S2DFSH TS | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 5

Technical content

S2DFSH – S2MFSH Taiwan Semiconductor

1 Version: B2103

2A, 200V - 1000V Standard Surface Mount Rectifier

FEATURES

  • AEC-Q101 qualified
  • Glass passivated chip junction
  • Ideal for automated placement
  • Low profile package
  • Moisture sensitivity level: level 1, per J-STD-020
  • RoHS Compliant
  • Halogen-free according to IEC 61249-2-21

APPLICATIONS

  • Freewheeling
  • Snubber
  • DC/DC converters
  • Automotive application MECHANICAL DATA
  • Case: SOD-128
  • Molding compound meets UL 94V-0 flammability rating
  • Terminal: Matte tin plated leads, solderable per J-STD-002
  • Meet JESD 201 class 2 whisker test
  • Polarity: Indicated by cathode band
  • Weight: 0.027g (approximately) KEY PARAMETERS PARAMETER VALUE UNIT IF 2 A VRRM 200 - 1000 V IFSM 50 A TJ MAX 150 °C Package SOD-128 Configuration Single die ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL S2D FSH S2G FSH S2J FSH S2K FSH S2M FSH UNIT Marking code on the device S2DFH S2GFH S2JFH S2KFH S2MFH Repetitive peak reverse voltage VRRM 200 400 600 800 1000 V Reverse voltage, total rms value VR(RMS) 140 280 420 560 700 V Forward current IF 2 A Surge peak forward current, single half sine-wave superimposed on rated load t = 8.3ms IFSM 50 A t = 1.0ms 140 A Junction temperature TJ -55 to +150 °C Storage temperature TSTG -55 to +150 °C SOD-128

S2DFSH – S2MFSH Taiwan Semiconductor

2 Version: B2103

Junction-to-lead thermal resistance RӨJL 14 °C/W Junction-to-ambient thermal resistance RӨJA 74 °C/W Junction-to-case thermal resistance RӨJC 20 °C/W Thermal Performance Note: Units mounted on PCB (5mm x 5mm Cu pad test board) ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER CONDITIONS SYMBOL TYP MAX UNIT Forward voltage(1) IF = 1A, TJ = 25°C VF 0.91 - V IF = 2A, TJ = 25°C 0.98 1.10 V IF = 1A, TJ = 125°C 0.79 - V IF = 2A, TJ = 125°C 0.88 0.98 V Reverse current @ rated VR (2) TJ = 25°C IR - 1 µA TJ = 125°C - 33 µA Junction capacitance 1MHz, VR = 4.0V CJ 12 - pF Notes: (1) Pulse test with PW = 0.3ms (2) Pulse test with PW = 30ms

ORDERING INFORMATION

ORDERING CODE(1) PACKAGE PACKING S2xFSH SOD-128 14,000 / Tape & Reel Notes: (1) “x” defines voltage from 200V(S2DFSH) to 1000V(S2MFSH)

S2DFSH – S2MFSH Taiwan Semiconductor

3 Version: B2103

(TA = 25°C unless otherwise noted) Fig.5 Typical Transient Thermal Impedance 0.0001 0.001 0.01 0.1 100 Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance Fig.3 Typical Reverse Characteristics Fig.4 Typical Forward Characteristics 25 50 75 100 125 150 100 1 10 100 f=1.0MHz Vsig=50mVp-p 0.001 0.01 0.1 100 10 20 30 40 50 60 70 80 90 100 TJ=25°C TJ=125°C TJ=150°C 0.1 Pulse width 300μs 1% duty cycle Pulse width 300μs 1% duty cycle TJ=25°C TJ=125°C TJ=-55°C TJ=150°C CAPACITANCE (pF) INSTANTANEOUS REVERSE CURRENT (μA) PERCENT OF RATED PEAK REVERSE VOLTAGE (%) INSTANTANEOUS FORWARD CURRENT (A) (A) 0.001 0.01 0.1 Pulse width TJ=25°C TJ=125°C UF1DLW FORWARD VOLTAGE (V) AVERAGE FORWARD CURRENT (A) REVERSE VOLTAGE (V) LEAD TEMPERATURE (°C) PULSE DURATION (s) TRANSIENT THERMAL IMPEDANCE (°C/W)

S2DFSH – S2MFSH Taiwan Semiconductor

4 Version: B2103

PACKAGE OUTLINE DIMENSIONS SOD-128 SUGGESTED PAD LAYOUT MARKING DIAGRAM P/N = Marking Code YW = Date Code F = Factory Code

S2DFSH – S2MFSH Taiwan Semiconductor

5 Version: B2103

Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC a ssumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life -saving, or life -sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale.