SCA8X0 VTI | Alldatasheet
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VTI Automotive Digital Accelerometer Platform SCA8X0 / 21X0 / 31X0 Accelerometers Product Family Specification
www.vti.fi Doc. Nr. 82 694 00 C TABLE OF CONTENTS
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www.vti.fi Doc. Nr. 82 694 00 C General Description
1.1 Introduction
VTI Automotive Digital Accelerometer Platform is an accelerometer product concept based on VTI capacitive 3D-MEMS technology. The VTI ADP platform integrates high accuracy micromechanical acceleration sensing together with a flexible SPI di gital interface. The products within the platform range from single axis accelerometers into two or three axis accelerometers. Dual Flat Lead (DFL) housing of the component guarantees robust operation over the product lifetime. The products are designed, manufactured and tested for high stability, reliability and quality requirements of automotive applications. The acce lerometers have extremely stable output over wide range of temperature, humidity and mechan ical noise. The components are qualified against AEC-Q100 standard and have several advanced self diagnostics features. The DFL housing is suitable for SMD mounting and the component is compatible with RoHS and ELV directives. This Product Family Specification describes the VTI Automotive Digital Accelerometer Platform common characteristics and how to operate with the products. Detail product specification is described in individual data sheets of each product.
1.2 Features
Standard features of the VTI Automotive Digital Accelerometer Platform
- Single, dual or three axis acceleration measurement
- SPI digital interface
- 3.3V supply voltage
- Enhanced self diagnostics features
- Internal temperature sensor
- Size 7.6 x 3.3 x 8.6 mm (w x h x l)
- RoHS compliant Dual Flat Lead (DFL) plastic package suitable for lead free soldering process and SMD mounting
- Package, pin-out and SPI protocol compatible within the product family
- Proven capacitive 3D-MEMS technology
- Qualified according to AEC-Q100 standard Main characteristics of each product within the product family are listed in Table 1 below. Table 1: Digital platform summary Type Measuring directions SCA810 X Single axis Accelerometer SCA820 Z Single axis Accelerometer SCA830 Y Single axis Accelerometer SCA2100 X, Y Dual axis Accelerometer SCA2110 X, Z Dual axis Accelerometer SCA2120 Y, Z Dual axis Accelerometer SCA3100 X, Y, Z Three axis Accelerometer Figure 1: Measurement directions
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1.3 Typical applications
VTI Automotive Digital Accelerometer Platform is targeted to automotive applications with high stability requirements. Typical applications include but are not limited to
- Electronic Stabilit y Control (ESC)
- Hill Start Assist (HSA)
- Electronic Parking Brake (EPB)
- Roll Over
- Active Suspension
- Inclination
- Industrial applications
1.4 Functional Description
Basic product concept of the VTI Automotive Digita l Accelerometer Platform is a two chip solution consisting of a single sensing element and one ASIC inside a pre-molded 12-pin housing. The interface to the application is a four wire digital SPI interface. In single axis products there is also Pulse Width Modulation output available. In additi on to the supply voltage filtering the component does not require any other components to be connected to the device. Block diagram of SCA8X0/SCA21X0/31X0
1.4.1 Sensing element
The sensing element of the product is manufactu red by using VTI Technologies proprietary bulk 3D-mems process enabling a robust, stable and lo w noise capacitive sensor. Depending on the product type and measurement direction the s ensing element type and orientation inside the housing can vary. Single axis products are equipp ed with single axis sensing elements and multi axis products are equipped with multi axis sensing elements.
1.4.2 Interface IC
The main functional blocks of the interface ASIC are the following:
1.4.3 Capacitance to voltage conversion
The acceleration is causing a capacitance change inside the sensing element. The capacitance change can be detected by the ASIC analog interface. The capacitance information is converted into an analog voltage that can be further processed easily inside the ASIC.
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1.4.4 Analog to digital conversion
Analog voltage information is amplified and filtered and converted into digital information for signal processing inside the ASIC.
1.4.5 Signal conditioning and filtering
The block filters and conditions the measurement information needed for the application
1.4.6 Temperature measurement
The accelerometers contain a temperature sensor for temperature compensation purposes and for use in the application.
1.4.7 Memory
Factory programmed calibration values are stored in a non-volatile memory
1.4.8 SPI
SPI interface is a simple four wire interface for communication between the component and the application micro controller.
1.4.9 Self diagnostics
The VTI Automotive Digital Platform contains several enhanced diagnostics features to allow timely and robust failure detection.
1.4.10 Power supply interface
The products are equipped with separate power and ground pins for analog and digital functionality to allow high accuracy measurement.
1.4.11 Factory calibration
VTI Automotive Digital Platform ac celerometers are factory calibrat ed. No separate calibration is required in the application. Trimmed parameters dur ing production include sensitivity, offset and frequency response. Calibration parameters are stored during the manufacturing of the part inside a non-volatile memory. The parameters are read automatically from the internal non-volatile memory during the startup of the sensor after power on.
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2 Operation Modes
2.1 Measurement mode
After the startup the acceleration data is immediat ely available through the SPI registers. There is no need to initialize the accelerometer before star ting to use of it. If the application is requiring monitoring of the correctness of the operation th ere are several options available to monitor the operation status.
2.2 Temperature output
The devices include a temperature measurement function. Temperature data can be read through the SPI interface. Temperature measurement is not calibrated for absolute accuracy. If absolute accuracy is needed, it can be achieved throug h measuring the temperature value in two temperature points in final application and storing them as a calibration value and calculating the absolute temperature value by using the two points.
2.3 Self-diagnostic functions
VTI Automotive Digital Accelerometer Platform has a set of built-in self-diagnostic functions to support the application fail safety. The diagnostic functions cover the accelerometer sensing element functionality, accelerometer internal operation and signal path functionality
2.3.1 Memory self-diagnostic
Factory calibrated values of the accelerometer ar e stored in a non-volatile memory. The calibrated values are read during the device power on into vola tile registers that cont rol the operation of the device. During the startup of the device the calculated sum of non-volatile registers is compared to the factory calibrated value. The test is done automatically after supplies are set on, after any reset state of component and after return from power-do wn mode. Test can also be started by a CTRL- register command.
2.3.2 Signal path self-diagnostic
2.3.2.1 SCA8X0 – singl e axis accelerometers
Sensor element and signal path is tested by deflect ing the proof mass of the sensing element to both directions over a predefined dynamic range. The test is done automatically during start-up and it can be repeated by a CTRL-register command. The result of the test is a momentary mass deflection seen in the output of the device. During the test the accelerometer performs a comparison of the deflection result to a pre- defined threshold value. When the needed dynamics have been detected the device will re turn the result of a passed test in a register. By following the output of the device on SPI interface it is possible to detect failures through the signal path.
2.3.2.2 SCA21X0 and SCA31X 0 – multi axis accelerometers
2.3.2.2.1 Start-up Self Test (STS)
During the application start up or when the accelerome ter is affected by the gravity force only it is possible to detect possible sensing element anomalies by applying a start up self test. The test is done in a following way: a digitally calculated resultan t acceleration of x, y and z-axis is compared to predefined threshold value. Test is started by CTRL-register command and it is done once when requested.
2.3.2.2.2 Continuous Self Test (STC)
During device operation the continuous self test is monitoring the sensing element performance. Digitally calculated self-diagnostic function is co mpared to predefined threshold value. Test is started by CTRL-register command and it is ca lculated continuously on background until disabled. Possible errors are indicated in an error status register and in SPI frame.
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2.4 Power Down mode
For low power applications it is possible to se t the accelerometer into power down mode. During the power down mode the power consumption is mi nimized inside the device. This is achieved by stopping the internal clocks and resetting the control registers of the device. Please refer to the individual device data sheets for detail power consumption figures.
2.5 Recommended start-up sequence
For correct device operation there are no spec ific configuration needed for the device before starting of measuring the acceleration. However if the device detail features are being used the following operations could be made after the powering on the device. Table 2: SCA8X0 start up sequence Item Procedure Functions Check power on to release part from reset and to start the operation
2 Wait 95ms • During the
diagnostics.
- Possible signal path self- diagnostic test is carried out.
- Settling of signal path
3 Read CTRL-register • Check the
- CTRL.ST=0
- SPI fixed bits
- dPAR, data parity
4 Read STATUS-register • Check the
- STATUS.CSMERR=0
- SPI fixed bits
- SPI FRME=0
- dPAR, data parity
5 Write CTRL=0000 0000 • After device
PORST=0 to be able to detect any future occurring power failures
- SPI fixed bits
- SPI FRME=0
6 Read X_MSB, X_LSB –
- Start reading the acceleration data
- SPI fixed bits
- SPI FRME=0
- SPI PORST=0
- dPAR, data parity
www.vti.fi Doc. Nr. 82 694 00 C Table 3: SCA21X0 and SCA31X0 start up sequence Item Procedure Functions Check reset
2 Wait 35ms • Memory reading
- Settling of signal path
3 Read INT_STATUS • Acknowledge for
(SAT-bit)
- Checksum pass detected from SPI frame
- SPI fixed bits
- SPI ST=0
4 Write
CTRL=00001010 (a) or CTRL=00001000 (b) or CTRL=00000000 (c)
- Set PORST=0 (abc)
- Start STC (ab)
- Start STS (a)
- SPI fixed bits
- SPI FRME=0
- SPI ST=0
- SPI SAT=0
5 Wait 10ms STS calculation -
6 Read CTRL • Check that STC is
on, if enabled
- Check that STS is over if enabled
- CTRL.ST=1
- CTRL.ST_CFG=0
- SPI fixed bits
- SPI FRME=0
- SPI PORST=0
- SPI ST=0
- SPI SAT=0
- dPAR, data parity
7 Read Z_MSB, Z_LSB,
Y_MSB, Y_LSB, X_MSB, X_LSB Read acceleration data • SPI fixed bits
- SPI FRME=0
- SPI PORST=0
- SPI ST=0
- SPI SAT=0
- dPAR, data parity
2.6 Recommended operation sequence
Table 4: Reading of the acceleration data Item Procedure Functions Check
1 Read acceleration data Desired x, y,
- SPI fixed bits
- SPI FRME=0
- SPI PORST=0
- SPI ST=0
- SPI SAT=0
- dPAR, data parity
2 Repeat item 1 (N-1) times Noise
3 Calculate average (AVE) of
4 Read acceleration data Desired x, y,
(one read before sending
- SPI fixed bits
- SPI FRME=0
- SPI PORST=0
www.vti.fi Doc. Nr. 82 694 00 C Item Procedure Functions Check AVE forward to check SPI failure bits)
- SPI ST=0
- SPI SAT=0
- dPAR, data parity
5 Send calculated AVE forward - -
6 Jump back to item 2 - -
For detailed SPI failure bit informat ion see chapter 4.2 Error Conditioning
2.7 Recommended procedures or optional features
Product family components have different features, which are not required during normal operation. However, they are recommended in some case s if they are seen im portant from system perspective.
2.7.1 SCA8x0/SCA21x0/SCA31x0
2.7.1.1 Read back procedure
It is recommended to read back every write command to compare read data to the write command. This way it is detected very unlikely failures in MCU, in SPI wiring, in SPI interface, in system clock or inside state machine.
2.7.1.2 Checksum during operation
Checksum is calculated for component register values that control the operation of product. Data is read from non-volatile memory to these regist ers during start-up and ch ecksum is calculated automatically. It is possible to repeat checksum calculation during normal operation by CTRL register command and test result can be seen from STATUS register (see more info in 3.2.1 and 3.1.6). In multi-axis products test result can be seen also from SPI fram e. By repeating checksum during normal operation, it is possible to detect very unlikely intermittent or static bit failures in register map.
2.7.1.3 Saturated data
Output data saturates to predefined value if product dynamic range is exceeded. If output data has been saturated it should be considered invalid a nd it should not be used for system controlling. Output data saturation can also be indication of some very unlike component failure.
2.7.1.4 Noiseless output
Valid acceleration output includes always some noise. If output data is constant, it can be indication of system error and data is not valid anymore. Therefore it is useful to monitor noise or deviation of output data.
2.7.1.5 Component ID
Each product family component type has unique id entification number, which is stored to non- volatile memory (see 3.3.2). This number can be used for example in production line to check that correct component is mounted to the system. In some cases it may be used for MCU software controlling.
2.7.2 SCA8x0
2.7.2.1 Mass deflection during operation
Mass deflection self-test is performed automatically to both direction in start-up. Mass deflection can be performed during operation if requested by us er. Test is started and direction is controlled
www.vti.fi Doc. Nr. 82 694 00 C by CTRL register (see more info in 3.2.1). Note that acceleration output data is not valid during test and after test is started to one direction there has to be 50ms wait time before output data is used.
2.7.2.2 Monitor acceleration data during mass deflection
Acceleration data can be read out from accelerati on output registers during mass deflection self- test in start-up or during operation, in case that test is repeated by the request. Monitoring this data it is possible to determine product frequency response and check product timing properties.
