SD05T1_12 SANYO | Alldatasheet

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© Semiconductor Components Industries, LLC, 2005 September, 2005 − Rev. 2

1 Publication Order Number:

SOD−323 Diodes for ESD Protection These TVS diodes are designed for applications requiring transient overvoltage protection capability. They are intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment and other applications. These devices are ideal for situations where board space is at a premium. Specification Features:

  • Steady State Power Routing of 200 mW
  • Peak Power − 350 W (8 /C0032 20 /C0109s)
  • Low Leakage
  • Cathode Indicated by Polarity Band
  • Package Weight: 4.507 mg/wmt
  • Meets IEC61000−4−2 Level 4, 15 kV (Air), 8 kV (Contact)
  • Meets IEC6100−4−4 Level 4, 40 A
  • Meets IEC6100−4−5 (Lightning), 24 A
  • Meets 16 kV Human Body Model ESD Requirements
  • Pb−Free Packages are Available Mechanical Characteristics: CASE: V oid-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94, V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements Use the Device Number to order the 7 inch/3,000 unit reel. Replace the “T1” with “T3” in the Device Number to order the 13 inch/10,000 unit reel. http://onsemi.com SOD−323 CASE 477 STYLE 1 MARKING DIAGRAM xx = Specific Device Code ZA = SD05T1 ZC = SD12T1 M = Month Code /C0071 = Pb−Free Package (Note: Microdot may be in either location) Preferred devices are recommended choices for future use and best overall value. Device Package Shipping †

ORDERING INFORMATION

SD05T1 SOD−323 3000/Tape & Reel SD12T1 SOD−323 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification s Brochure, BRD8011/D. xx M/C0071 /C0071 SD05T1G SOD−323 (Pb−Free) 3000/Tape & Reel SD12T1G SOD−323 (Pb−Free) 3000/Tape & Reel

http://onsemi.com MAXIMUM RATINGS Rating Symbol Value Unit Peak Power Dissipation @ 20 /C0109s (Note 1) @ TL ≤ 25°C Ppk 350 Watts IEC 61000−4−2 (ESD) Air Contact ±15 ±8.0 kV IEC 61000−4−4 (EFT) 40 A ESD Voltage (Human Body Model (HBM) Waveform per IEC 61000−4−2) VPP 30 kV Total Power Dissipation on FR−5 Board (Note 2) @ TA = 25°C Derate above 25°C °PD° 200 1.6 °mW° mW/°C Thermal Resistance Junction−to−Ambient R/C0113JA 635 °C/W Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C Lead Solder Temperature − Maximum (10 Second Duration) TL 260 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. *Other voltages may be available upon request. 1. Nonrepetitive current pulse, per Figure 6.

ELECTRICAL CHARACTERISTICS

(TA = 25°C unless otherwise noted) Symbol Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM Working Peak Reverse Voltage IR Maximum Reverse Leakage Current @ VRWM VBR Breakdown Voltage @ IT IT Test Current IF Forward Current VF Forward Voltage @ IF Uni−Directional TVS IPP IF V I IRIT VRWMVC VBR VF (V) IR @ VRWM (/C0109A) VBR, Breakdown Voltage (V) IT mA VC @ IPP = 5 A (Note 3) (V) Max IPP (Note 3) (A) VC @ Max IPP (Note 3) (V) Max Capacitance (pF) Min Max VR = 0 V f = 1.0 MHz SD12T1, G 12 1.0 13.3 15.75 1.0 19 15 25 150 3. 8 × 20 /C0109s pulse waveform.

http://onsemi.com PACKAGE DIMENSIONS SOD−323 CASE 477−02 ISSUE G STYLE 1: PIN 1. CATHODE 2. ANODE HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH SOLDER PLATING. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 5. DIMENSION L IS MEASURED FROM END OF RADIUS. NOTE 3 D 1 2b E A C NOTE 5 L HE DIM MIN NOM MAX MILLIMETERS A 0.80 0.90 1.00 A1 0.00 0.05 0.10 A3 0.15 REF b 0.25 0.32 0.4 C 0.089 0.12 0.177 D 1.60 1.70 1.80 E 1.15 1.25 1.35 0.08 2.30 2.50 2.70 L 0.031 0.035 0.040 0.000 0.002 0.004

0.006 REF

0.010 0.012 0.016 0.003 0.005 0.007 0.062 0.066 0.070 0.045 0.049 0.053 0.003 0.090 0.098 0.105 MIN NOM MAX INCHES 1.60 0.063 0.63 0.025 0.83 0.033 2.85 0.112 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 SD05T1/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.