SC2595 SEMTECH | Alldatasheet
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1 www.semtech.com SC2595 Integrated Linear DDR Termination Regulator POWER MANAGEMENT Revision: June 12, 2007 Typical Application Circuit The SC2595 is an integrated linear DDR termination device, which provides a complete solution for DDR termination designs; while meeting the JEDEC require- ments of SSTL-2 specifications for DDR-SDRAM termi- nation. The SC2595 can source and sink 1.5A current at the output V TT while maintaining excellent load regulation. VTT is designed to track the V REF voltage with a tight tolerance over the entire current range while preventing shoot through on the output stage. A V SENSE pin is incorporated to provide excellent load regulation, along with a buffered reference voltage. The SC2595 incorporates a disable function built into the AV CC pin to tri-state the output during Suspend To Ram (STR) states. (Multiple patents pending.) DDR memory termination High speed data line termination PC motherboards Graphics boards Disk drives CD-ROM drives Regulates while sourcing or sinking 1.5A AVCC range is from 2.5V to 5V Reference output Minimum number of external components Accurate internal voltage divider SOIC-8L EDP package. Also available in Lead-free package, fully WEEE and RoHS compliant Description Features
Applications
2© 2007 Semtech Corp. www.semtech.com SC2595 PRELIMINARYPOWER MANAGEMENT retemaraPr etemaraP retemaraP retemaraPr etemaraPl obmySl obmyS lobmyS lobmySl obmySs noitidnoCtseTs noitidnoCtseT snoitidnoCtseT snoitidnoCtseTs noitidnoCtseTn iMniM niM niMniMp yTpyT pyT pyTpyTx aMxaM xaM xaMxaMs tinUs tinU stinU stinUs tinU egatloVecnerefeRV FER I TUO_FER Am0=2 /QDDV Vm04- 52.12 /QDDV Vm04+ V noitalugeRdaoL )1( GER DAOL I DAOL A5.1+ot0: I DAOL A5.1-ot0: 5.0- 5.0+ tesffOegatloVtuptuOTTVS OV TTV I TUO V,A0= TT V- FER 02-0 0 2+V m tnerruCtnecseiuQI Q I DAOL A0=0 04A µ dlohserhTelbanECCVA 1.2V ecnadepmItupnIQDDVZ QDDV 001k Ω retemaraPr etemaraP retemaraP retemaraPr etemaraP lobmySl obmyS lobmyS lobmySl obmySm umixaMm umixaM mumixaM mumixaMm umixaMs tinUs tinU stinU stinUs tinU DNGotQDDV,CCVA,CCVPV CC 0.6+ot3.0-V esaCotnoitcnuJecnatsiseRlamrehT PDEL8-CIOS θ CJ 5.5 W/C° tneibmAotnoitcnuJecnatsiseRlamrehT PDEL8-CIOS θ AJ 5.63 W/C° egnaRerutarepmeTgnitarepOT A 501+ot04-C ° egnaRerutarepmeTnoitcnuJgnitarepOT J 051+ot04-C ° egnaRerutarepmeTegarotST GTS 051+ot56-C ° s04-01erutarepmeTwolfeRRIkaePT DAEL 042C ° s04-01erutarepmeTwolfeRRIkaePT DAEL 062C ° )ledoMydoBnamuH(gnitaRDSED SE2 V K Specifications with standard typeface are for TJ = 25oC and limits in boldface type apply over the full Operating Temperature Range (TJ = -40oC to +150oC). Unless otherwise specified, AVCC = PVCC = 2.5V, VDDQ = 2.5V.
Electrical Characteristics
Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. Note:Note:Note:Note:Note: (1) For Load Regulation, use a 10ms current pulse width when measuring V TT. Operating Range retemaraPr etemaraP retemaraP retemaraPr etemaraP lobmySl obmyS lobmyS lobmySl obmySm umixaMm umixaM mumixaM mumixaMm umixaMs tinUs tinU stinU stinUs tinU egnaRerutarepmeTnoitcnuJT J 051+ot04-C ° DNGotCCVAV A CC 5.5ot3.2V DNGotCCVPV P CC ot3.2V A CC V
3© 2007 Semtech Corp. www.semtech.com POWER MANAGEMENT SC2595 Pin Configuration Ordering Information Notes: (1) Only available in tape and reel packaging. A reel contains 2500 devices for SOIC-8L package. (2) Lead free package. Device is fully WEEE and RoHS compliant. Top View (SOIC-8L EDP) Part Number Package Temp. Range (T A) SC2595STRT(1)(2) SOIC-8L EDP -40 to +105OC SC2595EVB Evaluation Board
4© 2007 Semtech Corp. www.semtech.com SC2595 PRELIMINARYPOWER MANAGEMENT PDEL8-CIOSP DEL8-CIOS PDEL8-CIOS PDEL8-CIOSP DEL8-CIOS emaNniPe maNniP emaNniP emaNniPe maNniPn oitcnuFniPn oitcnuFniP noitcnuFniP noitcnuFniPn oitcnuFniP 1C N. noitcennoclanretnioN )1( 2D NG. dnuorG 3E SNESVV ESNES V.nipkcabdeefasi TT tsomnienalppirtsgnoldnaworranasyawlasienalp ecartegralaesuaclliwenalppirtsgnolsihT.snoitacilppadraobrehtom tsafa;noitidnoctneisnartdaolehtredisnoC.ecnatsiserecartdnaecnatcudni Vhguorhtgniogtnerrucdaol TT Vehtnosekipsegatlovetaercnacenalppirts TT VehtnopordegatlovCDaesuacoslanactnerrucdaolehT.enalp TT sitI.enalp Vtahtdednemmocer ESNES Vforetnecehtotdetcennocebdluohs TT otenalp t'nacenotahtesacnI.ytinummiesionehtdnanoitalugerdaolehtevorpmi Vehttcennoc ESNES Vehtforetnecehtotnip TT ehtottitcennocdluohseno,enalp V5952CS TT VfoecartregnolA.yltceridnip ESNES ehtesuacdnaesionpukcipyam .dediovaebtsumecartregnolehtecneh;noitalugerdaolfororre VehtotesolcroticapaccimarecFn001otFn01A ESNES diovaotderiuqersinip .noitidnoctneisnartgnirudnoitallicso 4F ERVV FER ecnereferlanretniehtfotuptuodereffubehtsedivorphcihw,niptuptuonasi VehtesunacrengisedmetsyS.egatlov FER tespihcegdirbhtroNrofegatlovtuptuo ereht,ecnadepmihgihyllacipyterasniptupniesehtesuaceB.yromemdna Vehtmorfnwardtnerrucfotnuomallamsaebdluohs FER oT.]01,9erugif[nip deddaebdluohs)Fn001-Fn01(roticapaccimareca,ytinummiesionehtevorpmi Vehtmorf FER .ecnatsidtrohshtiwdnuorgotnip 5Q DDV )2( VehT QDD Vetalugerotegatlovecnereferlanretnignitaercroftupninasinip .TT ehT V QDD patlartnecehT.redividrotsisermhoK001lanretniotdetcennocsiegatlov V(redividrotsiserfo QDD hcihw,reffubegatlovlanretniehtotdetcennocsi)2/ Votdetcennocsituptuo FER reifilpmarorreehtfotupnignitrevni-nonehtdnanip Veht,desolcpoolkcabdeefehthtiW.egatlovecnereferehtsa TT egatlovtuptuo Vehtkcartsyawlalliw QDD a+mho1.5esuotdednemmocersitI.ylesicerp2/ VrofroticapaccimarecFu1 QDD .ytinummiesionehtesaercniotretlifs'nip 6C CVA )2( VAehT CC VA.yrtiucriclortnoclanretniehtfollaylppusotdesusinip CC egatlov ehtwollaot)lacipytV1.2(egatlovdlohserhtOLVUstinahtretaergebotsah VAfI.noitarepolamronnieb5952CS CC dlohserhtOLVUehtnahtrewolsiegatlov Veht,egatlov TT .V0taniamerlliwegatlovtuptuo 7C CVP )2( VPehT CC Vehterehwmorfegatlovliarehtsedivorpnip TT .tnerrucdaolswardnip VAneewtebnoitatimilasierehT CC VPdna CC VPehT. CC rosselebtsumegatlov VAotlauqe CC VehT.noitalugeregatlovtuptuotcerrocehterusneotegatlov TT VPnotnednepedsiytilibapactnerrucecruos CC noegatlovehtrehgiH.egatlov VP CC rehgihdnassolrewoperomesuaclliwti,revewoh;tnerrucecruosehtrehgih, .]21,11,5erugif[esirerutarepmet 8T TVV ehT TT suounitnocA5.1ecruosdnaknisnactI.5952CSfotuptuoehtsinip sitI.noitalugerdaoltnellecxegnipeekelihwtnerruckaepA3dnatnerruc RSE(sroticapacRSEwolFu022tsaeltaesudluohsenotahtdednemmocer erahcihw,sroticapaccimarecFu01dna)mhom052nahtrewolebdluohs Vehtnodaerpsylmrofinu TT daolrednuekipsegatlovehtecuderotenalppirts .noitidnoctneisnart lamrehT daP .DNGotdetcennocebdluohsdaplamrehT Pin Descriptions
5© 2007 Semtech Corp. www.semtech.com POWER MANAGEMENT SC2595 Block Diagram OUT GND VDDQ VREF VSENSE UVLO PVCC AVCC VTT NC Driver Circuit OUT Notes:Notes:Notes:Notes:Notes: (1) Can be used for vias. (2) Power up of AV CC, PVCC and VDDQ supplies. (a) The preferred mode of operation is when the AVCC, PVCC and VDDQ pins are tied together to a single supply. (b) If and when AVCC, PVCC pins are tied to a supply separate to that of the VDDQ supply pin; then the VDDQ supply should lead AVCC, PVCC supply or the VDDQ supply and the AVCC, PVCC supply should rise simultaneously. (c) If the AVCC, PVCC and VDDQ supply pins are connected in a way such that, AVCC, PVCC supplies precedes VDDQ supply; then VTT output precedes VDDQ. This can cause the SDRAM device to latch-up, which may cause permanent damage to the SDRAM.
