 0.8 Instantaneous Forward Current---IF(mA) Forward Voltage---VF(V) Forward Current vs Forward Voltage Pulse width=300μs, Tj=25°C Tj=150℃ Tj=75°C Tj=125°C Tj= - 40°C 0.001 0.01 0.1 100 1000 10000 100000 1000000 0 20 40 60 80 100 Reverse Leakage Current---IR(μA) Reverse Voltage---VR(V) Reverse Leakage Current vs Reverse Voltage Tj=75℃ Tj=25℃ Tj=125℃ Tj=150°C Tj= -40℃ 10000 100000 1000000 10000000 0.1 1 10 100 Junction Capacitance---CJ(pF) Reverse Voltage---VR(V) Junction Capacitance vs Reverse Voltage Tj=25℃, f=1.0MHz
CYStech Electronics Corp. Spec. No. : C174J3 Issued Date : 2015.04.10 Revised Date : Page No. : 4/6 SKT10100AJ3 CYStek Product Specification Recommended solering footprint Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/ -5 C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3C/second max. 3C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100C 150C 60-120 seconds 150C 200C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183C 60-150 seconds 217C 60-150 seconds Peak Temperature(TP) 240 +0/ -5 C 260 +0/ -5 C Time within 5C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6C/second max. 6C/second max. Time 25 C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.
CYStech Electronics Corp. Spec. No. : C174J3 Issued Date : 2015.04.10 Revised Date : Page No. : 5/6 SKT10100AJ3 CYStek Product Specification Reel Dimension Carrier Tape Dimension
CYStech Electronics Corp. Spec. No. : C174J3 Issued Date : 2015.04.10 Revised Date : Page No. : 6/6 SKT10100AJ3 CYStek Product Specification TO-252 Dimension *: Typical DIM Inches Millimeters DIM Inches Millimeters Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: Lead : Pure tin plated Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. CYStek reserves the right to make changes to its products without notice. CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.