SBYV26C TAYCHIPST | Alldatasheet
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Technical content
600V 1.0A SBYV26C 1 of 2 Mechanical Data Web Site: www.taychipst.com
FEATURES
E-mail: sales@taychipst.com MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS High temperature metallurgically bonded construction Cavity-free glass passivated junction Ultrafast recovery time for high efficiency Low forward voltage, high current capability Capable of meeting environmental standards of MIL-S-19500 Hermetically sealed package Low leakage current High surge current capability Specified reverse surge capability High temperature soldering guaranteed: 350 C/10 seconds, 0.375" (9.5mm) lead length,5 lbs. (2.3kg) tension Case: JEDEC DO-204AL, molded plastic over glass body Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.012 oz., 0.3 g Maximum Ratings and Thermal Characteristics A = 25 C unless otherwise noted) Parameter Symbol Value Unit Maximum repetitive peak reverse voltage V RRM 600 V Maximum RMS voltage V RMS 420 V Maximum DC blocking voltage V DC 600 V Maximum average forward rectified current 0.375" (9.5mm) lead length at T L = 85 C (See Fig. 1) I F(AV) 1.0 A Peak forward surge current 10ms single half sine-wave superimposed on rated load I FSM 30 A Non repetitive peak reverse energy (Note 1) E RSM 5m J Typical thermal resistance (Note 2,3) R Θ JA R Θ JL C/W Operating junction and storage temperature range T J , T STG 65 to +175 C
Electrical Characteristics
A = 25 C unless otherwise noted) Minimum avalanche breakdown voltage at 100 µ AV BR 600 V Maximum instantaneous T J = 25 C V F 2.5 V forward voltage at 1.0A T J = 175 C 1.3 Maximum DC reverse current T A = 25 C I R 5.0 µ A at rated DC blocking voltage T A = 165 C 150 Max. reverse recovery time at I F = 0.5A, I R = 1.0A, I rr = 0.25A t rr 30 ns Maximum junction capacitance at 4.0V, 1MHz C J 45 pF Maximum reverse recovery current slope di r /dt 7 A/ µ s at I F = 1A, V R = 30V, di f /dt = 1A/ µ s Notes: (1) Peak reverse energy measured with 8/20 µ s surge (12 x 12mm) copper pads (3) Thermal resistance from junction to lead at 0.375 (9.5mm) lead length with both leads attached to heatsink Glass Passivated Ultrafast Rectifier
2 of 2E-mail: sales@taychipst.com Web Site: www.taychipst.com 100 1 100 Fig. 2 – Maximum Non-Repetitive Peak Forward Surge Current Peak Forward Surge Current (A) Number of Cycles at 50 H Z 0.6 0.8 1.0 1.2 0 25 50 75 100 125 150 175 Fig. 1 – Maximum Forward Current Derating Curve Average Forward Rectified Current (A) Temperature ( 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Instantaneous Forward Voltage (V) 02 0 6 0 40 100 Fig. 4 – Typical Reverse Leakage Characteristics Instantaneous Reverse Leakage Current µ Percent of Rated Peak Reverse Voltage (%) 0.4 0.2 Mounted on P .C.B. Lead mounted on heatsink 0.01 0.1 100 Instantaneous Forward Current (A) T J = 25 C T J = 125 C T J = 165 C t, Pulse Duration (sec.) Transient Thermal Impedance ( C/W) 0.01 0.1 100 100 0.01 0.001 0.1 100 Fig. 6 – Typical Transient Thermal Impedance T J = T J max. 10ms Single Half Sine-Wave Pulse Width = 300 µ s 1% Duty Cycle Fig. 3 – Typical Instantaneous Forward Characteristics Reverse Voltage (V) Junction Capacitance (pF) 0.1 1 10 100 100 Fig. 5 – Typical Junction Capacitance T J = 25 C f = 1.0 MH Z Vsig = 50mVp-p T J = 25 C T J = 125 C T J = 165 C T L T A 600V 1.0A SBYV26C Glass Passivated Ultrafast Rectifier