S5F325NU02 SAMSUNG | Alldatasheet
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1/3 INCH CCD IMAGE SENSOR FOR EIA CAMERA S5F325NU02 INTRODUCTION The S5F325NU02 is an interline transfer CCD area image sensor developed for EIA 1/3 inch optical format video cameras, surveillance cameras, object detectors and image pattern recognizers. High sensitivity is achieved through the on-chip micro lenses and HAD (Hole Accumulated Diode) photosensors. This chip features a field integration read out system and an electronic shutter with variable charge storage time.
FEATURES
- High Sensitivity
- Optical Size 1/3 inch Format
- Low Dark Current
- Horizontal Register 5V Drive
- 16pin Ceramic DIP Package
- Field Integration Read Out System
- No DC Bias on Reset Gate STRUCTURE
- Number of Total Pixels: 537(H) × 505(V)
- Number of Effective Pixels: 510(H) × 492(V)
- Chip Size : 6.00mm(H) × 4.95mm(V)
- Unit Pixel Size: 9.60 µm(H) × 7.50 µm(V)
- Optical Blacks & Dummies: Refer to Figure Below Vertical 1 Line (Even Field Only) 16Pin Cer-DIP
ORDERING INFORMATION
S5F325NU02-LAB0 16Pin Cer - DIP -10 °C − +60 °C 1 6 2 5 1 0 2 5 149212 V-CCD O U T P U T D u m m y P ix e ls O p tic a l B la c k P ix e ls E ff e c tiv e P ix e ls E ffe c tiv e Im a g in g A re a H -C C D
Figure 1. Block Diagram Table 1. Pin Description
5 GND Ground 13 Φ RS Charge reset clock
6 V GG Output stage gate bias 14 NC No connection
7 V SS Output stage source bias 15 Φ H1 Horizontal CCD transfer clock 1
8 V OUT Signal output 16 Φ H2 Horizontal CCD transfer clock 2
- The device can be destroyed, if the applied voltage or temperature is higher than the absolute maximum rating voltage
- When the clock width is less than 10 µsec and the clock duty factor is less than 0.1%.
Table 2. Absolute Maximum Ratings
Table 3. DC Characteristics Table 4. Clock Voltage Conditions
1/3 INCH CCD IMAGE SENSOR FOR EIA CAMERA S5F325NU02 DRIVE CLOCK WAVEFORM CONDITIONS Read Out Clock Waveform Vertical Transfer Clock Waveform 0 V 1 0 0 % 9 0 % 1 0 % 0 % V V H 1 , V V H 3 t r tw h tf V V H 1 V V H V V H H V V L L V V L V V L 1 V V L H V V H L V V H L V V H H ¥ÕV 1 V V H V V H L V V H H V V H H V V H LV V H 4 V V L V V L H V V L L V V L 4 ¥ÕV 4V V H H V V H H V V H V V H L V V H L V V H 2 V V L V V L L V V L H V V L 2 ¥ÕV 2 V V L 3 V V H H V V L V V H L V V H L V V H 3 V V H H V V H V V L H V V L L ¥ÕV 3 V V H = ( V V H 1 + V V H 2 ) / 2 V V L = ( V V L 3 + V V L 4 ) / 2 V ¥ÕV = V V H n - V V L n ( n = 1 ~ 4 ) V V H H = V V H + 0 . 3 V V V H L = V V H - 0 . 3 V V V L H = V V L + 0 . 3 V V V L L = V V L - 0 . 3 V
S5F325NU02 1/3 INCH CCD IMAGE SENSOR FOR EIA CAMERA Horizontal Transfer Clock Waveform Diagram Reset Gate Clock Waveform Diagram V RGLH is the maximum value and V RGLL is the minimum value of the coupling waveform in the period from Point A in the diagram about to R G rise V RGL = (V RGLH + V RGLL )/2, V FRG = V RGH - V RGL Substrate Clock Waveform 9 0 % 1 0 % tr tw h tf tw lV ¥ÕH V H L V R G L + 0 .5 V tw l P o in t A tw h tftr V R G H V R G L R G w a v e fo r m V R G L H V R G L L ¥ÕH 1 w a v e fo r m 1 0 % V ¥ÕR G 1 0 0 % 9 0 % 1 0 % 0 % tw htr tf V ¥ÕS U B V S U B
Table 5. Clock Equivalent Circuit Constant
Table 6. Equivalent Circuit Parameters
- Use a light source with color temperature of 3,200K hallogen lamp and CM-500S for IR cut filter.
