SAB82C215 SIEMENS | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 20

Technical content

Data / Address Buffer SAB 82C215 . ™ . of Siemens PC-AT'™ Chipset Advance Information e Address buffer and latch for local CPU- @ += Parity generation / detection logic for and X-address bus interface memory data bus @ Data buffer and latch for local CPU @ CMOS implementation for high speed data bus / memory data bus interface and low power requirements © Bus conversion logic for 16-bit to 8-bit @ 84-pin plastic leaded chip carrier transfers package (PL-CC-84) Siemens PC-AT Chipset a oo. D0-15 MO0-15 245 [_S20-15 ra paeeeueER Eee ape 4 | es | no-23 fT Memory Bus I : | 4 | MA sti . | | A0-23 f 0-9 BIOS E | Vay) i i e 287 | CT, a i | a ex SA1-16 B I HT I} {573 1 [ xeo s l LE LH} | 2x | e042) | Local 4 A0-9 : a j Py ISA LA17-23 Slot Address Busses | #88 Data Busses | 1 2.90

As a member of the Siemens PC-AT Chipset the SAB 82C215 provides address buffer / latch, data bus buffer / latch, data bus path conversion logic and parity logic. The SAB 82C215 data / address buffer, the SAB 82C211 system controller, the SAB 82C212 memory controller and the SAB 82C206 integrated peripheral controller provide a highly integrated high performance system solution for PC-AT compatible systems. The SAB 82C215 is fabricated in Siemens ACMOS technology and packaged in a 84-pin plastic leaded chip carrier package (PL-CC-84).

Ordering Information

Type Ordering code Package Description SAB 82C215-12-N_ | Q67120-P297 PL-CC-84 (SMD) | Data / Address Buffer of Siemens PC-AT Chipset (12 MHz) SAB 82C215-16-N | Q67120-P298 PL-CC-84 (SMD) | Data / Address Buffer of Siemens PC-AT Chipset (16 MHz) Siemens Aktiengesellschaft 2

A1-16< > Ko > xat - 16 IALE HLDA1 SAB ACO,1 82C215 AO ACEN# BHE# DRD# PARERR# OLE MPO,t Do-15 > Ki=> bo - 15 ! Figure 2 | Pin Configuration ‘ z Go toe Powtnt ote 2 yuso5asaaye BLS000 SoGGGLaSES EE SAS afalatalalatetetalalafatetn!atatal=lal=t= || a | Se | SD act G12 O 1, D oRo# aco B Mp 13 AceNs# B MoS \\ lat HM 12 i ong D mo4 D3 HMO 1

00 M03

| og Al mp2 ! og SAB A MD9 i GNo q 22 64 GND | be 82215 A Dt ood A M08 aig A M0 aq A xA1 aad 1) XA2 Ag A xa3

45 A xXAs

46 A xas

Yer G 32 sé 1 xa7 33 43 3 gcerensve yore ser rege AS e225 2555 5 $55 58225 | Siemens Aktiengesellschaft 3

Pin Definitions and Functions Symbol Pin input (I) Function Output (O) Address Latch / Buffers IALE Address Latch Enable JALE is the strobe input line of the address latch. It is used to latch the CPU addresses onto the X-address lines. A1 -A16 25-31 vO CPU Address Lines 1 - 16 33 - 411) During CPU cycles (HLDA1 =0) Ai - A16 are the inputs to the internal address latch of the SAB 82C215. During DMA cycles (HLDA1 = 1) A1 — A16 are outputs. The address latch is controlled by IALE. XA1 - XA16_ | 60 - 54 vo XBUS Address Lines 1 - 16 52:- 441) During CPU cycles (HLDA1 =0) XA1 - 16 are the outputs of the address latch. During DMA cycles (HLDA1 = 1) XA1 - 16 are inputs. HLDA1 53 Hold Acknowledge HLDA1 indicates the type of cycle currently executing. CPU cycles are executed with HLDA1 =0. During DMA cycles HLDA1 = 1. HLDA1 controls the direction of the address and data bus transfers. Data Buffers / Latch DO - D15 24, 23 vo CPU Data Bus Lines 0 - 15 . 21-16 DO - D15 represent the local CPU data bus lines. 9-21) The data bus buffers are controlled by HLDA1 and DRD#. i ACO,1 13, 12 ! Action Code Line 0, 1 | The two action code lines control the data path H during CPU and DMA cycles. ACO,1 are qualified i (enabled) by the ACEN# signal. At the Siemens | PC-AT chipset ACO,1 are generated by the SAB i 82C211. | 1) For detailed pin numbers see also pin configuration (figure 2). | Siemens Aktiengesellschaft 4