3 Addressing Space
Table 5 presents the registers of SCA8X0, SCA21X0 and SCA31X0 products. Table 5: Register address space Addr hex Name Description Mode (R/RW)
00 REVID ASIC revision ID number R
01 CTRL Control RW
02 STATUS Status R
03 RESET Reset component RW
04 X_LSB X-axis (or Y- or Z-axis in SCA8X0) LSB frame R
05 X_MSB X-axis (or Y- or Z-axis in SCA8X0) MSB frame R
06 Y_LSB Y-axis LSB frame in multi-axis components R
07 Y_MSB Y-axis MSB frame in multi-axis components R
08 Z_LSB Z-axis LSB frame in multi-axis components R
09 Z_MSB Z-axis MSB frame in multi-axis components R
... Reserved -
11 Reserved -
12 TEMP_LSB Temperature LSB frame R
13 TEMP_MSB Temperature MSB frame R
14 Reserved -
15 Reserved -
16 INT_STATUS Interrupt status register in multi-axis components R
17 Reserved -
... Reserved -
26 Reserved -
27 ID Component ID RW
28 Reserved -
... Reserved - 3F Reserved -
3.1 Output registers
3.1.1 X axis acceleration output
3.1.1.1 X_LSB
Address: 4h Bits Mode Initial Value Name
Description
7:0 R 00h DATA X-axis LSB frame (or Y-axis or Z-axis in SCA8X0) Read always X_MSB prior to X_LSB.
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3.1.1.2 X_MSB
Address: 5h Bits Mode Initial Value Name 7:0 R 00h DATA X-axis MSB frame (or Y-axis or Z-axis in SCA8X0) Reading of this register latches X_LSB.
3.1.2 Y axis acceleration output
3.1.2.1 Y_LSB
Address: 6h Bits Mode Initial Value Name 7:0 R 00h DATA Y-axis LSB frame Read always Y_MSB prior to Y_LSB.
3.1.2.2 Y_MSB
Address: 7h Bits Mode Initial Value Name 7:0 R 00h DATA Y-axis MSB frame Reading of this register latches Y_LSB.
3.1.3 Z axis acceleration output
3.1.3.1 Z_LSB
Address: 8h Bits Mode Initial Value Name 7:0 R 00h DATA Z-axis LSB frame Read always Z_MSB prior to Z_LSB.
3.1.3.2 Z_MSB
Address: 9h Bits Mode Initial Value Name 7:0 R 00h DATA Z-axis MSB frame Reading of this register latches Z_LSB. The bit level description of acceleration data from X_LSB ... Z_MSB register s is presented below (Note that the available axis combination of xyz depends on product type). The acceleration data is presented in 2's complement format. At 0 g acceleration the output is ideally 0000h.
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3.1.4 Output data conversion
3.1.4.1 2g products +/-2g product DOUT MSB bits(7:0) DOUT LSB bits(7:0) 12b 12b Bit number 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 [-] Bits (15:4) Bits (15:4) +1g position 0 0 1 1 1 0 0 0 0 1 0 0 x x x x 1000 900 384 -1g position 1 1 0 0 0 1 1 1 1 1 0 0 x x x x -1000 -900 C7C +Full-scale 0 1 1 1 1 1 1 1 1 1 1 1 x x x x 2274 2047 7FF -Full-scale 1 0 0 0 0 0 0 0 0 0 0 0 x x x x -2275 -2048 800 +/-2g product DOUT MSB bits(7:0) DOUT LSB bits(7:0) Bit number 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 [-] Bits (15:2) Bits (15:2) +1g position 0 0 0 0 1 1 1 0 0 0 0 1 0 0 x x 1000 900 384 -1g position 1 1 1 1 0 0 0 1 1 1 1 1 0 0 x x -1000 -900 3C7C +Full-scale *) 0 0 0 1 1 1 1 1 1 1 1 1 1 1 x x 2274 2047 7FF -Full-scale *) 1 1 1 0 0 0 0 0 0 0 0 0 0 0 x x -2275 -2048 3800 s = sign bit x = not used/defined bit *) = positive/negative full-scale or saturation limit of ±2 g product is 2.27 g. In SCA8X0 acceleration bits can be converted to mg acceleration (Acc) using following equation [] [ ]4252627282921021121221321429 and in SCA21X0/SCA31X0 223242526272829 2102112122132142 234567 8910111213 bbbbbbbb bbbbbsmgAcc , where bits are defined according to following table. Acceleration MSB-register: Address 5'hex / 7'hex / 9'hex A cceleration LSB-register: Address 4'hex / 6'hex / 8'hex DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0 DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0 b 1 5 b 1 4 b 1 3 b 1 2 b 1 1 b 1 0 b 9b 8b 7b 6b 5b 4b 3b 2b 1b 0 In data output registers of SCA21X 0/SCA31X0 there is reserved room for different g-ranges. To make sure that same software works with different product types it is recommended to use bits(15:2) for data conversion. If dynamic output range of product doe s not require bits b14 or b13 they include copy of sign bit b15. If self-test (checksum, STC, STS) alarms it sets ST bit in SPI frame and forces output data to value 7FFF'hex (checksum fail) or to value FFFF'hex (STC/STS alarm). In SCA21X0/SCA31X0 there is also possible to us e 1-extra lsb bit (b1) for calculation to improve resolution. In that case acceleration bits can be converted to mg acceleration (Acc) using following equation 122232425262728 292102112122132142 234567 891011121314 bbbbbbbb bbbbbbsmgAcc .