The light source is adjusted in accordance with the average value of Y signals indicated in each item.
- Through the following tests the substrate voltage should be set to the value while the device condition
should be kept within the range of the bias and clock conditions. Table 7. Operating Characteristics
S5F325NU02 1/3 INCH CCD IMAGE SENSOR FOR EIA CAMERA TEST METHODS 1. Measure the light intensities (L) when the averaged illuminance output value (Y) is the standard illuminance output value, 150mV (Y A ) and when half of 150mV (1/2 Y A ). 2. Adjust the light intensity to 15 times of the value with which Y is Y A , then measure the averaged illuminance output value (Y = Y SAT ). 3. Adjust the light intensity to 500 times of the value with which Y is Y A , then remove the read-out clock and drain the signal in photosensors by the electronic shutter operation in all the respective horizontal blanking times with the other clocks unchanged. Measure the maximum illuminance output value (Y SM ). 4. Adjust the light intensity to 1,000 times of the value with which Y is Y A , then inspect whether there is blooming phenomenon or not. 5. Measure the maximum and minimum illuminance output value (Y MAX , Y MIN ) when the light intensity is adjusted to make Y to be Y A . 6. Measure Y D with the horizontal idling time transfer level as reference, when the device ambient temperature is 60 °C and all of the light sources are shielded. 7. Follow test method 6, measure the maximum (D MAX ) and minimum illuminance output (D MIN ). S YA 2---YA– LYA 2---YA SM YSM YA U YMAX YMIN– YA ΔDD MAX DMIN–=
1/3 INCH CCD IMAGE SENSOR FOR EIA CAMERA S5F325NU02 8. Adjust the light intensity of Y signal output value by strobe light to 150mV (Y A ), calculate by below formula with measuring the image lag signal which is qenerated by below timing diagram. 9. Adjust the light intensity of Y signal average value to 150mV (Y A ), calculate by below formula with measuring the signal differences ( ΔY f [mV]) between fields. YLAG Ylag 150⁄() 100%()×= FLD SG1 Strobe Timing Output Y Signal Output 150mV Light Y Lag FY ΔYf YA⁄() 100%()×=
Figure 2. Spectral Response Characteristics
Figure 3. Application Circuits
Figure 4. Read-out Clock Timing Chart
Figure 5. Clock Timing Chart (Vertical Sync.)
Figure 6. Clock Timing Chart (Horizontal Sync.)
Figure 7. Package Dimensions
S5F325NU02 1/3 INCH CCD IMAGE SENSOR FOR EIA CAMERA HANDLING INSTRUCTIONS
- Static Charge Prevention CCD image sensors can be easily damaged by static discharge. Before handling, be sure to take the following protective measures. — Use non chargeable gloves, clothes or material. Also use conductive shoes. — When handling directly, use an earth band. — Install a conductive mat on the floor or working table to prevent generation of static electricity. — Ionized air is recommended for discharging when handling CCD image sensor. — For the shipment of mounted substrates, use boxes treated for the prevention of static charges.
- Soldering — Make sure the package temperature does not exceed 80 °C. — Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently. — To dismount an imaging device, do not use a solder suction equipment. When using an electronic disoldering tool, use a thermal controller of the zero cross on/off type and connect to ground.
- Dust and Dirt Protection — Operate in the clean environments (around class 1000 will be appropriate). — Do not either touch glass plates by hand or have object come in contact with glass surface. Should dirt stick to a glass surface blow it off with an air blow(for dirt stuck through static electricity ionized air is recommended). — Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch the glass. — Keep in case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. — When a protective tape is applied before shipping, just before use remove the tape applied electrostatic protection. Do not reuse the tape.
- Do not expose to strong light (sun rays) for long period, color filter are discolored.
- Exposure to high temperature or humidity will affect the characteristics. accordingly avoid storage or usage in such conditions.
- CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.