Pin Definitions and Functions (cont'd) Symbol Pin Input (I) Function Output (0) Data Buffers / Latch ACEN# 14 Action Code Enable# ACEN# =0 validates the action code signals ACO,1. MDO - MD15 | 61 - 63 vO Memory Data Bus 0 - 15 65 - 73 MDO - MD15 are the memory data bus lines. 79 - 821) They are controlled by HLDA1, DRD#, AC1,0 and ACEN#. DRD# 74 Data Read# DRD¢# controls the direction of the data bus buffer ‘ path. DRD#=1 sets the data path from local CPU i bus to memory bus. DRD#=0 sets the data path | from memory to local CPU bus. | DLE 76 ! Data Latch Enable | DLE controls the data bus latch. Memory bus data is stored in the latch with the high-to-low i transition of DLE. : Parity Generator / Checker AO Address Line 0 : AO is used to enable the low byte parity checking. BHE# 1 Byte High Enable# BHE# is used to enable the high byte parity checking. | MP1, MPO 78, 77 fe) Memory Parity Bit 1,0 | MP1 and MPO are the parity bits for the high and | low order bytes of the system DRAM’s. These ; lines are inputs during memory read operations for parity error detection and are outputs during i memory write operations for parity generation. ' PARERR# 83 ° Parity Error# PARERR# =0 indicates that a parity error has been detected during a system memory read operation. At the Siemens PC-AT chipset PARERR# is checked by the SAB 82C211 system controller. 1) For detailed pin numbers see also pin configuration (figure 2). : Siemens Aktiengeselischaft 5

Pin Definitions and Functions (cont'd) Symbol Input (I) Function Output (O Power Supply Voc 32, 42, Power Supply (+5 V) GND 1, 22, Ground (0 V) 43, 64, Figure 3 Block Diagram A1-16 eae XA1 - 16 Latch HLDA1 > DO - 15 PP | Swap MDO - 15 Latch D aK ! Parity anes Co Logic MPout } — PARERR# i ot Control H DRD# Logic | DLE Siemens Aktiengesellschaft 6

The SAB 82C215 data / address buffer for the SIEMENS PC-AT chipset provides the following functional units: e@ Address buffer and latch e Data buffer and latch @ Data bus conversion logic @ Parity generation / detection logic Address Buffer and Latch For local CPU cycles (HLDA1 =0) the SAB 82C215 provides the address buffering and latching between the CPU address lines A1 - A16 and the peripheral bus address lines XA1 - XA16. A1 - A16 can be latched by the address latch enable signal !ALE. The latch is transparent with IALE = high. During DMA cycles (HLDA1 = 1) the peripheral address bus XA1 - XA16 is routed to the A1 - A16 address bus lines. The address latch is not available during DMA cycles. Data Buffer and Latch The SAB 82C215 provides the buffering between the CPU data bus DO - D15 and the memory data bus MDO - MD15 for local cycles (on-board memory read / write cycles) or AT-bus cycles (on-board peripherals or AT-slot read / write cycles). DRD# is the direction control signal for the data buffer. For local write cycles DRD¢# is at high level and sets the data path from the CPU data bus to the memory data bus. For local read cycles DRD#=0 sets the data path from MD-bus to D-bus. DLE controls the data latch. DLE = 1 makes the latch transparent. During local cycles the action code enable signal is inactive (ACEN# = 1). During AT-bus cycles DLE is inactive (low), and instead of DLE the ACEN# signal is used to strobe the data into the data latch. With ACEN#=0 the data latch is transparent and data is stored with the low-to-high transition of ACEN#. During DMA cycles the D-bus of the SAB 82C215 is switched off. During DMA memory write operations (AC1,0 =0,0 and 1,0), the MD-bus lines are connected to the parity generator. If data bus conversion is required during DMA cycles (AC1,0 = 1,0 and 1,1), the corresponding data path is set between MDO - 7 and MD8 - 15. Data Bus Conversion Logic : The SAB 82C215 provides data bus conversion when the 16-bit CPU reads from or writes : to 8-bit devices. It also provides data bus conversion for DMA cycles. Table 1 lists the H possible cases of the data paths for CPU and DMA cycles. The action code signals | AC1, 0, which are qualified by ACEN#, control the different data path configurations. : Siemens Aktiengesellschaft 7