www.vti.fi Doc. Nr. 82 694 00 C 3.1.4.2 6 g products +/-6g product DOUT MSB bits(7:0) DOUT LSB bits(7:0) 12b 12b Bit number 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 [-] Bits (15:4) Bits (15:4) +1g position 0 0 0 1 0 1 0 0 0 1 0 1 x x x x 1000 325 145 -1g position 1 1 1 0 1 0 1 1 1 0 1 1 x x x x -1000 -325 EBB +Full-scale 0 1 1 1 1 1 1 1 1 1 1 1 x x x x 6300 2047 7FF -Full-scale 1 0 0 0 0 0 0 0 0 0 0 0 x x x x -6302 -2048 800 +/-6g product DOUT MSB bits(7:0) DOUT LSB bits(7:0) Bit number 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 [-] Bits (15:2) Bits (15:2) +1g position 0 0 0 0 1 0 1 0 0 0 1 0 1 0 x x 1000 650 28A -1g position 1 1 1 1 0 1 0 1 1 1 0 1 1 0 x x -1000 -650 3D76 +Full-scale *) 0 0 1 1 1 1 1 1 1 1 1 1 1 1 x x 6300 4095 FFF -Full-scale *) 1 1 0 0 0 0 0 0 0 0 0 0 0 0 x x -6302 -4096 3000 s = sign bit x = not used/defined bit *) = positive/negative full-scale or saturation limit of ±6 g product is 6.3 g. In SCA8X0 acceleration bits can be converted to mg acceleration (Acc) using following equation [] [ ]425262728292102112122132142325 1000 234567891011 bbbbbbbbbbbsmgAcc +⋅+⋅+⋅+⋅+⋅+⋅+⋅+⋅+⋅+⋅+⋅−= and in SCA21X0/SCA31X0 223242526272829 2102112122132142 650 1000 234567 8910111213 bbbbbbbb bbbbbsmgAcc , 3.1.4.3 1 g products +/-1g product DOUT MSB bits(7:0) DOUT LSB bits(7:0) 16b Bit number 15 14 13 12 11 10 9 8 7 6 5 4 3 210 [ - ] B i t s ( 1 5 : 0 ) SCA8xx s 512,0 256,0 128,0 64,0 32,0 16,0 8,0 4,00 2,00 1,00 0,50 0,25 0,13 0,06 0,03 [mg] [Dec] + 1 g p o s i t i o n 0 1 1 1 1 1 0 10 0 0 0 0000 1 0 0 0 3 2 0 0 0 - 1 g p o s i t i o n 1 0 0 0 0 0 1 10 0 0 0 0000 - 1 0 0 0 - 3 2 0 0 0 + F u l l - s c a l e 0 1 1 1 1 1 1 11 1 1 1 1111 1 0 2 3 3 2 7 6 7 - F u l l - s c a l e 1 0 0 0 0 0 0 00 0 0 0 0000 - 1 0 2 4 - 3 2 7 6 8 s = sign bit Acceleration bits can be converted to mg acceleration (Acc) using following equation +⋅+⋅+ 02122 232425262728292102112122132142 4456789101112131415 bbb bbbbbbbbbbbbsmgAcc
3.1.5 Temperature output
3.1.5.1 Temperature Register Low (TEMP_LSB)
Address: 12h Bits Mode Initial Value Name 7:0 R 00h DATA Data bits [7:0] of temperature sensor. Read always TEMP_MSB prior to TEMP_LSB.
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3.1.5.2 Temperature Register High (TEMP_MSB)
Address: 13h Bits Mode Initial Value Name 7:0 R 00h DATA Data bits [15:8] of temperature sensor. Reading of this register latches TEMP_LSB. The bit level description of temperature data: In SCA8X0 temperature data is not factory ca librated and hence sensitivity and offset of temperature data varies from part to part. Temper ature data is in 2's complement format and 14 bits (13:0) of TEMP_MSB/TEMP_LSB are used fo r temperature. Here is presented temperature calculation using 10bit but 4-extra LSB bit can be used to improve resolution in noise sense if needed. Table 6 Bit level description for SCA8X0 temperature registers Register TEMP_MSB TEMP_LSB Bit number Bit temperature weight [°C] B7:B6 xx sign ~82 ~41 ~21 ~10 ~5.1 ~2.6 ~1.3 ~0.6 ~0.3 B3:B0 rrrr Bit in temperature register xx t9 t8 t7 t6 T5 t4 t3 t2 t1 t0 rrrr x = not used bit r=reserved [] () C LSBk TempCCTemp o dec+°±=° 3245 , where Temp[°C] is temperature in Celsius and Temp dec is temperature from TEMP_MSB and TEMP_LSB registers in decimal format, bits(t9:0). k is temperature slope factor specified as Min Typ Max Unit k 2.8 3.1 3.5 LSB/ oC In SCA21X0 and SCA31X0 offset of temperature data is factory calibrated but sensitivity of the temperature data varies from part to part. Temp erature data is in unsigned format and 13 bits (13:1) of TEMP_MSB/TEMP_LSB are used for te mperature. Here is presented temperature calculation using 10bit but 3-extra LSB bit can be used to improve resolution in noise sense if needed. Table 7 Bit level description for SCA21X0/31X0 temperature registers Register TEMP_MSB TEMP_LSB Bit number Bit temperature weight [°C] B7:B6 xx ~162 ~81 ~41 ~20 ~10 ~5.1 ~2.5 ~1.3 ~0.6 ~0.3 B3:B0 rrrx Bit in temperature register xx t9 t8 t7 T6 T5 t4 t3 t2 t1 t0 rrrx x = not used bit r=reserved Temperature registers’ typical output at +23 °C is 512 counts and 1 °C change in temperature typically corresponds to 3.2 LSB change in temperature output. Temperature information is converted to [°C] as follows
www.vti.fi Doc. Nr. 82 694 00 C [] () C LSBk LSBTempCCTemp dec −+°±=° 5121023 , where Temp[°C] is temperature in Celsius and Temp dec is temperature from TEMP_MSB and TEMP_LSB registers in decimal format, bits(t9:0). k is temperature slope factor specified as Min Typ Max Unit k 2.8 3.2 3.6 LSB/ oC
3.1.6 Status Register (STATUS)
Address: 2h Bits Mode Initial Value Name 7:3 - - Reserved
2 R 0 ATEST Analog test mode status
1 – Test mode is active 0 – Test mode is not active 1 R 0 CSMERR EEPROM Checksum Error. In SCA21X0/SCA31X0 ST bit of SPI frame is also set if CSMERR is set. 0 R 0 FRME SPI frame error. Bit is reset, when next correct SPI frame is received. Bit is also visible in SPI frame.
3.1.7 Interrupt Status Register (INT_STATUS)
Address: 16h Bits Mode Initial Value Name
7 R 0 Reserved
6 R 0 SAT Saturation status of output data
1 – Over range detected, one or 2-3 of xyz axis is saturated and output data is not valid. 0 – Data in range SAT bit is also visible in SPI frame. This bit can be active after start-up or reset stage before signal path settles to final value and it has to be acknowledged in start-up sequence (see Table 3) or after SW reset or after PORST stage.
5 R 0 STS Status of gravitat ion based start-up self test
1 – Failure 0 – No failure STS sets also ST bit in SPI frame.
4 R 0 STC Status of continuous self test
1 – Failure 0 – No failure STC sets also ST bit in SPI frame. 3:0 R 0000 Reserved The bits in this interrupt status register and corr esponding SPI frame bits are cleared after register has been read. Register reading is treated as interrupt acknowledgement signal. These bits are kept active even failure condition is over if they are not acknowledged. This register is not defined in SCA8X0.
