SKM3045CTF3 CYSTEKEC | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 6

Technical content

Features

  • 150℃ operating junction temperature
  • Softest, fast switching capability
  • Reduced ultra-low forward voltage drop (VF) ; better efficiency and cooler operation.
  • Lead-Free Finish; RoHS Compliant
  • Halogen and Antimony Free. “Green” Device
  • MCD technology provides a superior avalanche capability than schottky diodes Mechanical Data
  • Case: JEDEC TO-263 molded plastic
  • Terminals: Pure tin plated, lead-free, solderable per MIL-STD-750 method 2026
  • Epoxy: UL 94V-0 rate flame retardant
  • Polarity: As marked. E q u i v a l e n t C i r c u i t O u t l i n e

CYStech Electronics Corp. Spec. No. : C180F3 Issued Date : 2015.04.13 Revised Date : 2015.08.25 Page No. : 2/2 SKM3045CTF3 CYStek Product Specification Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.) Parameter Symbol Min. Typ. Max. Units Maximum DC blocking voltage VDC 45 V Maximum Recurrent peak reverse voltage VRRM 45 V Maximum RMS voltage VRMS 32 V TC=25°C 0.47 0.54 Maximum instantaneous forward voltage at IF=15A TC=125°C VF 0.46 V Maximum instantaneous VR=45 V, TC=25℃ 70 200 μA reverse current at VR=45 V, TC=125℃ IR 20 50 mA Maximum Average forward rectified current @ TC=100℃ IF(AV) 15 A Non-repetitive peak forward surge current @ 8.3ms single half sine wave superimposed on rated load (JEDEC method) IFSM 250 A Peak Repetitive Reverse Surge Current (2uS-1Khz) IRRM 2 A Maximum Rate of Voltage Change ( at Rated VR ) dv/dt 10000 V/uS Storage temperature range Tstg -55 150 ℃ Operating junction temperature range TJ -55 150 ℃ Thermal Data Parameter Symbol Value Unit Typical Thermal Resistance, Junction-to-case Rth,j-c 2 °C/W Typical Thermal Resistance, Junction-to-ambient Rth,j-a 60 °C/W

Ordering Information

(Pb-free lead plating ) 800 pcs / Tape & Reel

CYStech Electronics Corp. Spec. No. : C180F3 Issued Date : 2015.04.13 Revised Date : 2015.08.25 Page No. : 3/3 SKM3045CTF3 CYStek Product Specification Typical Characteristics

CYStech Electronics Corp. Spec. No. : C180F3 Issued Date : 2015.04.13 Revised Date : 2015.08.25 Page No. : 4/4 SKM3045CTF3 CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C180F3 Issued Date : 2015.04.13 Revised Date : 2015.08.25 Page No. : 5/5 SKM3045CTF3 CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C180F3 Issued Date : 2015.04.13 Revised Date : 2015.08.25 Page No. : 6/6 SKM3045CTF3 CYStek Product Specification TO-263 Dimension