EGP10A TAYCHIPST | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 2

Technical content

Glass Passivated High Efficient Plastic Rectifiers 50V-1000V 1.0A EGP10A THRU EGP10M 1 of 2 Web Site: www.taychipst.com

FEATURES

E-mail: sales@taychipst.com MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS MECHANICAL DATA Rating at 25℃ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% Type Number Symbol EGP 10A EGP 10B EGP 10D EGP 10F EGP 10G EGP 10J EGP 10K EGP 10M Units Maximum Recurrent Peak Reverse Voltage V RRM 50 100 200 300 400 600 800 1000 V Maximum RMS Voltage V RMS 35 70 140 210 280 420 560 700 V Maximum DC Blocking Voltage V DC 50 100 200 300 400 600 800 1000 V Maximum Average Forward Rectified Current .375” (9.5mm) Lead Length A = 55℃ I (AV) 1.0 A Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method ) I FSM 30.0 A Maximum Instantaneous Forward Voltage @ 1.0A V F 0.95 1.25 1.7 V Maximum DC Reverse Current @ T A =25℃ at Rated DC Blocking Voltage @ T A =125℃ I R 5.0 100.0 uA uA Maximum Reverse Recovery Time ( Note 1 ) T J =25 Trr 50 75 nS Typical Junction Capacitance ( Note 2 ) Cj 20 15 pF Typical Thermal Resistance (Note 3) R θ JA Operating Temperature Range T J -65 to + 150 Storage Temperature Range T STG -65 to + 150 Notes: 1. Reverse Recovery Test Conditions: I F =0.5A, I R =1.0A, I RR =0.25A 3. Mount on Cu-Pad Size 5mm x 5mm on P.C.B. °C/W

  • Superectifier structure for high reliability condition
  • Cavity-free glass-passivated junction
  • Ultrafast reverse recovery time
  • Low forward voltage drop
  • Low leakage current
  • Low switching losses, high efficiency
  • High forward surge capability
  • Solder dip 275 °C max. 10 s, per JESD 22-B106
  • AEC-Q101 qualified
  • Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC Case: DO-204AL, molded epoxy over glass body Molding compound meets UL 94 V-0 flammability rating Base P/N-E3 - RoHS compliant, commercial grade Base P/NHE3 - RoHS compliant, AEC-Q101 qualified Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 E3 suffix meets JESD 201 class 1A whisker test, HE3 suffix meets JESD 201 class 2 whisker test Polarity: Color band denotes cathode end

RATINGS AND CHARACTERISTICS CURVES EGP10A THRU EGP10M 2 of 2 Web Site: www.taychipst.comE-mail: sales@taychipst.com Glass Passivated High Efficient Plastic Rectifiers 50V-1000V 1.0A EGP10A THRU EGP10M Fig. 1 - Maximum Forward Current Derating Curve Fig. 2 - Maximum Non-Re petitive Peak Forward Surge Current 1.0 0 25 50 75 100 125 150 175 Average Forward Rectified Current (A) Lead Temperature (°C) 0.5 Resistive or Inductive Load 0.375" (9.5 mm) Lead Length 1 100 10 Peak Forward Surge Current (A) Number of Cycles at 60 Hz T J = T J Max. 8.3 ms Single Half Sine-Wave Fig. 3 - Typical Instantaneous Forward Characteristics Fig. 4 - Typical Reverse Leakage Characteristics Fig. 5 - Typical Junction Capacitance Fig. 6 - Typical Transient Thermal Impedance 0.4 In s tantaneou s Forward Voltage (V) 0.01 0.1 100 In s tantaneou s Forward Current (A) 1.8 T J = 150 °C T J = 25 °C Pul s e Width = 300 μ s 1 % Duty Cycle E G P10A thru E G P10D E G P10F and E G P10 G 02 0 6 0 40 100 80 0.01 0.1 100 1000 Percent of Rated Peak Reverse Voltage (%) In stantaneou s Rever se Leakage Current (μA) T J = 150 °C T J = 25 °C T J = 100 °C Rever s e Voltage (V) Junction Capacitance (pF) 0.1 1 10 100 T J = 25 °C f = 1.0 MHz V s ig = 50 mV p-p E G P10A thru E G P10D E G P10F and E G P10 G Transient Thermal Impedance (°C/W) 0.01 0.1 1 10 100 100 0.1 t - Pulse Duration (s)