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3.2 Operation control registers
3.2.1 Control Register (CTRL)
Address: 1h Bits Mode Initial Value Name
7 RW 0 Reserved
6 RW 0 PORST 1 means reset state. Bit gets set to 1 when the digital gets reset by supply off control or under voltage control. Bit is set after supply off/on transition or startup. This bit can not be set by SPI but it can be reset to 0 by writing a 0 over the SPI. This bit is also sent as Bit3 of SPI output data frame on MISO.
5 RW 0 PDOW Set chip to power down mode
4 RW 0 SLEEP Set chip to sleep mode. This bit can not be set to 1 if PDOW is already 1 or if PDOW is being set by the current SPI command. (bit is not used in SCA8X0) 3 RW 0 ST Set chip to self-test mode. SCA8X0: This bit starts mass deflection self-test (see also ST_CFG bit). This bit is set to 0, when test is passed. This bit can not be set to 1 if PDOW is already 1 or if PDOW is being set by the current SPI command. Test is done automatically during start-up and acceleration output data can be read during test. SCA21X0 and SCA31X0: Start continuous self-test calculation (STC). This bit can not be set to 1 if PDOW or SLEEP or MTST is already 1 or if PDOW or SLEEP or MTST is being set by the current SPI command. Use INT_STATUS.STC and ST bit of SPI frame for test result monitoring.
2 RW 0 MST Memory self-test function is activated, when user
sets bit to ‘1’. This bit is reset to 0 when test is over. During memory self test, SPI access is prevented for 85us. This bit can not be set to 1 if PDOW or SLEEP is already 1 or if PDOW or SLEEP is being set by the current SPI command. Test is done automatically during start-up. Set other bits to zero in CTRL register by previous SPI command before starting memory self-test by CTRL.MST command. Use STATUS.CSMERR for test result monitoring and in SCA21X0/SCA31X0 ST bit in SPI frame. 1 RW 0 ST_CFG Self-test configuration. SCA8X0: Select direction of mass deflection. SCA21X0 and SCA31X0: Start gravitation based start-up self-test calculation (STS). This bit can not be set to 1 if PDOW or SLEEP or MTST is already 1 or if PDOW or SLEEP or MTST is being set by the current SPI command. STC and
www.vti.fi Doc. Nr. 82 694 00 C Bits Mode Initial Value Name STS have same priority and they can be set and used simultaneously. This bit is set to 0 when test is over. Use INT_STATUS.STS and ST bit of SPI frame for test result monitoring.
0 RW 0 MISO 0 = Set MISO line to normal state (= High
impedance state between SPI transfers, data out state during transfers) 1 = Set MISO like to a continuous high impedance state (same write command to multiple slaves, which share MISO line).
3.2.2 Reset Register (RESET)
Address: 3h Bits Mode Initial Value Name 7:0 RW 00h RST Writing 0C'hex, 05'hex, 0F'hex in this order resets component.
3.3 Identification registers
3.3.1 Revision ID (REVID)
Address: 0h Bits Mode Initial Value Name 7:0 R 23h 1) 22h 2) REVID ASIC revision identification number, each ASIC version has different REVID-number. 1) SCA8X0 2) SCA21X0/SCA31X0
3.3.2 Component ID (ID)
Address: 27h Bits Mode Initial Value Name 7:0 RW ID Component identification number (write operation by user is possible to this register but not to non-volatile memory) The ID register contains information about the product version and value is loaded from non- volatile memory. Each VTI Automotive Digital Accelerometer Platform product will have a unique identification number. Single axis products can be differentiated from mult i axis products through this register. SCA8X0: MSB = 0 SCA21X0: MSB = 1 SCA31X0: MSB = 1 Please refer to the product data sheet for correct ID number.
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4 SPI Interface
Serial peripheral interface (SPI) is a 4-wire sy nchronous serial interface. Data communication is enabled with active low Slave Select or Chip Sele ct wire (CSB). Data is transmitted via 3-wire interface consisting of serial data input (MOSI), serial data output (MISO) and serial clock (SCK). Every SPI system consists of one master and one or more slaves, where the master is defined as the microcomputer that provides the SPI clock, and th e slave is any integrated circuit that receives the SPI clock from the master. MOSI MISO SCK CSB DATA OUT (MOSI) DATA IN (MISO) SERIAL CLK (SCK) CSB0 CSB1 CSB2 CSB3 MOSI MISO SCK CSB MOSI MISO SCK CSB MOSI MISO SCK CSB MASTER MICROCONTROLLER SLAVE Figure 2: Typical SPI connection The SPI interface of VTI automotive series is designed to support almost any micro controller that uses software implemented SPI. However it is not designed to support any particular hardware implemented SPI found in many commercial micro controllers. SCA8X0/SCA21X0/SCA31X0 accelerometer operates always as a slave device in the master-slave operation mode. The data transfer between the master ( µP test machine etc.) and accelerometer is performed serially with four wire system. MOSI master out slave in µP → ASIC MISO master in slave out ASIC → µP SCK serial clock µP → ASIC CSB chip select (low active) µP → ASIC Each transmission starts with a falling edge on CSB and ends with the rising edge. During the transmission, commands and data are controlled by SCK and CSB according to the following rules:
- commands and data are shifted MSB first LSB last
- each output data/status-bits are shifted out on the falling edge of SCK (MISO line)
- each bit is sampled on the rising edge of SCK (MOSI line) SPI communication transfers data betwe en SPI master and registers of the SCA8X0/SCA21X0/SCA31X0. Registers can be read and write. SPI communication is full duplex communication. Data is send and received simultaneously.
www.vti.fi Doc. Nr. 82 694 00 C SPI frame format and transfer protocol is presented in Figure 3. Figure 3: SPI frame format
- MOSI
- A5:A0 Register address
- RB/W Read/Write selection, '0'=read
- aPAR Odd parity for bits A5:A0, RB/W
- DI7:DI0 Input data for data write
- MISO
- Bit 1 not defined bit
- FRME Frame error indication (previous frame)
- Bit 3-5 status bits
- PORST Power On Reset Status
- ST Self Test error, not defined in SCA8X0
- SAT Output SATuration indicator, not defined in SCA8X0
- Bit 6 always ‘0’, fixed bit
- Bit 7 always ‘1’, fixed bit
- dPAR Odd parity for output data (DO7:DO0)
- DO7:DO0 Output data Each communication frame contains 16 bits. Please see Figure 3 for SPI bit definition. The first 8 bits in MOSI line contains info about the opera tion (read/write) and the register address being accessed. First 6 bits define 6 bit address for selected operation, which is defined by bit 7 (‘0’ = read ‘1’ = write), which is followed by odd parity bit (aPAR) for 8 bit pattern. The later 8 bits in MOSI line contain data for a write operation and are ignored in case of read operation. The first bits in MISO line are frame error bit (F RME, bit2) of previous frame, reset status bit (PORST, bit3), self-test status bit (ST, bit4), satura tion status (SAT, bit5), fixed zero bit (bit6), fixed one bit (bit7) and odd parity bit of output data (dPAR, bi t8)). Parity is calculated from data, which is currently sent. The later 8 bits contain data for a read operation. During t he write operation, these data bits are previous data bits of addressed register. For write commands, data is written into the add ressed register on the rising edge of CSB. If the command frame is invalid, data will not be written into the register. The output register is shifted out MSB first over MISO output. Attempt to read a reserved register outputs data of 00h. When CSB is high state between data transfers, MISO line is in high-impedance state. If bit CTRL.SDODIS is set to ‘1’, MISO line is always in high-impedance state. In multi-chip SPI bus master can send data to all slave chips simultaneously.
