SK52-SMC HDSEMI | Alldatasheet

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H igh Diode Semiconductor Limiting Values (Absolute Maximum Rating) SK 52 THRU SK 520 Electrical Characteristics (T =25℃ Unless otherwise specified） Item Symbol Unit Test Conditions SK 5 2 3 4 5 6 8 10 15 20 Repetitive Peak Reverse Voltage V RRM V 20 30 40 50 60 80 100 150 200 Average Forward Current I F(AV) A 60HZ Half-sine wave, Resistance load, TL(Fig.1) 5.0 Surge(Non-repetitive)Forward Current I FSM A 60Hz Half-sine wave ,1 cycle , Ta =25℃ 150 Junction Temperature T J Storage Temperature T STG ℃ -65 ~ +150 a Item Symbol Unit Test Condition SK 5 Peak Forward Voltage V F V I F =5.0A Peak Reverse Current I RRM1 mA V RM RRM Ta =25℃ I RRM2 Ta =100℃ 20 10 Thermal Resistance(Typical) R θJ-A W Between junction and ambient 55 R θJ-L Between junction and terminal 17 2 3 4 5 6 8 10 15 20 0.55 0.85 0.7 0.5 V 14 21 28 35 42 56 70 105 140 Maximum RMS V RMS Voltage 0.95 0.2

H igh Diode Semiconductor Characteristics(Typical) 0 25 50 75 100 125 150 175 150 120 0.01 0.1 1 10 100 100 0.1 t,PULSE DURATION,sec. FIG. 6-TYPICAL TRANSIENT THERMAL IMPEDANCE FIG. 3-TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS NUMBER OF CYCLES AT 60 Hz FIG. 2-MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT FIG. 1- FORWARD CURRENT DERATING CURVE AVERAGE FORWARD RECTIFIED CURRENT, AMPERESINSTANTANEOUS FORWARD CURRENT,AMPERES £PEAK FORWARD SURGE CURRENT, AMPERES INSTANTANEOUS FORWARD VOLEAGE, VOLTS Single Phase Half Wave 60Hz Resistive or inductive Load 1 10 100 8.3ms SINGLE HALF SINE-WAVE (JEDEC Method) 0.01 0.1 TJ=25 C PULSE WIDTH=300 ms 1%DUTY CYCLE TRANSIENT THERMAL IMPEDANCE, C/W AMBIENT TEMPERATURE, C SK55-SK520 SK52-SK54 SK55-SK56 SK52-SK54 SK58-SK510 0.1 1.0 10 100 REVERSE VOLTAGE,VOLTS FIG. 5-TYPICAL JUNCTION CAPACITANCE JUNCTION CAPACITANCE, pF TJ=25 C 100 1000 2000 SK55-SK520 SK52-SK54 SK515-SK520 0 20 40 60 80 100 1,00 0.1 0.01 0.001 TJ=25 C TJ=100 C PERCENT OF PEAK REVERSE VOLTAGE,% FIG. 4-TYPICAL REVERSE CHARACTERISTICS INSTANTANEOUS REVERSE CURRENT, MILLIAMPERES TJ=75 C

0.108 (2.75) 0.123 (3.25) 0.256(6.50) 0.280(7.10) 0.217(5.50) 0.240(6.10) 0.087(2.2) 0.106(2.7) 0.035(0.90) 0.055(1.40) 0.291(7.40) 0.331(8.40) 0.012(0.30) 0.007(0.17) 0.008(0.203)MAX. Dimensions in inches and (millimeters) Package Outline Dimensions SMC Suggested Pad Layout SMC 6.5 3.5 1.8 JSHD JSHD H igh Diode Semiconductor

Reel Taping Specifications For Surface Mount Devices-SMC H igh Diode Semiconductor