Table 1: Action Code Functions ACI ACO HLDA1 | Operation Data path 1) 0 16-bit Write A-B-D-E and F-G-J-K F-Gu-K ie) 1 16-bit Read E-D-B-A and K-J-G-F 8-bit Low Read K-J-G-F 1 [| 0 | 0 _| &bit High Write to MD-bus low A-B-C-H-J-K 1 [| 1 | 0 | 8-bit Read MD-bus Low to D-bus high | K-J-H-C-B-A

0 MD-bus tristated: -

16-bit/8-bit (low byte) DMA read / write at MD-bus of + Tt fresewes 1 1 High memory Write to MD8 - 15 from K-J-H-C-D-E MDO -7 1 1 1 High memory Read from MD8 - 15 to E-D-C-H-J-K MDO -7 1) see figure 4 Figure 4 Data Bus Conversion Paths Local SAB 82C215 : Memory : cPu Data : Bus Bus i be - 015 “RED KE woe - m0 18 Do - 07 ee MDo - MD7 i : Siemens Aktiengesellschaft 8

Parity Generation / Detection Logic For local memory write cycles the SAB 82C215 generates an even parity bit (MP0, MP1) for each of the two data bytes MDO - 7 and MD8 - 15. The parity bit is set if the corres- ponding data byte has an even number of 1's. During local memory read cycles the SAB 82C215 checks the data bytes for even parity. If a parity error is detected, the PARERR# output becomes active (low). PARERR# is activated by the falling edge of DLE and deactivated by the rising edge of DRD#. For DMA cycles (HLDA1 = 1) the parity checker is disabled. During parity checking AO and BHE# select the data bytes to be checked. SAB 82C215 control lines interface The SAB 82C215 has several control lines. In a PC-AT design using the Siemens PC-AT chipset the interface of the SAB 82C215 control lines is shown in the next figure. Figure 5 Interface of the SAB 82C215 control lines in the Siemens PC-AT Chipset active, if HLDA1 =0 x BHE# SAB cpu Y active, if sas sas i ACO 82021 sc25 | System ["ACEN# Controle SAB DRD# | 820212 | Memory | Controller Siemens Aktiengesellschaft 9

Ambient temperature under bias... 26-26. e ees OF0 70°C Storage temperature 2... cece eee = 6510 +150 °C Note: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Exposure to absolute maximum ratings for extended periods may affect device reliability. DC Characteristics Ta = Oto 70 °C; Voc = +5 V45 %; GND=O0V Parameter Test Input high voltage Vin 2.0 Voc Vv - +0.5 Output low voltage Vo Vv MDO - 15: Io. =8MA other outputs: lo. =4 mA Output high voltage Vou 24 Vv MDO ~ 15: Ion =- 8MA other outputs: Ton =- 4 MA Input leakage current [m |- [+10 |u| 0V<Vin<Voc Output tristate loz +10 pA 0.45 V < Vout < Voc leakage current Standby power supply current | fcose _[- [1.0 [ma_|- Siemens Aktiengesellschaft 10

Ta = 0 to 70 °C; Voc = +5V45 %; GND=0V Parameter [Semeot [ unit wewes [unt Test condition MD-bus tristated after DRD# active [fs | 75 | 24 [ns | - MD-bus valid to D-bus valid [2 | 8 | 185 [ns [- MD-bus being driven after DRD# inactive [ts. | 75 | 28 [ns | - MPO, MP1 being driven after DRD# a ee - inactive D-bus invalid after DRD# inactive le | 4 | 13 [ns | - D-bus tristated after DRD# inactive ls | 6 | 15 [ns | - D-bus valid to MD-bus valid lt | 11 | 19 [ns [- D-bus valid to MP1, MPO valid fe | 11 | 20 [ns |- ACEN# active to D-bus valid [| 16 | 27 [ns | - Action code valid to MO-bus valid ls _| 10 | 19 [ns | - i Action code invalid to MD-bus invalid [to | 11 | 20 [ns | = "DLE inactive to, PARERR# enabled [t, | 17 | 30 [ns [- DRD# inactive to PARERR# disabled [tz | _17 | 28 [ns_|- | TALE active to XA-bus valid lis | 11 | 19 [ns [- | XA-bus valid to A-bus validSAB 82C215-12 fT tp ete - SAB 82C215-15 7 16 - MD, MP setup time to DLE trailingedge [ts | 0 | - [ns_|- MD, MP hold time from DLE trailing edge [te | 6 | - [ns |- : DRD¢# setup time to DLE trailing edge [ir | 12 { - [ns | - | MD-bus hold time from ACEN# fe P78 fe | - | trailing edge | MD-bus valid to MP valid during DMA a ee - | memory write cycle | MD-bus high byte valid to MD low byte fe Pe] ei | - | valid during DMA high memory read cycle | Action code valid to MD high byte valid ef ef ei - i during DMA high memory write cycle j Action code valid to MP valid during DMA fe pr] i | - | high memory write cycle Siemens Aktiengesellschaft 11