4.1 Output of Acceleration Data
16-bit data is sent in 8-bit data bytes during two frames. Each frame contains odd parity bit of data bits. Number format of acceleration data is two’s complement number.
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4.1.1 Register read operation
An example of X-axis acceleration read command is presented in Figure 4. Master gives the register address to be read via MOSI line: '05' in hex format and '000101' in binary format, register name is X_MSB (X-axis MSB frame). 7 th bit is set to '0' to indicate the read operation and 8th bit is 1 for odd parity. The sensor replies to asked operation by transf erring the register content via MISO line. After transferring the asked X_MSB register content, mast er gives next register address to be read: '04' in hex format and '000100' in binary format, register name is X_LSB (X-axis LSB frame). The sensor replies to asked operation by transferring the register content MSB first. Figure 4: Example of 16 bit acceleration data transfer from registers DOUT2-1 (05h,04h). DO15…DO0 bits are acceleration data bits (DO15= MSB) and parity (dPAR) is odd parity of register of 8 data bits. FRME is possible frame error bit of previous frame, PORST is reset bit, ST is self- test status bit and SAT is output saturation status bit.
4.1.2 Decremented register read operation
In Figure 5 is presented a decremented read operation where the content of four output registers is read by one SPI frame. After normal register addressing and one register content reading the µC keeps CSB line low and continues supplying the SCK pulses. After every 8 SCK pulses the output data address is decremented by one and the previous DOUT register's content is shifted out without parity bits. Parity bit is calculated and transferred only for the first data frame. From X_LSB register address the SCA21X0/SCA31X0 jumps to Z_MSB. Decremented reading is possible only for registers X_LSB ... Z_MSB in SCA21X0 and SCA31X0 series. Decremented read is not recommended in fail-safe critical applications because output data parity is only available for first 8bit data. Figure 5: An example of decremented read operation.
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4.1.3 MOSI data of SPI commands
Table 8: MOSI data during SPI read command Register to be read Function MOSI (15:0) [bits] MOSI [hex] REVID Read ASIC revision ID 000000 01 xxxxxxxx 01xx CTRL Read CTRL register 000001 00 xxxxxxxx 04xx STATUS Read Status register 000010 00 xxxxxxxx 08xx X_LSB Read acceleration on X-axis, LSB 000100 00 xxxxxxxx 10xx X_MSB Read acceleration on X-axis, MSB 000101 01 xxxxxxxx 15xx Y_LSB Read acceleration on Y-axis, LSB 000110 01 xxxxxxxx 19xx Y_MSB Read acceleration on Y-axis, MSB 000111 00 xxxxxxxx 1Cxx Z_LSB Read acceleration on Z-axis, LSB 001000 00 xxxxxxxx 20xx Z_MSB Read acceleration on Z-axis, MSB 001001 01 xxxxxxxx 25xx TEMP_LSB Read temperature, LSB 010010 01 xxxxxxxx 49xx TEMP_MSB Read temperature, MSB 010011 00 xxxxxxxx 4Cxx INT_STATUS Read INT_STATUS register 010110 00 xxxxxxxx 58xx ID Read product ID number 100111 01 xxxxxxxx 9Dxx Table 9: MOSI data during write command Register to be written Function MOSI (15:0) [bits] MOSI [hex] RESET Reset component (data C'hex ) 000011 10 00001100 0E0C RESET Reset component (data 5'hex ) 000011 10 00000101 0E05 RESET Reset component (data F'hex ) 000011 10 00001111 0E0F CTRL Set PORST to zero 000001 11 00000000 0700 CTRL Set chip to power down mode 000001 11 00100000 0720 CTRL Start self-diagnostic 000001 11 00001000 0708 CTRL Start memory self-test 000001 11 00000100 0704
4.2 Error Conditioning
4.2.1 FRME-bit
While sending a frame, if CSB is raised to 1 before sending 16 SCKs, the frame is considered invalid. In SCA8X0 the frame erro r is raised if number of SCK pulses is not 16. In SCA21X0/3100 the frame error is raised only if number of SCK pul ses is not divisible by 8 to support decremented mode reading. When an invalid frame is receiv ed, the last command is simply ignored and the register contents are left unchanged. Status bit STATUS.FRME is set to indicate this error condition. During next SPI frame error bit send out as bit number 2. Bit STATUS.FRME will be reseted, if correct frame is received.
4.2.2 PORST-bit
PORST length is 1bit in SPI frame. PORST bit is se t if chip is reseted (HW reset by POR or supply on/off) or under-voltage is detected. PORST bit is also set after power-up because chip has been in reset state. PORST can be set to zero (reseted) by writing CTRL.PORST =0. Software (SW) reset does not set PORST. When CTRL.PORST bit is written to 0 via SPI, ther e is 300ns delay before register value is set to zero.
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4.2.3 ST-bit (SCA21X0 / 3100)
Self-test frame status (ST) is set if STC or STS is alarmed or checksum is not passed.
- CASE 1: Checksum fails and ST-frame bit is set 1. ST is set back to zero when (and only if) new checksum calculation is passed.
- CASE 2: ST-frame bit is set because STC or ST S is alarmed. In this case ST-frame bit can be cleared by INT_STATUS register reading. ST bit is not defined in SCA8X0 series.
4.2.4 SAT-bit (SCA21X0 / 3100)
Saturation status (SAT) is set if any of axis xyz is saturated and it can be cleared by INT_STATUS register reading. This bit is kept active even failure condition is over if it is not acknowledged. Saturation limit varies between different product types. For example:
- SCA2100 2 g product: x and y channel saturates to 2.27 g and SAT bit in SPI frame and in INT_STATUS register is set, if 2.27 g is exce eded. Additional to this, if acceleration to z- direction exceeds 4.54 g, SAT bit in SPI frame and in INT_STATUS register is set. In all cases INT_STATUS register reading is needed for acknowledgement and acceleration output data of any channel is not valid, when bit is active.