7© 2007 Semtech Corp. www.semtech.com POWER MANAGEMENT SC2595 Layout guidelinesLayout guidelinesLayout guidelinesLayout guidelinesLayout guidelines 1)The SC2595 has a power SO-8 package. It can im- prove the thermal impedance (θJC) significantly. A suitable thermal pad should be added when PCB layout. Some thermal vias are required to connect the thermal pad to the PCB ground layer. This will improve the thermal per- formance . 2)To increase the noise immunity, a ceramic capacitor of 10nf to 100nf is required to decouple the V REF pin with the shortest connection trace, also A 10nF to 100nF ceramic capacitor close to the V SENSE pin is required to avoid oscillation during transient condition. 3)To reduce the noise on the input power rail for stan- dard SSTL-2 application, a 68µF low ESR capacitor and a 1µF ceramic capacitor have to be used on the input power rail with shortest possible connection. 4)For lower power loss SSTL-2 application, a 220µF AL. capacitor (ESR should be lower than 250m ohm) and a 10µF ceramic has to be added on the PV CC pin and a 1µF ceramic capacitor +5.1 ohm filter has to be added on the V DDQ pin with shortest possible connection. 5)VTT output copper plane should be as large as possible. 6)VSENSE trace should be as short as possible. Application Information (Cont.)
11© 2007 Semtech Corp. www.semtech.com POWER MANAGEMENT SC2595 Outline Drawing - Power SOIC-8L Land Pattern - Power SOIC-8L Y THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. NOTES: REFERENCE IPC-SM-782A, RLP NO. 300A.2. INCHES DIMENSIONS Z P Y X DIM C G MILLIMETERS E .201 5.10 X FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR FUNCTIONAL PERFORMANCE OF THE DEVICE. SHALL BE CONNECTED TO A SYSTEM GROUND PLANE. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD3. F E D SOLDER MASK THERMAL VIA ?0 . 3 6 m m D .098 2.49 F .096 2.44 Z(C) G (.205) (5.20) P 3.00.118 1.27.050 0.60.024 2.20.087 7.40.291 E SEE DETAIL DETAIL A A .050 BSC .236 BSC .010 .150 .189 .154 .193 .012 - 0.25
1.27 BSC
6.00 BSC
3.90 4.90 .157 .197 3.80 4.80 .020 0.31 4.00 5.00 0.51 bxN 2X N/2 TIPS SEATING aaa C E/22X N A D bbb C A-B D ccc C e/2 (.041) .004 .008 .028 .016 .007 .049 .000 .053 8 0 0.20 0.10 - 8 0.40 0.17 1.25 0.00 .041 .010 .069 .065 .005 1.35 (1.05) 0.72 1.04 0.25 - 1.75 1.65 0.13 c L (L1) 01 0.25 GAGE PLANE h 3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. -B- CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). DATUMS AND TO BE DETERMINED AT DATUM PLANE NOTES: 2. -A- -H- SIDE VIEW A B C De H PLANE F F EXPOSED PAD N bbb aaa ccc A b D E L h e c DIM MIN MILLIMETERS NOM DIMENSIONS INCHES MIN MAX MAX NOM h 4. REFERENCE JEDEC STD MS-012, VARIATION BA. Semtech Corporation Power Management Products Division
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