DRD# tae tap mea oust ! a H Output For this timing: DLE =1 a CPU Write Timing +} fe tr >| Siemens Aktiengesellschaft 12

' Data Latch Timing (CPU Read) i OLE DRD# MDO - 15 | \\ MPO,1 tis Pt ths | DMA Timing (HLDA1 = 1) i Memory Write Cycle HLDA1 too >] | Siemens Aktiengesellschaft 13

DMA Timing (HLDA1 = 1) Memory Read High Byte / 1/O Write Low Byte HLDA1 / < t, >| DMA Timing (HLDA1 = 1) VO Read Low Byte / Memory Write High Byte | HLDA1 / : — >| tee r ! tag Siemens Aktiengesellschaft 14

ACEN# Timing <— ty ACEN# hg : DRD#=DLE=0 i Action Code Timing i i ACEN#=0 | Siemens Aktiengeselischaft 15

PARERR# Timing DLE DRD# PARERR# j<— ty Adress Latch Timing ALE ms th XA1 - 16 Output <— fia i Siemens Aktiengesellschaft 16

Load Circuit and AC Characteristics Measurement Waveform fhe t TTT TIN FF We TTT Input pV 13v) 2 2 Ton four You Output (Delay) 1.3V 13V, fra fu 13V : tput 1 (Enable/Disable) ‘ron fap Vou i OsV : 13V : Vin=3V, Y= OV, s10ns, f= 5ns Ye do. j R i R ‘ q : , sw2 i i i ' Siemens Aktiengesellschaft 17

Load Circuit Measurement Conditions Parameter Output Type | symbot_| C. (pF) [Riko | Ry (kQ) [sw, | sw, Propagation Totem Pole Delay Time Tristate teu OFF | ON Bidirectional tPHL OFF | ON Propagation Open Drain or tPLH 50 05 OFF Delay Time Open Collector | teu. 50 0.5 OFF Disable Time Tristate teiz 0.5 ON Bidirectional teuz 0.5 OFF | ON Enable Time Tristate tpze 50 0.5 1.0 ON ON Bidirectional tpzH 50 0.5 1.0 OFF ON i i ; Siemens Aktiengeselischaft 18

Plastic Package, PL-CC-84 (SMD) (Plastic leaded chip-carrier) 30.203 29.31.02 Index Marking ; 4 a a | —_ zi. - Fa 8, B _-| [3.27 (0.81 max osnal 4420.3] 35 : Dimensions in mm i i i Siemens Aktiengeselischaft 19

Electronic Designs Inc, makes no warranty for the use of the products described in this volume, These specications are subject to change and are based on design goals and are not guaranteed. The information has been carefully checked and is wae . . boleved tobe entirely refable. However, no responsbilty is assumedtorinaccuracies, Additional copies of this Databook, as well as | Electronic Designs Inc. reserves the right to make any changes in specications at i : any time and without notice. Information contained in this volime supersedes data other EDI literature, may be ordered from: previously publshed on these parts by EDI. (Revision 1-80) CAGE 66301 Publications Department Life Support Pokey , : Electronic Designs Products are not authorized foruse asciticalcomponentsinite Electronic Designs Incorporated support devices or systoms unless a specific witen agreement pertaining to such 42 South Street 4 intended use is executed between the manufacturer and an officer of EDI. . Life support devices or systams are devicos or systems which (a) are intended for Hopkinton MA 01748, USA surgical implant into the body or (b) support of sustain ie and whose failure to 508-435-2341 | perform, when properly used in accordance with instructions for use provided in the . labeling, can be raasonably expected to result in a sigificantinjury tothe user, FAX: 508-435-6302 A cctical component is any component of ale support device or system whose a failure to perform can be reasonably expacted to affect its safety or effectiveness, — Copyright® 1990 Electronic Designs Inc. 35SMCSA9/90 Printed in USA am