- SCA2110 2 g product: x and z channel saturates to 2.27 g and SAT bit in SPI frame and in INT_STATUS register is set, if 2.27 g is exce eded. Additional to this, if acceleration to y- direction exceeds 4.54 g, SAT bit in SPI frame and in INT_STATUS register is set. In all cases INT_STATUS register reading is needed for acknowledgement and acceleration output data of any channel is not valid, when bit is active.
- SCA2120 2 g product: y and z channel saturates to 2.27 g and SAT bit in SPI frame and in INT_STATUS register is set, if 2.27 g is exce eded. Additional to this, if acceleration to x- direction exceeds 4.54 g, SAT bit in SPI frame and in INT_STATUS register is set. In all cases INT_STATUS register reading is needed for acknowledgement and acceleration output data of any channel is not valid, when bit is active. SAT bit is not defined in SCA8X0 series, but output saturates to the calibrated level. For example acceleration output data of SCA8x0 2 g products saturates to 2.27 g. 4.2.5 aPAR-bit (SCA21X0 / 3100) aPAR is odd parity bit of input address+RB/W-bit. Master write it and slave check that bit.
- If there is parity error and RB/W='1', write command is ignored and frame error bit is set to STATUS-register and to SPI frame. Next correct SPI frame will zero this bit.
- If there is parity error and RB/W='0', read command is performed normally and frame error bit is set to STATUS-register and to SPI frame. Next correct SPI frame will zero this bit. aPAR bit is not checked in SCA8X0 series. Table 10: Address parity Address Notes A5 A4 A3 A2 A1 A0 RB/W aPAR 0 0 0 0 0 0 0 1 correct frame 1 1 1 1 1 1 1 0 correct frame 1 0 1 0 1 0 1 1 correct frame 0 1 0 1 0 1 0 0 correct frame
www.vti.fi Doc. Nr. 82 694 00 C 4.2.6 dPAR-bit dPAR bit is odd parity bit of 8bit data that is curr ently sent in the frame. Master checks this bit and compares to received data. Using dPAR at l east one bit errors in data transmission can be detected.
4.2.7 Fixed bits
Bits 6 and 7 are always fixed in MISO line. Bit 6 should always be '0' and bit 7 always '1'
4.2.8 Output data
- Reset stage: When component is in reset or under voltage state, PORST bit in SPI frame and CTRL.PORST bit is set. Furthermore, all register values are set to 00'hex. 2. Saturation: When acceleration exceeds measur ement range, the output data is saturated to specified positive or negative full-scale. 3. Self-diagnostic failure: In SCA21X0 and 31X0 the ST bit in SPI frame is set when memory diagnostic or signal path diagnostic functions fail. Furthermore acceleration output data is forced to 7FFF'hex if memory diagnostic fails or to FFFF'hex if signal path diagnostic functions (STC/STS) fail.
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5 Electrical Characteristics
All voltages are referenced to ground. Currents flowing into the circuit have positive values.
5.1 Absolute maximum ratings
The absolute maximum ratings of Digital Family are presented in Table 11 below. Table 11: Absolute maximum ratings Parameter Value Unit Supply voltage (Vdd) -0.3 to +3.6 V Voltage at input / output pins -0.3 to (Vdd + 0.3) V ESD (Human body model) ±2 kV Storage temperature -40 ... +125 °C Operating temperature -40 ... +125 °C Ultrasonic cleaning Not allowed
5.2 Power Supply
5.3 Digital I/O Specification
5.3.1 DC Characteristics
Supply voltage is 3.3 V unless otherwise noted. Current flowing into the circuit has positive values. Parameter Conditions Symbol Min Typ Max Unit Input terminal CSB
1 Pull up current V IN = 0 V I PU 10 50 µA
2 Input high voltage DVDD = 3.3 V VIH 2 DVDD V 3 Input low voltage DVDD = 3.3 V V IL 0.8 V 4 Hysteresis DVDD = 3.3 V VHYST 0.18 V Input terminal MOSI, SCK 5 Pull down current V IN = 3.3 V I PD 10 50 µA 6 Input high voltage DVDD = 3.3 V VIH 2 DVDD V 7 Input low voltage DVDD = 3.3 V V IL 0.8 V 8 Hysteresis DVDD = 3.3 V VHYST 0.18 V Output terminal MISO
9 Output high voltage I > -1mA
DVDD = 3.3 V VOH DVDD – 0.5 V 10 Output low voltage I < 1 mA VOL 0.5 V 11 Tri-state leakage 0 < V MISO < 3.3 V I LEAK -3 3 uA
5.3.2 AC Characteristics
Parameter Conditions Symbol Min Typ Max Unit Terminal CSB, SCK
1 Time from CSB (10%) to
SCK (90%)1 T LS1 T per/2 ns
2 Time from SCK (10%) to
CSB (90%)1 TLS2 Tper/2 ns Terminal SCK
3 SCK low time Load capacitance at
MISO < 50 pF tr=rise time tf=fall time TCL 60 T per/2 – (tr+tf)/2 ns
4 SCK high time Load capacitance at
MISO < 50 pF TCH 60 Tper/2 – (tr+tf)/2 ns
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5 SCK Frequency fsck =
8 MHz
Terminal MOSI, SCK
6 Time from changing
MOSI (10%, 90%) to SCK (90%)1. Data setup time T SET T per/4 ns
7 Time from SCK (90%) to
changing MOSI (10%, 90%)1. Data hold time THOL Tper/4 ns Terminal MISO, CSB
8 Time from CSB (10%) to
stable MISO (10%, 90%) Load capacitance at MISO < 50 pF TVAL1 T per/4 ns
9 Time from CSB (90%) to
MISO1. Load capacitance at MISO < 50 pF TLZ Tper/4 ns Terminal MISO, SCK
10 Time from SCK (10%) to
stable MISO (10%, 90%)1. Load capacitance at MISO < 50 pF TVAL2 1.3 x Tper/4 ns Terminal CSB
11 Time between SPI
cycles, CSB at high level (90%) T LH T per ns CSB SCK MOSI MISO TLS1 TCH THOL TSET TVAL1 TVAL2 TLZ TLS2 TLH MSB in MSB out LSB in LSB outDATA out DATA in TCL Figure 6: Timing diagram of SPI communication
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6 Application information
6.1 Package dimensions
The package dimensions are presented in the Figure 7 below (measures in mm with ±0.1 mm tolerance). The part weights < 0.35 g. Figure 7: Package dimensions
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6.2 Output to Angle Conversion
Product output is function of sin and it can be tran sferred to angle using the following equation for conversion: ,arcsin ⎛ −= ySensitivit OffsetOutput gLSB α Where Output LSB is output in g, Offset 0g is offset at 0 g position and sensitivity is sensitivity of product. Nominal sensitivity is determined at datasheet of product and 0 g can be used in Offset0g if not measured after installation. To read output of product refer chapter Output Data Conversion. Angles close to 0° inclination can be estimated quite accurately with straight line conversion but for the best possible accuracy, arcsine conversion is recommended to be used. The following table shows the angle measurement error if straight line conversion is used. Straight line conversion equation: ⎛ −= ySensitivit OffsetOutput gLSB α Where Output LSB is output in g, Offset 0g is offset at 0 g position and sensitivity is sensitivity of product. Tilt angle [°] Straight line conversion error [°] 0 0 1 0.0027 2 0.0058 3 0.0094 4 0.0140 5 0.0198 10 0.0787 15 0.2185 30 1.668
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6.3 Measuring Directions
X [mg] 0 0 0 0 ARCSIN(X) [o] 00 0 0 Y [mg] 0 -707 -1000 -707 ARCSIN(Y) [o] 0- 4 5 - 9 0 - 4 5 Z [mg] 1000 707 0 -707 ARCSIN(Z) [o] 90 45 0 -45 56 7 8 X [mg] 0 0 0 0 ARCSIN(X) [o] 00 0 0 Y [mg] 0 707 1000 707 ARCSIN(Y) [o] 04 5 9 0 4 5 Z [mg] -1000 -707 0 707 ARCSIN(Z) [o] -90 -45 0 45 Measuring direction of Z and Y axis of ADP-product and output in mg and degree 12 3 4 X [mg] 1000 707 0 -707 ARCSIN(X) [o] 90 45 0 -45 Y [mg] 0 -707 -1000 -707 ARCSIN(Y) [o] 0- 4 5 - 9 0 - 4 5 Z [mg] 0 0 0 0 ARCSIN(Z) [o] 00 0 0 56 7 8 X [mg] -1000 -707 0 707 ARCSIN(X) [o] -90 -45 0 45 Y [mg] 0 707 1000 707 ARCSIN(Y) [o] 04 5 9 0 4 5 Z [mg] 0 0 0 0 ARCSIN(Z) [o] 00 0 0 Measuring direction of Z and Y axis of ADP-product and output in mg and degree
6.4 Pin Description
1 Reserved Not used Gnd
2 Reserved PD Factory use Gnd
3 AVSS AI Negative power supply (analog) Gnd
4 AVDD AI Positive power supply (analog) Vdd
5 CSB DI PU Chip select CSB
6 MISO ZO Data output MISO
7 SCK DI PD Serial clock SCK
8 MOSI DI PD Data input MOSI
10 DVDD AI Positive power supply (digital) Vdd
11 DVSS AI Negative power supply (digital) Gnd
12 EGnd AI EMC ground Gnd
6.5 Recommended circuit diagram
Figure 9. Following design rules and recommendations should be considered to achieve maximum
1 Connect (C4) 100 nF (ESR < 1) capacitor between AVDD and AVSS
2 Connect (C5) 100 nF (ESR < 1) capacitor between DVDD and DVSS
3 Use one power supply VDD for AVDD and DVDD (AVDD voltage level has to
4 Connect (C6) 10 µF capacitor between AVDD and AVSS
5 Connect serial resistance (R1) 10 Ω between VDD and AVDD/DVDD
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6 To achieve high EMC DPI performance, add serial inductance (L1) to VDD line
before serial resistance (for example Murata: BLM18HG102S) Figure 9: Recommended circuit diagram
6.6 Recommended PWB layout
Recommended PWB layout for all product family components with SPI interface is shown in Figure 10 and Figure 11. Following design rules and recommendations should be considered: Required:
1 Connect (C4) 100 nF SMD capacito r between AVDD and AVSS right next to
component pins AVDD and AVSS
2 Connect (C5) 100 nF SMD capacitor between DVDD and DVSS right next to
component pins DVDD and DVSS
3 Use separate ground levels AVSS and DVSS unde r and near the component
but connect them together on the PCB, see Figure 10
4 Locate ground plate under component
5 Do not route signals or power supplies under the component on top layer
6 Ensure good ground connec tion of Egnd (pin12) to AVSS
Recommended:
7 Locate digital ground under digital signal lines
8 Do not route digital signals one upon the other for long distance
9 Avoid crossing of AVDD path with digital signal especially between serial
resistance R1 and AVDD pin
10 Do not route digital signals under the component on 2nd layer
C6 10 µF 10 Ω VDD Note 1
www.vti.fi Doc. Nr. 82 694 00 C Recommended PWB pad layout is presented in the Figure 12 below (dimensions in mm). Figure 12: Component pad layout
6.7 Assembly instructions
The Moisture Sensitivity Level (MSL) of the co mponent is 3 according to the IPC/JEDEC J-STD- 020C. Please refer to the document "TN53 Assembly Instructions for Dual Flat Lead Package" for more detailed information of the assembly.
6.8 Tape and reel specifications
Please refer to the document "TN53 Assembly Inst ructions for Dual Flat Lead Package" for tape and reel specifications.
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7 Contact Information
(head office) VTI Technologies Oy P.O. Box 27 Myllynkivenkuja 6 FI-01621 Vantaa Finland Tel. +358 9 879 181 Fax +358 9 8791 8791 E-mail: sales@vti.fi Germany VTI Technologies Oy Branch Office Frankfurt Rennbahnstrasse 72-74 D-60528 Frankfurt am Main, Germany Tel. +49 69 6786 880 Fax +49 69 6786 8829 E-mail: sales.de@vti.fi USA VTI Technologies, Inc. One ParkLane Blvd. Suite 804 - East Tower Dearborn, MI 48126 USA Tel. +1 313 425 0850 Fax +1 313 425 0860 E-mail sales@vtitechnologies.com Japan VTI Technologies Oy Tokyo Office Tokyo-to, Minato-ku 2-7-16 Bureau Toranomon 401 105-0001 Japan Tel. +81 3 6277 6618 Fax +81 3 6277 6619 E-mail: sales.japan@vti.fi China VTI Technologies Shanghai Office 6th floor, Room 618
780 Cailun Lu
201203 Shanghai
P.R. China Tel. +86 21 5132 0417 Fax +86 21 513 20 416 E-mail: sales.china@vti.fi To find out your local sales representative visit www.vti.fi